Tech Articles

Halogen-Free for the Modern Age: No Sacrifices Necessary

Editor — Tue, 09 Apr 2013 18:35:00 +0000

Halogen-free is not a slam-dunk yet – at least not in the Americas.

Microelectronics in adhesives dispensing electronics

Editor — Tue, 15 Jan 2013 22:18:00 +0000

These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes.

A review of halogen/halide-free test methods and classifications for soldering materials

Jasbir Bath, Gordon Clark, Tim Jensen et al — Fri, 30 Sep 2011 20:07:00 +0000

Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials.

Improved efficiency using root cause failure analysis

Gerry Padnos — Fri, 30 Sep 2011 19:23:00 +0000

A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above?

Cost factors of the cleaning process—part 1

Thomas Kucharek — Fri, 30 Sep 2011 01:54:00 +0000

Companies are constantly striving to reduce costs incurred during electronics production in order to increase cost effectiveness.

Bare board contamination

Sheila Hamilton — Fri, 12 Aug 2011 00:19:00 +0000

Technology and processing developments within SMT are moving bare board cleaning from a nice-to-have feature to an absolute necessity if yields are to be protected and/or improved.

Are factories efficient?

Peter Grundy — Thu, 11 Aug 2011 23:30:00 +0000

There are all sorts of ways of defining efficiency and there are all sorts of ways of trying to become efficient.

X-ray inspection of semiconductor devices that use copper wire interconnections

David Bernard, Ph.D., and Evstatin Krastev, Ph.D. — Thu, 11 Aug 2011 22:52:00 +0000

Copper wire is increasingly being used to replace gold as the interconnection of choice. This article discusses the use of x-ray inspection to check for the presence and alignment of interconnection wires.

Solder paste stencil manufacturing methods & their impact on precision and accuracy

Ahne Oosterhof and Stephan Schmidt — Thu, 11 Aug 2011 22:08:00 +0000

Stencil positional accuracy is a function of the manufacturing process (Machines, Methods, Materials and Men). The various parameters that influence positional accuracy will be discussed.

Contract electronic manufacturers with staying power

Pamela J. Gordon — Wed, 06 Jul 2011 23:02:00 +0000

How three small-to-medium-sized companies have achieved lasting success in this tough, dynamic industry