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Texas Instruments Ranks First in IEEE 802.15.4 IC Vendor Matrix Ranking

EDA Geek News Staff — Fri, 06 Nov 2009 16:32:25 +0000

Texas Instruments has been ranked at the top of the latest IEEE 802.15.4 IC Vendor Matrix released by ABI Research. Jennic, Ltd. and Freescale Semiconductor claimed the second and third spots in the company’s most recent evaluation of worldwide IEEE 802.15.4 IC vendors. The Vendor Matrix is an analytical tool developed by ABI Research to provide a clear understanding of vendors’ positions in specific markets. Vendors are assessed on the important parameters of “innovation” and “implementation” across several criteria unique to each vendor matrix.

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Cyber Secure Institute Issues Cybersecurity Truisms Statement

EDA Geek News Staff — Fri, 06 Nov 2009 12:27:31 +0000

Rob Housman, the Executive Director of the Cyber Secure Institute, put out this statement concerning two disturbing trends in cybersecurity: the growing number of unsupportable security claims and the increasing reliance on widely held beliefs as opposed to tested and proven technologies. The Cyber Security Institute is an analysis and advocacy institute dedicated to serving as the voice for effective cyber security.

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UCLA Engineering Students Win element14 Live EDGE Competition

EDA Geek News Staff — Fri, 06 Nov 2009 12:09:29 +0000

UCLA Engineering and element14, a new online technology resource and community for electronic design engineers, announce that three students at the Henry Samueli School of Engineering and Applied Science were selected to receive $2,500 Live EDGE scholarships to help further their educations in electrical and electronics engineering. Of the 12 Live EDGE scholarships awarded to engineering students worldwide, UCLA had the most winners.

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Dassault Unveils Component Supplier Management Solution for High-Tech

EDA Geek News Staff — Thu, 05 Nov 2009 17:35:40 +0000

Dassault Systèmes (DS) (Euronext Paris: #13065, DSY.PA), a world leader in 3D and Product Lifecycle Management (PLM) solutions, announced that it is offering high-tech companies a more effective way to utilize design-for-cost capabilities early in the product lifecycle. Building on its broader high tech PLM offering, the DS ENOVIA Component Supplier Management (CSM) Initiative will enable companies to promote a more comprehensive design anywhere, manufacture anywhere strategy incorporating global re-use, standardization and utilization of parts and components across their entire product development process. This approach helps to drive organizational agility and savings by maximizing margins, driving economies of scale, reducing cycle times and improving overall quality.

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Freescale Introduces i.MX514, i.MX516, i.MX512, i.MX513 Processors

EDA Geek News Staff — Thu, 05 Nov 2009 12:32:40 +0000

The Freescale i.MX51 product family that helped establish the fast-growing smartbook category has been expanded to include new processors designed to help customers differentiate and win in automotive, industrial, and consumer markets. The new devices are the i.MX514 and i.MX516 processors for automotive applications and the i.MX512 and i.MX513 processors for industrial and consumer applications. In addition to these new offerings, the previously announced i.MX515 processor is shipping in volume quantities to smartbook manufacturers and is expanding availability to include industrial and additional consumer applications.

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STMicroelectronics Rolls Out 13 Single-axis, Two-axis MEMS Gyroscopes

EDA Geek News Staff — Thu, 05 Nov 2009 12:02:28 +0000

STMicroelectronics (NYSE: STM), the leading supplier of MEMS for consumer and portable applications(1), has expanded its motion-sensor portfolio with a broad range of thirteen new single- and two-axis gyroscopes. With more than a 50% shrink in volume over previous ST devices, reduced power consumption, and an aggressive price, ST’s new high-performance angular-motion sensors open the way to a wide range of innovative consumer applications, including gesture-controlled gaming and pointing devices, image stabilization in digital video or still cameras, and assisted GPS navigation.

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VIA Unveils AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems

EDA Geek News Staff — Wed, 04 Nov 2009 19:50:28 +0000

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs. Built using only five sections the VIA AMOS-5000 has the VIA-developed Em-ITX at its heart, offering developers a wealth of advantages including rich and versatile I/O configurations through expansive dual I/O coastlines, coupled with a variety of expansion modules for wide variety of application specific I/O configurations and a flexible EMIO bus supporting a wide range of modern and legacy bus technologies. Systems build using the VIA AMOS-5000 are shock resistant and can withstand a wide range of temperatures.

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Engineers without Borders, IEFT Help Sustain Schools in Tanzania

EDA Geek News Staff — Wed, 04 Nov 2009 19:34:14 +0000

Water and education are inseparable and interconnected. A school cannot function efficiently without a reliable water supply, and students’ learning abilities and attendance depend on the availability of clean water. Indigenous Education Foundation of Tanzania (IEFT), a non-profit grassroots organization that provides quality, affordable secondary education to underserved indigenous children in rural Tanzania, is partnering with the Portland Chapter of Engineers without Borders-USA (EWB-USA) to ensure the staff and students of Orkeeswa Secondary School in Lashaine Village, Tanzania have a water supply system that is safe and dependable.

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SiliconAid JTD Chip Debugger to Integrated into ASSET ScanWorks

EDA Geek News Staff — Wed, 04 Nov 2009 12:07:40 +0000

ASSET® InterTech, the leading supplier of open tools for embedded instrumentation, and SiliconAid Solutions, Austin, TX., have formed a strategic relationship whereby ASSET will integrate its first integrated circuit (IC) test tool into the ScanWorks® platform for embedded instrumentation and resell SiliconAid’s insertion and verification tools that support the emerging IEEE P1687 Internal JTAG (IJTAG) standard. SiliconAid is a supplier of world class chip verification and debug tools that support the IEEE 1149.1 Boundary-Scan Standard, which is commonly referred to as JTAG after the Joint Test Action Group which initiated development of the standard.

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Expanded NI Hardware-in-the-Loop Simulation Platform

EDA Geek News Staff — Tue, 03 Nov 2009 23:53:33 +0000

National Instruments has expanded their hardware-in-the-loop (HIL) simulation platform. In the past six months, NI has released almost 40 new products targeted at delivering flexible HIL solutions to embedded control system developers within a variety of industries. The NI HIL simulation tools enables engineers to maintain reliability and time-to-market requirements while reducing costs.

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STMicroelectronics, LG Display Reveal iDP Standard for LCD TVs

EDA Geek News Staff — Tue, 03 Nov 2009 23:04:07 +0000

STMicroelectronics (NYSE: STM), one of the world’s leading semiconductor companies, in collaboration with LG Display (NYSE: LPL, KRX: 034220), a world leading LCD panel manufacturer, announced submission of their proposed iDP (Internal DisplayPort) interface standard aimed at replacing the current LVDS (Low Voltage Differential Signaling) standard to the VESA (Video Electronics Standards Association) TV Panel Task Group.

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Chip Market Grows by 20% in Third Quarter

EDA Geek News Staff — Tue, 03 Nov 2009 21:50:55 +0000

September’s chip sales hit US$24.0 billion, heralding a 20 percent quarterly increase on Q2-09. “That means we are in the enviable position of announcing an increase to our 2009 forecast,” commented Malcolm Penn, Chairman and CEO at the UK-based research firm, Future Horizons. “We now see the market declining only 10 percent over 2008, a truly remarkable recovery considering the abyss we were staring into just this time last year. September’s sales were even higher than our optimistic best expectations. This recovery now has a momentum of its own.”

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Cell Phones to Remotely Control Cars

EDA Geek News Staff — Tue, 03 Nov 2009 12:07:04 +0000

In the 1997 spy thriller Tomorrow Never Dies, secret agent James Bond employs an Ericsson cell phone to control his BMW 750iL, outdriving a horde of gun-wielding bad guys in a tire-screeching, heart-pounding car chase. While actually driving a car with a cell phone remains the province of cinematic fantasy, using a mobile handset to remotely control some motor vehicle functions is already a reality, and represents a market set to boom in the coming years, according to iSuppli Corp.

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MoSys 40nm PCI Express 2.0 PHY

EDA Geek News Staff — Mon, 02 Nov 2009 19:22:12 +0000

MoSys, Inc., a leading supplier of differentiated high density embedded memory and high data rate parallel and serial interface IP, announced the availability of its PCI Express 2.0 PHY. MoSys’ PHY complies with the PIPE 2.0 specification and provides the physical layer (PHY) interface that connects to industry standard PCI Express 2.0 controllers.

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Mentor Graphics Reveals Roadmap for Silicon Test, Yield Analysis

EDA Geek News Staff — Mon, 02 Nov 2009 18:16:51 +0000

Mentor Graphics Corporation (NASDAQ: MENT) outlined its strategy and roadmap to help customers address the growing test challenges they face in moving to smaller process nodes and more complex, low-power, mixed-signal systems-on-chip (SOCs). As part of this strategy, Mentor is uniting its embedded compression and automatic test pattern generation (ATPG) technology with the leading built-in self-test (BIST) technology from recently acquired LogicVision into a new product line, called Tessent[tm]. The Tessent line is the industry’s most comprehensive set of design-for-test and silicon test solutions, and also includes LogicVision’s SiliconInsight product, Mentor’s layout-aware diagnosis tools and the newly announced Tessent YieldInsight product to provide solutions for post-silicon test characterization and yield analysis.

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In-Stat Reports Nokia Losing Market Share for Wi-Fi Handsets

EDA Geek News Staff — Mon, 02 Nov 2009 12:05:16 +0000

Nokia, the leading market share vendor for dual-mode Wi-Fi handsets, has seen its market lead slip significantly over the past year, reports In-Stat. In 2Q08, Nokia had over 50% market share. This has dropped well over 10 share points as of 2Q09. Over that same time period, Apple has significantly increased market share, as did RIM. Wi-Fi handset shipments have increased significantly over the past several years. From 2007 to 2008, shipments increased by over 50%. This growth is a result from increased phone functionality, falling price points, and carrier promotion.

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Emerson Network Power Rolls Out ATC250 Bus Converter for AdvancedTCA

EDA Geek News Staff — Fri, 30 Oct 2009 17:37:16 +0000

Emerson Network Power, a business of Emerson (NYSE:EMR) and the global leader in enabling Business-Critical Continuity, enhanced its industry-leading dc-dc bus converter portfolio with the release of the ATC250 at the AdvancedTCA® Summit 2009. The high-density, dual-input converter offers board manufacturers a ruggedized, compact solution for generating on-board power in high-density AdvancedTCA (ATCA®) environments and other space-constrained systems that typically employ distributed power architectures.

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STMicroelectronics STDP8028 Combines DisplayPort 1.1a, HDMI 1.3 Receiver

EDA Geek News Staff — Fri, 30 Oct 2009 16:51:36 +0000

STMicroelectronics (NYSE: STM), a world leader in consumer ICs, is the first to combine a DisplayPort 1.1a and HDMI 1.3 receiver to support full high-definition sources, such as Blu-Ray, while providing comprehensive analog-video and audio connectivity. The new STDP8028 SoC from ST simplifies the design of high-end Full-HD multimedia displays with its unique integration of video inputs, advanced video quality and usability features such as Picture-In-Picture (PIP) and Picture-By-Picture (PBP). The SoC is being designed into multi-function monitors and public displays by leading OEMs around the world.

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MIPS Releases Optimized ActionScript VM to Tamarin Open Source Project

EDA Geek News Staff — Thu, 29 Oct 2009 20:01:16 +0000

MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, announced it has released a MIPS®-optimized version of the ActionScript[TM] virtual machine (VM) that is used in compelling Web-connected technologies such as Adobe® Flash® Player. The ActionScript VM is accessible via the Tamarin open source project, and is a key component in optimizing Adobe Flash Player for running on the MIPS architecture.

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Intel, Numonyx Team on Stacked, Cross Point Phase Change Memory

EDA Geek News Staff — Thu, 29 Oct 2009 11:39:05 +0000

Intel Corporation and Numonyx B.V. announced a key breakthrough in the research of phase change memory (PCM), a new non-volatile memory technology that combines many of the benefits of today’s various memory types. For the first time, researchers have demonstrated a 64Mb test chip that enables the ability to stack, or place, multiple layers of PCM arrays within a single die. These findings pave the way for building memory devices with greater capacity, lower power consumption and optimal space savings for random access non-volatile memory and storage applications.

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Avago Debuts ACPL-M71T, ACPL-M72T R2Couplers for Hybrid Electric Vehicles

EDA Geek News Staff — Thu, 29 Oct 2009 11:05:55 +0000

Avago Technologies (Nasdaq:AVGO), a leading supplier of analog interface components for communications, industrial and consumer applications, announced a pair of automotive-grade high speed, low power, digital CMOS optocouplers for use in Hybrid Electric Vehicles. The ACPL-M71T single channel high speed 15MBd and ACPL-M72T low power LED drive optocouplers are the latest additions to Avago’s R2Coupler[TM] digital family. Both of these high temperature, low power optocouplers, which are available in small outline IC-5 (SOIC-5) packages, are ideal for use in controller area network bus (CANBus) interfaces and microcontroller interfaces applications.

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Laird Debuts Three EMI Sentry Form-In-Place Gaskets for EMI Shielding

EDA Geek News Staff — Wed, 28 Oct 2009 17:32:13 +0000

Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, announced the addition of three new products to its EMI Sentry[tm] Form-In-Place gasket family. This top-of-the-line Form-In-Place gasket family provides EMI shielding while offering heat and humidity resistance, excellent adhesion strength, and a minimal compression set. These qualities improve reliability by increasing the durability and longevity of assemblies. In addition, fast handling and rapid curing speed up productivity, while increased softness offers the cost saving advantage of volume dispensing.

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EVE ZeBu-Server Supports Verification Components Catalog

EDA Geek News Staff — Wed, 28 Oct 2009 11:35:21 +0000

EVE, the leader in hardware/software co-verification, announced that ZeBu-Server, its a scalable emulation system capable of handling up to one-billion application specific integrated circuit (ASIC) gates, supports a wide range of verification components. EVE’s comprehensive catalog of ZeBu verification intellectual property (VIP) includes transactors, memory models and speed bridges. These verification components set a new standard in performance and affordability, helping to give ZeBu-Server the lowest cost of emulation ownership in the industry.

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AMD Opteron Processors Improve ATCA Blade Servers

EDA Geek News Staff — Wed, 28 Oct 2009 11:04:32 +0000

AMD (NYSE: AMD) is demonstrating its latest advancements for helping improve the network performance capability of industry-standard Advanced Telecommunications Computing Architecture (ATCA) blade servers at the ATCA Summit. Quad-Core AMD Opteron[tm] processors, at 50 and 71W TDP, provide a high-performance, low-power platform for the networking and telecommunications market. The new AMD server chipset featuring PCI® Express 2.0 and HyperTransport[tm] 3 technology provides a complete solution with improved I/O capabilities to increase performance over previous-generation platforms.

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Cadence Debuts Allegro 16.3 System-in-Package, IC Packaging Software

EDA Geek News Staff — Wed, 28 Oct 2009 10:44:18 +0000

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced that package designers will be able to play a greater role in co-design and design chain collaboration with the latest release of its system-in-package (SiP) and IC packaging software. The Cadence Allegro 16.3 release features SiP Layout XL, a new product that puts co-design directly in the package design environment. The new co-design technology enables the optimization of designs between packaging and IC design teams without requiring packaging designers to learn IC design tools. Design chain collaboration is further enhanced through new SiP Finishing technology available with Allegro Package Designer (APD).

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NI Creates New Version of Graphical Software for LEGO MINDSTORMS NXT 2.0

EDA Geek News Staff — Tue, 27 Oct 2009 17:17:08 +0000

National Instruments announced a new version of its intuitive drag-and-drop software that powers the LEGO MINDSTORMS NXT 2.0 robotics kits for retail and education. With this system, children as young as 9 years old can design their own robots using new features such as color recognition, Bluetooth support and additional robot models that offer children more options to express their creativity. The software, which will be included with all LEGO MINDSTORMS NXT 2.0 kits, is based on the widely adopted NI LabVIEW graphical programming software, which provides children easy-to-use, drag-and-drop functionality to program their robotic creations. With this software, students simply drag and drop icons that are representative of the various tasks they want their robots to perform, similar to how professional engineers and scientists control today’s latest robotics with LabVIEW.

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RadiSys Reveals ATCA 4.0 Initiative for AdvancedTCA Products

EDA Geek News Staff — Tue, 27 Oct 2009 11:32:10 +0000

RadiSys® Corporation (NASDAQ: RSYS), a leading global provider of embedded computing solutions for telecommunications and other industries, announced the RadiSys ATCA 4.0 initiative, the company’s 4th generation of AdvancedTCA (ATCA) products that are designed to support the next generation of high bandwidth applications. A first in the marketplace, this fully integrated platform features the latest technology in the industry, incorporating a 10GBASE-KR and 40GBASE-KR4 capable backplane and 40G switching capability. As Telecom Equipment Manufacturers (TEMs) focus on building next generation network elements, including 4G and Broadband, the RadiSys ATCA 4.0 platform will provide them with the next generation switching, power and cooling that they require.

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Synopsys, Freescale Expand Verification Collaboration

EDA Geek News Staff — Tue, 27 Oct 2009 11:01:54 +0000

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, announced the expansion of its verification collaboration with Freescale. The integration of complex hardware enabled by Moore’s law, IP, and embedded software content in modern devices is causing a rapid increase in verification complexity. Freescale and Synopsys have broadened their ongoing collaboration to manage this growing complexity. In addition to verification performance, efficiency, and methodology, the expanded collaboration will focus on managing the ever-increasing cost of verification, which can encompass up to 75 percent of the total cost of product development.

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Trident Verifies Digital TV SoCs with Mentor Veloce Hardware Emulator

EDA Geek News Staff — Mon, 26 Oct 2009 15:58:44 +0000

Mentor Graphics Corp. (NASDAQ: MENT), the leader in advanced system verification solutions, announced that Trident Microsystems, a leader in high-performance semiconductor system solutions for the multimedia and digital television markets, has adopted Mentor’s Veloce® platform for the complete system-level verification of its next-generation digital TV SoC chips. Trident chose the Veloce platform due to its superior compiler and debug technologies, performance, accuracy, and innovative portfolio of iSolve[tm] vertical market solutions for the verification of their multimedia-based designs.

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Concurrent Announces TR 501/36x 3U VPX-REDI Single Board Computer

EDA Geek News Staff — Mon, 26 Oct 2009 11:03:14 +0000

Concurrent Technologies introduces a leading edge high performance 3U VPX-REDI single board computer based on Intel’s latest dual-core processors. The TR 501/36x is designed to comply with the OpenVPX VITA 65 standard, and utilizes the 1.86 GHz Intel Core 2 Duo SL9400 processor and the Intel® GS45 mobile class chipset both from the Intel® embedded roadmap, ensuring long term availability. The board supports up to 8 Gbytes DDR3-1066 soldered SDRAM and a wide variety of I/O interfaces including an XMC site. The rugged conduction cooled variant, TR 501/36xRC, supports VPXREDI Type 1 Two Level Maintenance.

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