SMT Association News
IPC Welcomes New Senior Director of Education Programs
IPC – Association Connecting Electronics Industries announces the addition of Colette Buscemi as senior director of education programs to its staff at IPC headquarters in Bannockburn (Chicago), Ill.
As IPC’s senior director of education programs, Buscemi will be responsible for working with partners, staff and other associations to develop markets for IPC’s educational programs. In addition, she will identify and establish external resources and partners from education and workforce training organizations to help deliver IPC’s education and workforce development initiatives to attract and develop students and learners at all levels. Initiatives will target non-traditional, K-12, and post-secondary students, as well as transitioning military and veterans.
With a specialty in in strengthening and revitalizing business ecosystems, industry sectors and communities through trade development, workforce and educational programs, Buscemi has expertise in working with membership-based industry associations and government sponsored programs focused on improving U.S. Manufacturing through technology advancements and workforce initiatives.
North American PCB Industry Growth Continues to Strengthen
IPC – Association Connecting Electronics Industries announced the November 2017 findings from its North American Printed Circuit Board (PCB) Statistical Program. Positive year-over-year shipment and order growth continued in November. The book-to-bill ratio remained high in November at 1.09. Total North American PCB shipments in November 2017 were up 4.0 percent compared to the same month last year. This year to date, shipments are 2.3 percent below the same period last year. Compared to the preceding month, November shipments increased 0.4 percent. PCB bookings in November increased 15.8 percent year-on-year, raising year-to-date order growth to 5.7 percent above the same period last year.
Bookings in November were down 3.8 percent compared to the previous month. “The North American PCB industry’s recovery continued in November and is becoming more robust, with positive year-on-year sales growth for the third consecutive month and strengthening growth rates,” said Sharon Starr, IPC’s director of market research. “The outlook is also positive, based on strong order growth in recent months, and on PCB book-to-bill ratios above parity (1.0) for 10 consecutive months. Although the book-to-bill ratio has been retreating from a 12-year high in August, due to growth in sales, it remains strong, indicating a likelihood of continued sales growth in the coming months,” she added.
Detailed Data Available The next edition of IPC’s North American PCB Market Report, containing detailed November data from IPC’s PCB Statistical Program, will be available the week of January 8, 2018. The monthly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by company size tiers, demand for prototypes, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. More information about this report can be found at www.ipc.org/market-research-reports. Interpreting the Data The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.
Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.
Best Technical Paper at IPC APEX EXPO 2018 Selected
The best technical conference paper of IPC APEX EXPO 2018 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors received their awards during the opening keynote session.
Taking top honors, the winning paper is, “Equivalent Capacitance Approach to Obtain Effective Roughness Dielectric Parameters for Copper Foils” by Marina Y. Koledintseva, Oracle. Her co-author was: Tracey Vincent, CST of America. This year, two papers were selected in the honorable mention category. Honorable mention went to, “Derivation of Equation on Thermal Life Prediction of Plated Through Hole for Printed Wiring Board” by Yoshiyuki Hiroshima, Fujitsu Advanced Technologies Limited.
His co-authors were: Shunichi Kikuchi and Akiko Matsui, Fujitsu Advanced Technologies Limited; Yoshiharu Kariya and Kazuki Watanabe, Shibaura Institute of Technology; Hiroshi Shimizu, Hitachi Chemical Company, Ltd.; and Jack Tan, HDP User Group International, Inc. Honorable mention also goes to “Bottom Heating during Manual Rework” by Lars Bruno, Ericsson AB. The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.