The 0.25-micron high-voltage process node enables higher voltage functionality to be integrated efficiently into single chip power management ICs, increasing cost efficiencies and expanding the addressable market for Dialog solutions.

The ability to integrate higher voltage and more efficient components is an important feature of Dialog's next generation PMICs, and enables the creation of smaller form factor devices with reduced power consumption. A broad range of proprietary IP blocks, based on TSMC's 0.25um BCD process nodes, have already been developed for incorporation into Dialog's next generation PMICs, with the first devices already available. The designs deliver the industry's leading power management performance for portable devices.

"Close collaboration of our innovative technology with foundry partners is key to Dialog's strategic business model, which accelerates the development of the highest level of power management integration in the industry," said Dr Jalal Bagherli, CEO of Dialog Semiconductor. "Through our ongoing and longstanding collaboration with TSMC, we are able to provide our customers with validated low-power technologies to manage their power management needs and meet aggressive time-to-market goals."

"TSMC consistently delivers cutting edge technology platforms that include integrated design collaterals," said Jason Chen, Vice President of Worldwide Sales and Marketing at TSMC. "Dialog is one of the technology leaders, bringing the best power management experiences possible to portable users through extended battery lifetime in portable devices. We are proud to be a strategic supplier to them."

    
    
    Dialog contact:
    
    Birgit Hummel, Dialog Semiconductor, Neue Strasse 95,D-73230
    Kirchheim/Teck-Nabern, Germany.
    
    Tel:     +49 7021 805 412      e-mail:   birgit.hummel@diasemi.com
    Fax:     +49 7021 805 200      Web:      www.dialog-semiconductor.com
    
    Rob Ashwell, Publitek Limited, 18 Brock Street, Bath,
    BA1 2LW, United Kingdom
    
    
    Tel:     +44 (0)1225 470000    e-mail:   rob.ashwell@publitek.com
    
    TSMC contact:
    
    J.H.Tzeng, Deputy Director PR Department
    
    Tel:     + 886 3 5055028       Fax:      +886-3-5670121
    email:   jhtzeng@tsmc.com
    
    Michael Kramer, Senior Administrator, PR Department
    
    Tel:     +886 3 5636688        Fax:      +886-3-5670121
                ext. 712-6216  
    email:   cychung@tsmc.com
    
    

About Dialog

Dialog Semiconductor creates energy-efficient, highly integrated, mixed-signal circuits optimised for personal mobile, lighting & display and automotive applications. The company provides flexible and dynamic support, world-class innovation and the assurance of dealing with an established business partner.

With its unique focus and expertise in system power management, Dialog brings decades of experience to the rapid development of integrated circuits for power management, audio, display processing and motor control. Dialog's processor companion chips are essential for enhancing both the performance of hand-held products and the consumers' multimedia experience. With world-class manufacturing partners, Dialog operates a fabless business model.

Dialog Semiconductor plc is headquartered near Stuttgart with a global sales, R&D and marketing organisation. In 2009, it had approximately $218 million in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 340 employees. The company is listed on the Frankfurt (FWB: DLG) stock exchange.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company's managed capacity in 2009 totaled 9.96 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs™, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

Small form factor and low power consumption are important features of Qualcomm's next generation of system-on-a-chip (SoC) solutions, including the Snapdragon™ chipset platform. The two companies are capitalizing on their long-term relationship as Qualcomm works on migrating directly from the 45nm to the 28nm node.

"TSMC prides itself on its ability to deliver cutting-edge technology platforms, including the related design ecosystems. Our 28nm platform supports the high-performance, low-power products that deliver next-generation experiences," said Jason Chen, vice president of Worldwide Sales and Marketing. "We are pleased to be working with Qualcomm, a market leader in wireless technology, on bringing these new experiences to reality."

"Qualcomm's close collaboration with TSMC has always been a key part of our ability to deliver significant advantages to our customers through the industry-leading integration, power efficiency and cost efficiency of our products – enabling them to do more with less," said Jim Clifford, senior vice president and general manager of Qualcomm CDMA Technologies. "Qualcomm's integrated fabless manufacturing model and migration to smaller geometries will allow us to continue enabling the best mobile user experience possible on handsets, smartphones and smartbook devices."

Qualcomm and TSMC worked closely on 65nm and 45nm technologies. They are continuing their relationship into low-power, low-leakage 28nm designs for high-volume manufacturing. Delivering up to twice the density of previous manufacturing nodes, 28nm technology allows semiconductors that power mobile devices to do far more with less power. Qualcomm and TSMC are working on both high-k metal gate (HKMG) 28HP and silicon oxynitride (SiON) 28LP technologies. Qualcomm expects to tape out its first commercial 28nm products in mid-2010.

Close collaboration with strategic technology and foundry partners is a key part of Qualcomm's Integrated Fabless Manufacturing (IFM) business model, which delivers greater efficiencies and accelerated technology advancement to the industry.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2009 exceeded 10 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GigaFabs™, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

About Qualcomm

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 100 Index, the S&P 500 Index and is a 2009 FORTUNE 500 company. For more information, please visit Qualcomm around the Web:

www.qualcomm.com

Blog: www.qualcomm.com/blog

Twitter: www.twitter.com/qualcomm

Facebook: www.facebook.com/Qualcomm

Qualcomm is a registered trademark of Qualcomm Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.

PowerTrim is a first-of-its-kind technology that blends a layer of design technology with advanced semiconductor processing to optimize a design's power leakage. Tela Innovations provides the patented PowerTrim technology and services under an exclusive license to TSMC.

PowerTrim software analyzed the LSI design and substituted cells with small increases in gate length on non-critical timing paths. These small changes make a significant impact since increasing gate length exponentially reduces leakage current.

"Low power consumption and high performance are key to the success of our products," said Norm Lawrence, director of Product and Test Engineering, Networking Components Division at LSI Corporation. "Working closely with TSMC and Tela Innovations, PowerTrim helped us reduce leakage power by over 25% while improving our yield distribution for leakage."

PowerTrim performs speed/power tradeoffs using a CD biasing technique that analyzes designs and intelligently applies gate length biases to the appropriate cells (i.e. non-critical paths possessing sufficient timing "slack"). The technology optimizes transistors along these paths without reducing chip performance. The gate CD biases are implemented as part of the Optical Proximity Correction (OPC) flow. The process does not impact cell footprint or chip area. The result is significant leakage power reduction while maintaining chip performance and area. PowerTrim also significantly reduces leakage power variability resulting in improved parametric yield.

"Enabling our customers to improve important product features like power consumption is one of the key objectives of TSMC's Open Innovation Platform(TM) initiative," said ST Juang, senior director of Design Infrastructure Marketing at TSMC. "Collaborating with innovative companies like Tela Innovations to provide an Open Innovation(TM) program creates differentiated value that is the central vision behind this initiative. We are quite pleased with the results that LSI achieved and are encouraged by their decision to deploy PowerTrim."

The PowerTrim service is implemented in conjunction with other leakage reduction techniques such as multi-Vt cell libraries, reverse body biasing, header/footer sleep switches, and voltage islands. It provides additional leakage improvements and is more efficient in terms of leakage reduction per unit of slack than high-Vt transistors.

Availability

PowerTrim is available directly from TSMC for advanced process technologies including 90nm, 80nm, 65nm, 55nm, and 40nm process nodes. Tela's technology is exclusively embedded in PowerTrim. Contact TSMC account management for more information.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2009 exceeded 10 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GigaFabs™, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

HSINCHU, Taiwan, R.O.C., Nov. 27 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that it plans to launch the automotive industry's first process qualification specification and service package for automotive-grade semiconductor manufacturing at the China IC Design Conference being held in Xiamen on December 2.

The company also announced that its Fab 10, located in Shanghai, is prepared to manufacture automotive grade ICs.

The automotive process qualification specification, made broadly public today, was first proposed at the Automotive Electronic Council's (AEC) annual Reliability Workshop in June 2008. Semiconductor devices in automobiles wear out quickly due to the stringent operating environment, and it is critical that the inherent manufacturing process can support semiconductor devices that will last far beyond the vehicle's lifetime.

TSMC has also developed a comprehensive Automotive Service Package to complement customers' test coverage and test methodology to reduce the field failure rate. TSMC Automotive Service Package incorporate tightened process control, device level screen limit, and wafer sorting scrap criteria, additional SPC monitoring, preferred tools, etc. It significantly reduces process variation and outliers.

"Integrated circuits of all types are playing a larger role in the automotive industry. Our commitment is to support automotive IC technology including innovations that are taking place in China," said Jason Chen, Vice President, Worldwide Sales and Marketing, TSMC. "We are backing this commitment with action by dedicating our efforts at Fab 10 in Shanghai to accelerate the growth of China's automotive present and future."

TSMC Fab 10 in Shanghai, along with multiple fabs in Taiwan, has successfully established the capability of supporting the automotive service package. The automotive process route in Fab 10 is available for global auto supply chain companies, including those in China.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

The partnership extension with TSMC is in line with Infineon's strategy to outsource manufacturing and to engage in technology co-development for 65nm and smaller geometry processes. The 65nm eFlash technology for automotive applications supports the high degree of functional integration required that drive the performance and features called for in upcoming safety and emission standards. The 65nm eFlash technology for chip card and security applications will support Infineon's innovation focus on tailored security that offers the appropriate level of security at the best cost-performance ratio, for applications in the smart card form factor and beyond.

Process and product qualification for security MCUs is scheduled for the second half of 2012. Automotive MCU qualification and production start is scheduled for the first half of 2013. Infineon's 32-bit TriCore(TM) family MCUs will be the first automotive products produced on the 65nm eFlash process. Ultimately, TSMC will manufacture Infineon's broad range of security microcontrollers that feature contact-based, contact-less or dual interface.

"We are pleased to extend our collaboration with TSMC as a stable and reliable partner into new applications," explained Jochen Hanebeck, President of the Automotive Division at Infineon Technologies. "We are confident that TSMC with its strong manufacturing excellence background will be able to fulfill the stringent automotive market requirements with their particular focus on quality."

Dr. Helmut Gassel, President of Infineon's Chip Card & Security Division, added: "For smart card and security applications, Infineon has safeguarded a long-term production partner. We trust in TSMC to master the demanding obligations of Infineon as an innovative and reliable source providing long-term and stable supply of security microcontrollers. Indicating our firm and ongoing commitment to highest security standards, it is understood that TSMC will be audited under the most stringent international security specifications as being provided by Infineon."

"Infineon is an acknowledged leader in a number of technology and application segments. They have a world-class reputation in embedded flash development and have earned the respect of the automotive and chip card industry for their product quality and innovation. TSMC is committed to providing the manufacturing quality required by our automotive customers. We will provide that same level of excellence and the security required for their smart card applications," said C.C. Wei, Senior Vice President, Business Development, TSMC.

Infineon and TSMC have compiled more than a decade-long partnership covering several Infineon's applications, such as industrial and wireline. Based on a manufacturing agreement to use TSMC 65nm low-power technology for Infineon's products employed in mobile devices, which started about two years ago, the move to automotive and chip card applications signals a firm and ongoing commitment on the part of both companies to a strong development alliance and a stable and long-term production partnership.

Infineon is one of two market leaders that both hold a 9.5% share of the worldwide automotive electronics market in 2008, worth about US$18.3 billion. Infineon is the number one chip card semiconductor vendor, with 25.5 percent of the worldwide market valued at US$2.4 billion in 2008.

TSMC is the only dedicated foundry to offer 0.25-micron and 0.18-micron embedded flash IP that meet AEC-Q100 specification.

About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending September), the company reported sales of Euro 4.3 billion with approximately 29,100 employees worldwide in continuing operations. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com

This news release is available online at www.infineon.com/press/ and at www.tsmc.com/

"Setting a record year in 2010 is TSMC's internal target and should not be viewed as a financial forecast," said Ms. Ho. "What Chairman Chang has referred to as TSMC's profit record was the net profit set in 2006. However, he has also indicated internally that this profit goal will be adjusted by employee profit sharing expensing, which is currently 15% of net income. Using 2006 net income of NT$127 billion, the profit record that TSMC aims to break in 2010 will be NT$108 billion."

Year-over-year, third quarter revenue decreased 3.3% while net income decreased 0.1% and diluted EPS increased 0.3%. Compared to second quarter of 2009, third quarter results represent a 21.2% increase in revenue, an increase of 25% in net income, and an increase of 24.8% in diluted EPS. All figures were prepared in accordance with R.O.C. GAAP on a consolidated basis.

Gross margin for the quarter was 47.7%, operating margin was 35.6%, and net margin was 34%.

As demand outlook continued to improve, third quarter saw a solid growth in the demand for semiconductors across all major applications.

Advanced process technologies (0.13-micron and below) accounted for 67% of wafer revenues. 90-nanometer process technology accounted for 18% of wafer revenues, 65-nanometer 31%, and 40-nanometer exceeded 4% of total wafer sales.

"For the fourth quarter, we expect the demand from computer related applications to grow strongly while communication related applications will take a pause after two consecutive quarters' strong momentum, and consumer applications will decline following their seasonal pattern," said Lora Ho, VP and Chief Financial Officer of TSMC. "Based on our current business outlook, management expects overall performance for fourth quarter 2009 to be as follows:

    -- Revenue is expected to be between NT$90 billion and NT$92 billion;
    -- Gross profit margin is expected to be between 47% and 48.5%;
    -- Operating profit margin is expected to be between 35.5% and 37%."

Lora Ho further said: "Due to stronger demand for 40-nanometer and 65-nanometer technologies, TSMC 2009 capital expenditure is further raised and is expected to be around US$2.7 billion."

Conference Call & Webcast Notice:

TSMC's quarterly review conference call will be held at 8 a.m. Eastern Time (8 p.m. Taiwan Time) on Thursday, October 29, 2009. The conference call will also be webcast live on the Internet. Investors wishing to access the live webcast should visit TSMC's web site at http://www.tsmc.com at least 15 minutes prior to the broadcast. Instructions will be provided on the web site to facilitate the download and installation of necessary audio applications. Investors without Internet access may listen to the conference call, in listen-only mode, by dialing 1-617-614-3518 in the U.S., 852-3002-1672 in Hong Kong, and 44-207-365-8426 in the U.K. (Password: TSMC). An archived version of the webcast will be available on TSMC's web site for six months following the Company's quarterly review conference call and webcast.

Profile

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company's total managed capacity in 2008 exceeded nine million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com .

                   (Management Report and Tables Follow)



    TSMC 3Q09 Quarterly Management Report October 29, 2009

    Topics in This Report

    -- Revenue Analysis
    -- Profit & Expense Analysis
    -- Financial Condition Review
    -- Cash Flow
    -- CapEx & Capacity
    -- Recap of Recent Important Events & Announcements

    Operating Results Review:



    Summary:

    (Amounts are on consolidated basis
    and are in NT billions except
    otherwise noted)                        3Q09   2Q09    3Q08    QoQ    YoY

    EPS (NT$ per common share)              1.18   0.94    1.17  24.8%   0.3%
        (US$ per ADR unit)                  0.18   0.14    0.19     --     --

    Consolidated Net Sales                 89.94  74.21   92.98  21.2%  (3.3%)
    Gross Profit                           42.86  34.30   43.09  25.0%  (0.5%)
    Gross Margin                           47.7%  46.2%   46.3%     --     --

    Operating Expense                     (10.87) (9.17) (10.18) 18.6%   6.9%
    Operating Income                       31.99  25.13   32.91  27.3%  (2.8%)
    Operating Margin                       35.6%  33.9%   35.4%     --     --
    Non-Operating Items                     0.97   1.26    1.51     --     --

    Net Income                             30.55  24.44   30.57  25.0%  (0.1%)
    Net Profit Margin                      34.0%  32.9%   32.9%     --     --

    Wafer Shipment (kpcs 8 inch-equiv.)    2,445  1,971   2,411  24.0%   1.4%

    Note: Total outstanding shares were 25,901mn units on 9/30/09



    Financial Highlights:

    Third Quarter 2009

    -- Consolidated net sales were NT$89.94 billion, representing a 21.2%
       growth from NT$74.21 billion in 2Q09 and a 3.3% decline from NT$92.98
       billion in 3Q08.
    -- Gross margin was 47.7%, 1.5 percentage points higher than 2Q09 and 1.4
       percentage points higher than 3Q08.
    -- Operating margin was 35.6%, 1.7 percentage points higher than 2Q09 and
       0.2 percentage point higher than 3Q08. Operating expenses were NT$10.87
       billion, NT$1.7 billion and NT$0.69 billion higher than prior and
       year-ago quarter, respectively.
    -- The combined result from non-operating income and long-term investments
       was a gain of NT$0.97 billion, comparing with a gain of NT$1.26 billion
       in 2Q09 and a gain of NT$1.51 billion in 3Q08.
    -- Consolidated net income attributable to shareholders of the parent
       company was NT$30.55 billion, 25.0% increase from prior quarter. Net
       profit margin was 34.0% and diluted EPS was NT$1.18.



    I. Revenue Analysis

       I.  Wafer Sales Analysis

       By Application                         3Q09        2Q09        3Q08
       Computer                                30%         28%         33%
       Communication                           46%         45%         41%
       Consumer                                18%         21%         20%
       Industrial/Others                        6%          6%          6%

       By Technology                          3Q09        2Q09        3Q08
       45/40nm                                  4%          1%          0%
       65nm                                    31%         28%         25%
       90nm                                    18%         23%         26%
       0.11/0.13um                             14%         13%         15%
       0.15/0.18um                             21%         23%         22%
       0.25/0.35um                              9%          9%          9%
       0.50um+                                  3%          3%          3%

       By Customer Type                       3Q09        2Q09        3Q08
       Fabless/System                          80%         82%         70%
       IDM                                     20%         18%         30%

       By Geography                           3Q09        2Q09        3Q08
       North America                           70%         65%         74%
       Asia Pacific                            13%         18%         11%
       China                                    3%          3%          1%
       Europe                                  11%         11%         11%
       Japan                                    3%          3%          3%

Revenue Analysis:

3Q09 business saw a continued improvement with demand growing across the board. Sequentially, revenues from computer applications grew the most with 29% quarter-over-quarter growth rate, followed by communication's 25% and consumer's 11%, respectively.

As a result of continued ramp-up of our 40/45nm technology, revenues from 40/45nm were more than quadrupled during the quarter and accounted for 4% of total wafer sales. Meanwhile, revenues from 65nm and 90nm each accounted for 31% and 18% of total wafer sales. Overall, revenues from advanced technologies (0.13-micron and below) represented 67% of total wafer sales, two percentage points up from prior quarter.

Revenues from IDM customers accounted for 20% of total wafer sales in 3Q09, two percentage points increase from 2Q09.

From a geographic perspective, revenues from customers based in North America accounted for 70% of total wafer sales, five percentage points up from prior quarter. Meanwhile, sales from Asia Pacific, China, Europe and Japan accounted for 13%, 3%, 11%, and 3% of total wafer sales, respectively.

    II. Profit & Expense Analysis



    II - 1. Gross Profit Analysis

    (In NT billions)                            3Q09        2Q09        3Q08

    COGS                                       47.08       39.91       49.89
    Depreciation                               18.37       18.54       19.06
    Other MFG Cost                             28.71       21.37       30.83

    Gross Profit                               42.86       34.30       43.09

    Gross Margin                               47.7%       46.2%       46.3%

Gross Profit Analysis:

Gross margin for the third quarter 2009 was 47.7%, up from 46.2% of prior quarter. The 1.5 percentage points improvement in gross margin was primarily due to a higher level of capacity utilization and continued cost improvement, partially offset by a decline in pure price and unfavorable exchange rate.

    II - 2. Operating Expenses

    (In NT billions)                            3Q09        2Q09        3Q08

    Total Operating Exp.                       10.87        9.17       10.18
    SG&A                                        4.67        4.07        4.20
    Research & Development                      6.20        5.10        5.98
    Total Operating Exp. as a % of Sales       12.1%       12.3%       10.9%

Operating Expenses:

Total operating expenses for 3Q09 increased by NT$1.70 billion to NT$10.87 billion, representing 12.1% of net sales, better than 12.3% of net sales in 2Q09.

SG&A expenses increased by NT$0.60 billion from 2Q09. The increase was mainly due to higher legal fee and a one-time donation.

Research and development expenditures increased by NT$1.1 billion sequentially, primarily due to increased activities in 28nm and 22nm technology development.

    II - 3. Non-Operating Items

    (In NT billions)                            3Q09         2Q09        3Q08

    Non-Operating Inc./(Exp.)                   0.52         1.15        1.33
       Net Interest Income/(Exp.)               0.42         0.56        1.15
       Other Non-Operating                      0.10         0.59        0.18
    L-T Investments                             0.45         0.11        0.18
       SSMC                                     0.26         0.19        0.15
       Others                                   0.19        (0.08)       0.03
    Total Non-Operating Items                   0.97         1.26        1.51

Non-Operating Items:

Combined result from non-operating income and long-term investments was a gain of NT$0.97 billion for third quarter 2009.

Non-operating income was NT$0.52 billion, lower than NT$1.15 billion in 2Q09. The sequential decline was primarily due to the absence of litigation compensation and less interest income.

Net investment gain was NT$0.45 billion, higher than NT$0.11 billion of prior quarter, mainly due to continued business improvement among invested companies.

    III. Financial Condition Review



    III - 1. Liquidity Analysis
      (Selected Balance Sheet Items)

      (In NT billions)                          3Q09        2Q09         3Q08

      Cash & Marketable Securities            180.32      246.77       158.17
      Accounts Receivable - Trade              35.88       33.38        45.33
      Inventory                                19.18       18.97        21.82
      Total Current Assets                    244.24      309.42       232.35
      Accounts Payable                         26.30       25.96        17.75
      Current Portion of Bonds Payable          0.00        0.00         8.00
      Dividends Payable                         0.00       77.17         0.00
      Accrued Bonus to Employees                8.62       11.49        13.28
      Accrued Liabilities and Others           20.09       15.01        23.10
      Total Current Liabilities                55.01      129.63        62.13
      Current Ratio (x)                          4.4         2.4          3.7
      Net Working Capital                     189.23      179.79       170.22

Liquidity Analysis:

At the end of 3Q09, total cash and marketable securities decreased by NT$66.45 billion to NT$180.32 billion. We paid NT$76.88 billion for cash dividends and generated NT$14.62 billion of free cash flow during this quarter.

Total current liabilities decreased by NT$74.62 billion in this quarter, primarily due to payment of cash dividends.

Net working capital was NT$189.23 billion and current ratio increased to 4.4x.

    III - 2. Receivable/Inventory Days

      (In Number of Days)
                                                3Q09        2Q09         3Q08

      Days of Receivable                          36          30           43
      Days of Inventory                           41          42           45

Receivable and Inventory Days:

Sequentially, days of receivable increased by six days to 36 days in 3Q09, mainly due to average accounts receivable growing faster than sales. The quality of collection remains the same.

    Days of inventory decreased by one day to 41 days.



    III - 3. Debt Service

      (In NT billions)                          3Q09        2Q09        3Q08

      Cash & Marketable Securities            180.32      246.77       158.17
      Interest-Bearing Debt                    15.33       15.57        23.41
      Net Cash Reserves                       164.99      231.20       134.76

Debt Service:

Net cash reserves, defined as the excess of cash and short-term marketable securities over interest-bearing debt, decreased by NT$66.21 billion to NT$164.99 billion at the end of 3Q09, primarily due to cash dividend payment, net off by free cash flow generated during this quarter.

    IV. Cash Flow



    IV - 1.1. Cash Flow Analysis

      (In NT billions)                          3Q09        2Q09         3Q08

      Net Income                               30.55       24.44        30.57
      Depreciation & Amortization              20.00       20.05        20.69
      Employee Profit Sharing Payment*         (7.49)        n.a          n.a
      Other Operating Sources/(Uses)            3.60      (19.97)        4.64
      Total Operating Sources/(Uses)           46.66       24.52        55.90

      Capital Expenditure                     (32.04)      (7.42)      (10.38)
      Marketable Financial Instruments        (18.94)       1.68       (18.07)
      Other Investing Sources/(Uses)           (0.53)      (0.25)        1.93
      Net Investing Sources/(Uses)            (51.51)      (5.99)      (26.52)

      Cash Dividends                          (76.88)       0.00       (76.78)
      Employee Profit Sharing Payment*           n.a         n.a        (3.94)
      Purchase of Treasury Stock                0.00        0.00       (23.81)
      Other Financing Sources/(Uses)           (0.11)      (0.34)       (0.43)

      Net Financing Sources/(Uses)            (76.99)      (0.34)     (104.96)

      Net Cash Position Changes               (81.84)      18.19       (75.58)

      Exchange Rate Changes & Others           (0.74)      (1.93)        2.68

      Ending Cash Balance                     156.94      239.52       112.45

      *Starting 2008, Taiwan accounting rule requires company to expense
       employee profit sharing

Summary of Cash Flow:

Cash generated from operating activities totaled NT$46.66 billion during the quarter, up from NT$24.52 billion in 2Q09 as a result of higher level of business activities, partially offset by NT$7.49 billion for 2008 employee profit sharing payment.

Net cash used in investing activities was NT$51.51 billion in 3Q09, reflecting the capital expenditures of NT$32.04 billion and investments in fixed income instruments of NT$14.83 billion.

Net cash used in financing activities was NT$76.99 billion during the quarter, as we paid NT$76.88 billion for cash dividends.

    As a result, TSMC ended 3Q09 with a cash balance of NT$156.94 billion.

    IV - 2. Operating and Free Cash Flows:

Operating and Free Cash Flows:

Cash flows generated from operating activities were NT$46.66 billion during the quarter. Free cash flow, defined as the excess of operating cash flows over capital expenditures, totaled NT$14.62 billion in 3Q09, compared to NT$17.10 billion in 2Q09.

Please refer to the link for the index charts:
Chain Carbon Inventory. (2009/09/21)
-- Fujitsu Microelectronics and TSMC To Collaborate On 28nm Process
Technology. (2009/08/27)
-- TSMC Has Become the First Foundry Not Only To Achieve 28nm Functional
64Mb SRAM Yield, But Also To Achieve It Across All Three 28nm Nodes.
(2009/8/24)
-- TSMC Adds High-K Metal Gate Low Power Process To 28nm Road Map. Risk
Production Is Expected In Q3 2010. (2009/08/24)
-- IDT And TSMC Enter Product Fabrication Agreement. (2009/08/06)
-- TSMC Extends Design Methodology Leadership To 28nm With Reference Flow
10.0. (2009/07/22)



TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
Consolidated Condensed Balance Sheets

(Expressed in Millions of New Taiwan Dollars (NTD) and U.S. Dollars (USD)) (1)

                                     September 30, 2009       June 30, 2009
                                         (unaudited)            (audited)
    ASSETS                           USD      NTD       %       NTD       %
    Current Assets
      Cash and Cash Equivalents    $4,874  $156,935    29.0  $239,517    40.8
      Investments in Marketable
       Financial Instruments          726    23,384     4.3     7,252     1.2
      Accounts Receivable - Trade   1,114    35,881     6.6    33,384     5.7
      Inventories, Net                596    19,176     3.5    18,974     3.2
      Other Current Assets            275     8,865     1.7    10,292     1.8
         Total Current Assets       7,585   244,241    45.1   309,419    52.7

    Long-Term Investments           1,197    38,553     7.1    32,498     5.5

    Properties, Plant and
     Equipment                     28,318   911,844   168.3   881,897   150.1
    Less: Accumulated
     Depreciation                 (20,963) (675,028) (124.6) (656,826) (111.8)
         Properties, Plant and
          Equipment, Net            7,355   236,816    43.7   225,071    38.3

    Other Assets                      692    22,287     4.1    20,555     3.5
    Total Assets                  $16,829  $541,897   100.0  $587,543   100.0

    LIABILITIES AND SHAREHOLDERS'
     EQUITY
    Current Liabilities
      Accounts Payables              $330   $10,633     2.0   $10,105     1.7
      Payables to Contractors and
       Equipment Suppliers            486    15,666     2.9    15,853     2.7
      Accrued Expenses and Other
       Current Liabilities            882    28,401     5.2   103,363    17.6
      Current Portion of Bonds
       Payable and Long-Term
       Debts                           10       309     0.1       309     0.1
         Total Current Liabilities  1,708    55,009    10.2   129,630    22.1
    Bonds Payable                     140     4,500     0.8     4,500     0.8
    Other Long-Term Liabilities       489    15,761     2.9    16,060     2.7
         Total Liabilities          2,337    75,270    13.9   150,190    25.6

    Shareholders' Equity
     Attributable to Shareholders
     of the Parent
      Capital Stock at Par Value    8,044   259,007    47.8   258,964    44.1
      Capital Surplus               1,722    55,440    10.2    55,331     9.4
      Legal Capital Reserve (2)     2,401    77,317    14.3    77,317    13.2
      Special Capital Reserve (2)      --        --      --        --      --
      Unappropriated Earnings (2)   2,233    71,899    13.3    41,348     7.0
      Treasury Stock                   --        --      --        --      --
      Others                          (24)     (778)   (0.2)      801     0.1
         Total Equity
          Attributable to
          Shareholders of the
          Parent                   14,376   462,885    85.4   433,761    73.8
      Minority Interests              116     3,742     0.7     3,592     0.6
         Total Shareholders'
          Equity                   14,492   466,627    86.1   437,353    74.4
    Total Liabilities &
     Shareholders' Equity         $16,829  $541,897   100.0  $587,543   100.0

    Note:

    (1) Amounts in New Taiwan dollars have been translated into U.S. dollars
        at the rate of NT$32.2 as of September 30, 2009.
    (2) Certain prior period balances have been reclassified to conform to
        the current period presentation.



     TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
                    Consolidated Condensed Balance Sheets

                                 (Continued)

                        September 30, 2008
                            (unaudited)           QoQ               YoY
    ASSETS                   NTD       %      Amount     %     Amount     %
    Current Assets
      Cash and Cash
       Equivalents        $112,446    20.4  ($82,582)  (34.5) $44,489    39.6
      Investments in
       Marketable
       Financial
       Instruments          45,724     8.3    16,132   222.4  (22,340)  (48.9)
      Accounts Receivable
       - Trade              45,333     8.2     2,497     7.5   (9,452)  (20.9)
      Inventories, Net      21,817     4.0       202     1.1   (2,641)  (12.1)
      Other Current
       Assets                7,029     1.3    (1,427)  (13.9)   1,836    26.1
         Total Current
          Assets           232,349    42.2   (65,178)  (21.1)  11,892     5.1

    Long-Term Investments   41,874     7.6     6,055    18.6   (3,321)   (7.9)

    Properties, Plant and
     Equipment             849,818   154.5    29,947     3.4   62,026     7.3
    Less: Accumulated
     Depreciation         (597,523) (108.6)  (18,202)    2.8  (77,505)   13.0
         Properties,
          Plant and
          Equipment, Net   252,295    45.9    11,745     5.2  (15,479)   (6.1)

    Other Assets            23,481     4.3     1,732     8.4   (1,194)   (5.1)
    Total Assets          $549,999   100.0  ($45,646)   (7.8) ($8,102)   (1.5)

    LIABILITIES AND
     SHAREHOLDERS' EQUITY
    Current Liabilities
      Accounts Payables     $9,671     1.8      $528     5.2     $962    10.0
      Payables to
       Contractors and
       Equipment
       Suppliers             8,082     1.4      (187)   (1.2)   7,584    93.8
      Accrued Expenses
       and Other Current
       Liabilities          36,124     6.6   (74,962)  (72.5)  (7,723)  (21.4)
      Current Portion of
       Bonds Payable and
       Long-Term Debts       8,258     1.5        --    (0.1)  (7,949)  (96.3)
         Total Current
          Liabilities       62,135    11.3   (74,621)  (57.6)  (7,126)  (11.5)
    Bonds Payable            4,500     0.8        --      --       --      --
    Other Long-Term
     Liabilities            17,541     3.2      (299)   (1.9)  (1,780)  (10.1)
         Total
          Liabilities       84,176    15.3   (74,920)  (49.9)  (8,906)  (10.6)

    Shareholders' Equity
     Attributable to
     Shareholders of the
     Parent
      Capital Stock at
       Par Value           259,042    47.1        43     0.0      (35)   (0.0)
      Capital Surplus       50,463     9.2       109     0.2    4,977     9.9
      Legal Capital
       Reserve (2)          67,324    12.2        --      --    9,993    14.8
      Special Capital
       Reserve (2)             392     0.1        --      --     (392) (100.0)
      Unappropriated
       Earnings (2)        103,063    18.7    30,551    73.9  (31,164)  (30.2)
      Treasury Stock       (16,500)   (3.0)       --      --   16,500  (100.0)
      Others                (1,708)   (0.3)   (1,579) (197.1)     930   (54.5)
         Total Equity
          Attributable to
          Shareholders of
          the Parent       462,076    84.0    29,124     6.7      809     0.2
      Minority Interests     3,747     0.7       150     4.2       (5)   (0.2)
         Total
          Shareholders'
          Equity           465,823    84.7    29,274     6.7      804     0.2
    Total Liabilities &
     Shareholders' Equity $549,999   100.0  ($45,646)   (7.8) ($8,102)   (1.5)


    Note:
    (1) Amounts in New Taiwan dollars have been translated into U.S. dollars
        at the rate of NT$32.2 as of September 30, 2009.
    (2) Certain prior period balances have been reclassified to conform to
        the current period presentation.



     TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
              Unaudited Consolidated Condensed Income Statements
        For the Three Months Ended September 30, 2009, June 30, 2009,
                              September 30, 2008

             Except for Per Share Amounts and Shares Outstanding)

                                              3Q 2009             2Q 2009
                                        USD      NTD      %      NTD      %
    Net Sales                          $2,742  $89,936  100.0  $74,212  100.0
    Cost of Sales                      (1,435) (47,078) (52.3) (39,916) (53.8)
      Gross Profit                      1,307   42,858   47.7   34,296   46.2
    Operating Expenses
      Research and Development
       Expenses                          (189)  (6,202)  (6.9)  (5,096)  (6.9)
      General and Administrative
       Expenses                          (108)  (3,541)  (3.9)  (2,881)  (3.8)
      Sales and Marketing Expenses        (35)  (1,131)  (1.3)  (1,192)  (1.6)
    Total Operating Expenses             (332) (10,874) (12.1)  (9,169) (12.3)

         Income from Operations           975   31,984   35.6   25,127   33.9

    Non-Operating Income, Net              16      519    0.5    1,156    1.6
    Investment Gains                       14      454    0.5      106    0.1
    Income before Income Tax            1,005   32,957   36.6   26,389   35.6

    Income Tax Expenses                   (70)  (2,285)  (2.5)  (1,943)  (2.7)

         Net Income                       935   30,672   34.1   24,446   32.9

    Minority Interests                     (3)    (121)  (0.1)      (4)    --

    Net Income Attributable to
     Shareholders of the Parent           932   30,551   34.0   24,442   32.9


    Earnings per Share - Diluted        $0.04    $1.18     --    $0.94     --
    Earnings per ADR - Diluted (2)      $0.18    $5.88     --    $4.71     --

    Weighted Average Outstanding
     Shares - Diluted ('M) (3)             --   25,984     --   25,944     --

    Note:
    (1) Amounts in New Taiwan dollars have been translated into U.S.
        dollars at the weighted average rate of NTD32.797 for the third
        quarter of 2009.
    (2) 1 ADR equals 5 ordinary shares.
    (3) Total diluted weighted average outstanding shares were 26,070M
        shares for 3Q08 after the retroactive adjustments for stock dividends



     TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
              Unaudited Consolidated Condensed Income Statements
        For the Three Months Ended September 30, 2009, June 30, 2009,
                              September 30, 2008

       Except for Per Share Amounts and Shares Outstanding) (Continued)

                                 3Q 2008            QoQ             YoY
                                NTD      %     Amount     %     Amount     %
    Net Sales                 $92,979  100.0  $15,724    21.2  ($3,043)  (3.3)
    Cost of Sales             (49,885) (53.7)  (7,162)   17.9    2,807   (5.6)
      Gross Profit             43,094   46.3    8,562    25.0     (236)  (0.5)
    Operating Expenses
      Research and
       Development Expenses    (5,981)  (6.4)  (1,106)   21.7     (221)   3.7
      General and
       Administrative
       Expenses                (2,979)  (3.2)    (660)   22.9     (562)  18.9
      Sales and Marketing
       Expenses                (1,217)  (1.3)      61    (5.1)      86   (7.0)
    Total Operating Expenses  (10,177) (10.9)  (1,705)   18.6     (697)   6.9

       Income from Operations  32,917   35.4    6,857    27.3     (933)  (2.8)

    Non-Operating Income, Net   1,328    1.4     (637)  (55.1)    (809) (60.9)
    Investment Gains              185    0.2      348   328.8      269  144.5
    Income before Income Tax   34,430   37.0    6,568    24.9   (1,473)  (4.3)

    Income Tax Expenses        (3,658)  (3.9)    (342)   17.6    1,373  (37.5)

       Net Income              30,772   33.1    6,226    25.5     (100)  (0.3)

    Minority Interests           (198)  (0.2)    (117) 3055.4       77  (38.8)

    Net Income Attributable
     to Shareholders of
     the Parent                30,574   32.9    6,109    25.0      (23)  (0.1)

    Earnings per Share -
     Diluted                    $1.17     --    $0.24    24.8    $0.01    0.3
    Earnings per ADR -
     Diluted (2)                $5.86     --    $1.17    24.8    $0.02    0.3

    Weighted Average
     Outstanding Shares -
     Diluted ('M) (3)          26,070     --       --      --      --      --


    Note:
    (1) Amounts in New Taiwan dollars have been translated into U.S.
        dollars at the weighted average rate of NTD32.797 for the third
        quarter of 2009.
    (2) 1 ADR equals 5 ordinary shares.
    (3) Total diluted weighted average outstanding shares were 26,070M
        shares for 3Q08 after the retroactive adjustments for stock dividends



     TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
               Audited Consolidated Condensed Income Statements
            For the Nine Months Ended September 30, 2009 and 2008

             Except for Per Share Amounts and Shares Outstanding)

                                      For the Nine Months Ended September 30
                                              2009                 2008
                                      USD      NTD       %      NTD       %
    Net Sales                        $6,148  $203,648  100.0  $268,595  100.0
    Cost of Sales                    (3,593) (119,014) (58.4) (147,041) (54.7)
      Gross Profit                    2,555    84,634   41.6   121,554   45.3
    Operating Expenses
      Research and Development
       Expenses                        (454)  (15,026)  (7.4)  (16,655)  (6.2)
      General and Administrative
       Expenses                        (242)   (8,017)  (4.0)   (8,811)  (3.3)
      Sales and Marketing Expenses      (98)   (3,271)  (1.6)   (3,674)  (1.4)
    Total Operating Expenses           (794)  (26,314) (13.0)  (29,140) (10.9)

         Income from Operations       1,761    58,320   28.6    92,414   34.4

    Non-Operating Income, Net            61     2,028    1.0     4,923    1.8
    Investment Gains (Losses)            (8)     (253)  (0.1)    1,042    0.4
    Income before Income Tax          1,814    60,095   29.5    98,379   36.6

    Income Tax Expenses                (105)   (3,489)  (1.7)  (10,497)  (3.9)

         Net Income                   1,709    56,606   27.8    87,882   32.7

    Minority Interests                   (2)      (54)    --      (395)  (0.1)

    Net Income Attributable to
     Shareholders of the Parent       1,707    56,552   27.8    87,487   32.6

    Earnings per Share - Diluted      $0.07     $2.18     --     $3.33     --
    Earnings per ADR - Diluted (2)    $0.33    $10.88     --    $16.64     --

    Weighted Average Outstanding
     Shares - Diluted ('M) (3)           --    25,981     --    26,290     --

    Note:
    (1) Amounts in New Taiwan dollars have been translated into U.S. dollars
        at the weighted average rate of NTD 33.122 for the nine months ended
        September 30, 2009.
    (2) 1 ADR equals 5 ordinary shares.
    (3) Total diluted weighted average outstanding shares were 26,290M
        shares for the nine months ended September 30, 2008 after the
        retroactive adjustment for stock dividends.



      TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
                Audited Consolidated Condensed Income Statements
             For the Nine Months Ended September 30, 2009 and 2008

 (Expressed in Millions of New Taiwan Dollars (NTD) and U.S. Dollars (USD) (1)

              Except for Per Share Amounts and Shares Outstanding) (Continued)

                                  For the Nine Months Ended September 30
                                                            YoY
                                                     Amount       %
    Net Sales                                      ($64,947)    (24.2)
    Cost of Sales                                    28,027     (19.1)
      Gross Profit                                  (36,920)    (30.4)
    Operating Expenses
      Research and Development Expenses               1,629      (9.8)
      General and Administrative Expenses               794      (9.0)
      Sales and Marketing Expenses                      403     (11.0)
    Total Operating Expenses                          2,826      (9.7)

         Income from Operations                     (34,094)    (36.9)

    Non-Operating Income, Net                        (2,895)     (58.8)
    Investment Gains (Losses)                        (1,295)    (124.3)
    Income before Income Tax                        (38,284)     (38.9)

    Income Tax Expenses                               7,008      (66.8)

         Net Income                                 (31,276)     (35.6)

    Minority Interests                                  341      (86.3)

    Net Income Attributable to
     Shareholders of the Parent                     (30,935)     (35.4)

    Earnings per Share - Diluted                     ($1.15)     (34.6)
    Earnings per ADR - Diluted (2)                   ($5.76)     (34.6)

    Weighted Average Outstanding Shares -
     Diluted ('M) (3)                                    --         --

    Note:
    (1) Amounts in New Taiwan dollars have been translated into U.S. dollars
        at the weighted average rate of NTD 33.122 for the nine months ended
        September 30, 2009.
    (2) 1 ADR equals 5 ordinary shares.
    (3) Total diluted weighted average outstanding shares were 26,290M
        shares for the nine months ended September 30, 2008 after the
        retroactive adjustment for stock dividends.



     TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED AND SUBSIDIARIES
               Consolidated Condensed Statements of Cash Flows
     For the Six Months Ended September 30, 2009 and for the Three Months

                             Nine Months 2009   3Q 2009    2Q 2009    3Q 2008
                                (unaudited)   (unaudited)(unaudited)(unaudited)
                                USD       NTD      NTD       NTD        NTD
    Cash Flows from Operating
     Activities:
        Net Income            $1,707   $56,552   $30,551   $24,442   $30,574
        Net Income
         Attributable to
         Minority Interest         2        54       121         4       198
        Depreciation &
         Amortization          1,828    60,537    20,001    20,053    20,686
        Deferred Income Tax      (34)   (1,122)     (426)      697       410
        Equity in Losses
         (Earnings) of Equity
         Method Investees,
         Net                       8       253      (454)     (106)     (185)
        Changes in Working
         Capital & Others       (553)  (18,307)   (3,138)  (20,566)    4,220
        Net Cash Provided by
         Operating Activities  2,958    97,967    46,655    24,524    55,903

    Cash Flows from Investing
     Activities:
        Acquisitions of:
           Marketable
            Financial
            Instruments         (937)  (31,046)  (20,827)     (968)  (40,201)
           Investments
            Accounted for
            Using Equity
            Method                (1)      (32)      (32)       --       (55)
           Property, Plant
            and Equipment     (1,361)  (45,070)  (32,038)   (7,415)  (10,378)
           Financial Assets
            Carried at Cost       (8)     (271)     (139)      (48)      (87)
        Proceeds from
         Disposal or maturity of:
           Marketable
            Financial
            Instruments          833    27,591     1,886     2,651    22,126
           Property, Plant
            and Equipment         --         7         2         3       140
           Financial Assets
            Carried at Cost        3        94        19        75        --
        Others                   (20)     (640)     (381)     (291)    1,930
        Net Cash Used In
         Investing Activities (1,491)  (49,367)  (51,510)   (5,993)  (26,525)

    Cash Flows from Financing
     Activities:
        Decrease in Guarantee
         Deposits                (10)     (327)      (77)      (86)      (83)
        Proceeds from
         Exercise of Stock
         Options                   6       191       162        14        51
        Bonus Paid to
         Directors and
         Supervisors              --        --        --        --      (177)
        Repayment of Long-
         Term Bonds Payable     (242)   (8,000)       --        --        --
        Cash Dividends Paid
         for Common Stock     (2,321)  (76,876)  (76,876)       --   (76,779)
        Repurchase of
         Treasury Stock           --        --        --        --   (23,812)
        Cash Bonus Paid to
         Employees                --        --        --        --    (3,940)
        Others                    (5)     (182)     (191)     (265)     (222)
        Net Cash Used in
         Financing Activities (2,572)  (85,194)  (76,982)     (337) (104,962)

    Net Increase (Decrease)
     in Cash and Cash
     Equivalents              (1,105)  (36,594)  (81,837)   18,194   (75,584)

    Effect of Exchange Rate
     Changes and Others          (33)   (1,085)     (745)   (1,939)    2,684

    Cash and Cash Equivalents
     at Beginning of Period    5,876   194,614   239,517   223,262   185,346

    Cash and Cash Equivalents
     at End of Period         $4,738  $156,935  $156,935  $239,517  $112,446

    Note:
    (1) Amounts in New Taiwan dollars have been translated into U.S. dollars
        at the weighted average rate of NTD33.122 for the nine months ended
        September 30, 2009.

    CONTACT

     Elizabeth Sun
     Investor Relations Division
     TSMC
     Email: invest@tsmc.com
     Tel:   +886-3-568-2085

Under the new alliance, SVTC and TSMC will work with developers to bring to market new applications in emerging technologies such as micro-electro-mechanical systems (MEMS), biochips and other devices incorporating new materials and novel structures. The agreement is the latest in a series of collaborations between the two companies.

Joseph Bronson, SVTC's CEO, said, "The partnership will seek out and work with 'More than Moore' customers whose ideas or products are based on silicon technologies, but may not necessarily scale with Moore's Law."

"There are a number of promising applications that could inspire entire new industries, but many lack a clear path to commercialization and high-volume manufacturing," said Bronson. "Our technology commercialization agreement with TSMC will enable the world's most promising innovators to develop new products and to bring the best of these new devices into volume production."

C.C. Wei, TSMC senior vice president, Mainstream Technology Business, added, "TSMC has a strong tradition of working with innovators to develop applications that change the technology landscape. Our relationship with SVTC creates a highly effective path to bring innovative products built on mainstream process technologies to market quickly."

The SVTC Fast-Transfer� process provides solutions that drive yields for products transferred to TSMC to achieve a fast revenue ramp.

Under the agreement, TSMC and SVTC will bring new products from concept to volume production. Typically, companies with conceptual or undeveloped products will utilize SVTC for development and commercialization of new technologies. As product demands increase, SVTC will transfer the customers' processes to TSMC for volume manufacturing. SVTC and TSMC will co-market the services emerging from the new agreement.

About SVTC Technologies

SVTC Technologies speeds the development and commercialization of innovative silicon-based technologies and products, cost-effectively and in an IP-secure manner. Through facilities in San Jose, California, and Austin, Texas, SVTC serves customers in rapidly growing markets such as novel memory, novel transistors, logic, MEMS, biotechnology, images sensors and photovoltaics. SVTC offers a suite of leading-edge equipment and services, including full-scale 8-inch and 12-inch process capabilities, advanced CMOS equipment, analytical services, development support tools and commercialization services. SVTC is co-owned by Oak Hill Capital Management and Tallwood Venture Capital, along with management. SVTC Technologies is an equal opportunity employer. More information can be found at www.svtc.com.

 
SVTC Contact:
Ashwin Kumar
Email Contact
1-512-356-2312

This collaborative effort combines Fujitsu Microelectronics' expertise and strength in advanced high-speed process and low-power design technologies with TSMC's expertise and strength in power-efficient high- performance logic/SoC process and leading-edge technology platform that is part of the Open Innovation Platform(TM) from TSMC. Extending the collaboration to 28nm will provide the opportunity for both companies to capitalize on a competitive and high-performance 28nm technology based on TSMC's 28nm technology portfolio that includes high-performance and low-power applications.

The two companies are also discussing possibilities for collaborating on advanced packaging that could include joint developments that combine Fujitsu Microelectronics' strengths in high-performance lead-free and ultra-high-pin count packaging technologies, with TSMC's strength in chip-package integration and advanced Cu/ELK interconnect.

"We are rapidly progressing in our previously-announced collaboration with TSMC on 40nm process technology, with several product designs in progress at present," said Haruyoshi Yagi, Corporate Senior Vice President of Fujitsu Microelectronics Limited. "With this further agreement with TSMC on 28nm high-performance process technology development and production, we combine both companies' strengths to create greater value for our customers, and will further drive the growth of businesses for TSMC and Fujitsu's ASIC and ASSP (*1) core products."

"Fujitsu Microelectronics selected TSMC as a partner based in part on TSMC's unsurpassed record of developing and ramping advanced technologies. The agreement today is also a vote of confidence in TSMC's technology platforms that include design related considerations such as design kits, design flows, TSMC and 3rd party IP; robust device related documentation, processes technology excellence and backend assembly and test capabilities," said Jason Chen, Vice President, Worldwide Sales and Marketing, TSMC.

Notes:

*1: ASIC and ASSP

ASIC: Application specific IC. Customized ICs for specific applications (customers).

ASSP: Application specific standard product. IC products for specific applications, such as image processing and network-related processing.

Fujitsu Microelectronics Customer Contact:

Fujitsu Microelectronics Limited

Business Management Division

Inquiries:www.tsmc.com.

All company or product names referenced herein are trademarks or registered trademarks of their respective owners. Information provided in this press release is accurate at time of publication and is subject to change without advance notice.

"Achieving 64Mb SRAM yield across all three 28nm process nodes is striking. It is particularly noteworthy because this achievement demonstrates the manufacturing benefits of the gate-last approach that we developed for the two TSMC 28nm high-k metal gate processes," explained Dr. Jack Sun, vice president, Research and Development at TSMC.

"This accomplishment underscores TSMC's process technology capability and value in 28nm. It shows TSMC is not only able to extend conventional SiON technology to 28nm, but is also able to deliver the right 28nm HKMG technology at the same time," explained Dr. Mark Liu, senior vice president, Advanced Technology Business at TSMC.

The TSMC 28nm development and ramp-up has remained on track since the announcement made in September of 2008. The 28LP process is expected to enter risk production at the end of Q1 of 2010, followed closely by the 28HP risk production at the end of Q2 and the 28HPL risk production in Q3.

The 28nm LP process will serve as a fast time-to-market and low cost technology ideal for cellular and mobile applications. The 28nm HP process is expected to support devices such as CPUs, GPUs, Chipsets, FPGAs, networking, video game consoles, and mobile computing applications that are performance demanding. The 28nm HPL process features low power, low leakage, and medium-high performance. It is aimed to support applications such as cell phone, smart netbook, wireless communication and portable consumer electronics that demand low leakage.

All 28nm TSMC processes feature a comprehensive design infrastructure based on the company's Open Innovation Platform(TM) to extend the power of the technology to a broad range of differentiating products.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

TSMC's 28nm development and ramp has remained on schedule since the company announced the technology in September 2008. The new process' risk production follows the HKMG high performance (HP) process by one quarter and the low power (LP) silicon oxynitride (SiON) process by two quarters. Risk production for the 28nm low power (LP) SiON process is scheduled for the end of first quarter of 2010, while risk production for the 28nm HP process is expected at the end of second quarter, 2010.

The 28nm HPL (low power with HKMG) process is a derivative of TSMC's high performance HKMG technology and features low power, low leakage, and medium-high performance on a gate-last approach. It supports low leakage applications such as cell phone, smart netbook, wireless communication and portable consumer electronics.

The 28nm HPL process comes complete with comprehensive device support and is considered suitable as a SoC platform for general market applications. It is differentiated from the 28LP technology, which is positioned for cellular and handheld applications where lower cost and faster time-to-market from an evolutionary SiON process is most attractive.

The 28nm HP process, announced as part of the September 2008 introduction, is also built on a gate-last approach and supports performance driven devices such as CPUs, GPUs, Chipsets, FPGAs, video game console and mobile computing applications.

"We developed a gate-last approach for TSMC's 28nm high-k metal gate family that is superior in terms of transistor characteristics, high end and low end performance upside, and manufacturability," said Dr. Jack Sun, vice president, Research and Development, TSMC.

"TSMC has been working with customers over a significant period of time to develop high-k metal gate technologies for low power applications. The addition of the 28nm HPL to the 28nm technology family, combined with the 28LP and 28HP, means that TSMC now provides the most comprehensive 28nm technology portfolio," said Dr. Mark Liu, senior vice president, Advanced Technology Business, TSMC.

To fully utilize the power of the 28nm technology family for a broad range of differentiating products, TSMC is working closely with customers and ecosystem partners to build a comprehensive design infrastructure based on the company's recently unveiled Open Innovation Platform(TM). The Open Innovation Platform(TM), hosted by TSMC, is open to TSMC customers and partners.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers, including capacity from two advanced 12-inch - GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

TOKYO and HSIN-CHU, Taiwan, April 30 /PRNewswire-FirstCall/ -- Fujitsu Microelectronics Limited and Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that they will collaborate on leading-edge process technology production for the manufacturing of Fujitsu Microelectronics' products. Under an agreement between the companies, Fujitsu Microelectronics will expand its 40-nanometer generation logic IC business with production at TSMC's fabs.

The collaborative effort will bring together Fujitsu Microelectronics' IC design technologies, leading edge imaging and communication intellectual property (IP), and high-quality technical support to customers, especially in Japan, with TSMC's foundry-leading process technology and capability. This advanced technology engagement should enable both companies to create new business for themselves and for their prospective customers.

The two companies also announced that they intend to initiate discussions on collaborative development of high-performance process technologies for 28-nanometer and below for Fujitsu Microelectronics' product applications.

"From the aspect of its advanced process technologies and large-scale production capacity, TSMC is the most attractive semiconductor foundry partner," said Haruki Okada, president of Fujitsu Microelectronics Limited. "By continuing to create our advantages in fine-pitch process technologies through this partnership, we can further grow our ASIC and ASSP (*1) product businesses."

"Fujitsu Microelectronics is clearly a world-class leader in advanced high-speed and low-power technologies, design engineering, and differentiated IP. Given TSMC's long-standing commitment to Japan's semiconductor market, and our on-going investment and dedication to advanced process technology, our collaboration with Fujitsu Microelectronics represents a new best-in-class solution for many system companies," said Dr. Rick Tsai, president & CEO of TSMC.

Notes:

*1: ASIC and ASSP

ASIC: Application specific IC. Customized ICs for specific applications (customers).

ASSP: Application specific standard products. IC products for specific applications, such as image processing and network-related processing.

    Press Contacts:

    Fujitsu Limited
    Public and Investor Relations Division
    Inquiries:
    https://www-s.fujitsu.com/global/news/contacts/inquiries/index.html

    Taiwan Semiconductor Manufacturing Company, Ltd.
    Corporate Public Relations
    Michael Kramer
    Phone 886-3-563-6688 Ext. 712-6216

    TSMC Japan Limited
    Press Center
    c/o: E&E, Inc.
    Phone 81-422-30-8800

Fujitsu Microelectronics Customer Inquiries:

Management Promotion Office

Fujitsu Microelectronics Limited

https://www-s.fujitsu.com/global/ser...

About Fujitsu Microelectronics Limited (FML)

Fujitsu Microelectronics Limited designs and manufactures semiconductors, providing highly reliable, optimal solutions and support to meet the varying needs of its customers. Products and services include ASICs/COT, ASSPs, power management ICs, and flash microcontrollers, with wide-ranging expertise focusing on imaging, wireless, automotive and security applications. Fujitsu Microelectronics also drives power efficiency and environmental initiatives. Headquartered in Tokyo, Fujitsu Microelectronics Limited was established as a subsidiary of Fujitsu Limited on March 21, 2008. Through its global sales and development network, with sites in Japan and throughout Asia, Europe, and the Americas, Fujitsu Microelectronics offers semiconductor solutions to the global marketplace. For more information: http://jp.fujitsu.com/fml/en/

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit www.tsmc.com.

All company or product names referenced herein are trademarks or registered trademarks of their respective owners. Information provided in this press release is accurate at time of publication and is subject to change without advance notice.

The complete MS/RF RDK -- with documentation, PLL circuit example, and validated flow tutorial -- will be available on TSMC Online at http://online.tsmc.com in Q2 2009 to selected TSMC 65-nanometer customers worldwide, giving designers an opportunity to learn about the integrated solution. Both Cadence and TSMC plan to demonstrate aspects of the flow at the TSMC Technology Symposium in San Jose, Calif., in April, the CDNLive! EMEA user conference in Munich, Germany, in May, and the Design Automation Conference (DAC) in San Francisco in July.

"This MS/RF Reference Design Kit is a perfect example of how TSMC and Cadence continue to collaborate to help our mutual customers get to market faster," said ST Juang, senior director of Design Infrastructure Marketing at TSMC. "With the challenges associated with today's complex RF mixed-signal designs, I'm sure this reference flow and all the supporting materials and examples can be of great aid to many of our customers."

"Cadence Virtuoso technology is a hub within the greater ecosystem of custom and mixed-signal design," said Bill Heiser, group director for Solutions Marketing at Cadence. "Our commitment of working closely with foundry partners like TSMC strengthens that ecosystem to the benefit of our joint customers tackling the toughest mixed-signal challenges."

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Cadence, Spectre and Virtuoso are registered trademarks and the Cadence logo is a trademark of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

     For more information, please contact:
     Dean Solov
     Cadence Design Systems, Inc.
     408-944-7226
     dsolov@cadence.com
      

The new RDK helps resolve the long-standing challenge of full chip verification of SoCs with both analog, mixed signal and digital content. It enables a top-down MS/RF design methodology and a system-level simulation flow to reduce design cycle time and encourage IP reuse. The reference design in the RDK is an advanced Fractional-N Phase Locked Loop (PLL) developed in TSMC 65nm RF process technology and fully validated in silicon with accurate correlation between simulation results and silicon measurements.

The RDK includes a video tutorial and step-by-step design manual; the complete PLL reference design database with schematics, layouts, and simulation test benches; a design flow and methodology introduction; silicon test reports, release notes specifying design tool and version requirements and a TSMC 65nm process design kit (PDK).

"Enhancing innovation in the MS/RF design space is one key initiative of the TSMC Open Innovation Platform," explains ST Juang, senior director of Design Infrastructure Marketing at TSMC. "The TSMC MS/RF RDK delivers a new level of confidence to our customers that complex MS/RF blocks can be created and accurately verified in the context of full chip RF SoCs, and taped out with high quality, thus ensuring first-pass silicon success. We continue to collaborate with our ecosystem partners to enhance the features and capabilities of the RDK to address emerging MS/RF design challenges."

Pricing and Availability

The TSMC 65nm MS/RF RDK is available now in limited release and at no charge to selective customers during Q2 2009. General release to other customers is targeted for Q3 2009. Customers may access the MS/RF RDK at the TSMC Online customer design portal http://online.tsmc.com/online/ or contact their local sales and support representatives for details.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch - GigaFabs (TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

Integrated Sign-Off Flow is an automated RTL to GDSII chip implementation flow that tightly integrates all process-specific items including pre-qualified library and IP, selected EDA tools, production-quality flow, advanced design methodology, and TSMC foundry technology files that have been proven and refined over hundreds of applications. With embedded TSMC design know-how and sign-off recommendations, the new flow utilizes pre-qualified EDA toolsets from multiple vendors and leverages industry-proven TSMC Reference Flow methodology.

The Integrated Sign-Off Flow, targeting initially at 65nm process node with planned extensions into other process technology nodes, supports advanced design techniques for low power and design-for-manufacturability (DFM). It includes executable scripts for complete flow automation and EDA tool queuing system support. With validated libraries and IP, qualified EDA tools, full set of proper technology files, and automated installation scripts, Integrated Sign-Off Flow significantly shortens the time it normally takes design team to set up the design environment and flow before starting the design project. The built-in advanced design methodology and proven sign-off scripts further shortens the design cycle, and improves tape-out quality.

"The ability to reduce design setup effort and design cycle time clearly result in design cost reduction, and this is one of the key objectives of the recently launched TSMC Open Innovation Platform(TM)," explains ST Juang, senior director of Design Infrastructure Marketing at TSMC. "If we can lower design costs, we can help eliminate a major source of profit erosion that impacts all ecosystem parties, including our customers, our EDA partners and, of course, our own foundry services. This Integrated Sign-Off Flow represents a highly collaborative effort to increase reuse and reduce engineering waste."

Pricing and Availability

The TSMC 65nm Integrated Sign-Off Flow is available now in limited release and at no charge to selective customers during Q2 2009. General release to other customers is targeted for Q3 2009. Customers may access the Integrated Sign-Off Flow at the TSMC Online customer design portal http://online.tsmc.com/online/ or contact their local sales and support representatives for details.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch - GigaFabs(TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

The evaluation of potential technologies - X-ray vs. opto-acoustic - "We found that X-ray reflectometry (XRR) demonstrated the required capability. Among the evaluated X-ray based tools, the JVX 6200 for its superior precision in the sub-angstrom range and for its lower total cost of ownership"

Isaac Mazor, Jordan Valley's President and CEO commented, "We are pleased and proud with the outcome of this evaluation. We see TSMC not only as a valued strategic customer, but also as a technological leader. TSMC's decision is recognition of XRR as the technology-of-choice for copper layer thickness metrology in our products. We are looking forward to continue supporting their metrology needs as they evolve."

About X-ray Reflectometry

X-ray reflectometry is a no-contact, non-distractive, surface-sensitive technique that delivers precise and accurate characterization and metrology of thin films and multi-layer stacks. The technique delivers thickness, density and roughness data by analyzing the reflection vs. angle, and interference patterns of X-rays that reflect off the interfaces.

XRR is capable of analyzing single and multiple thin films layers from 1 to 500 nm thick. Jordan Valley's advanced XRR technology allows measurements on production wafers and offers superior throughput of over 30 WPH (17 points on 300mm wafer).

About TSMC

Established in 1987, Taiwan Semiconductor Manufacturing Company (TSMC) is the world's largest dedicated semiconductor foundry. As the founder and leader of the dedicated foundry business, TSMC has built its reputation on offering advanced wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services to its customers. The company's total managed capacity exceeds 8 million 8-inch equivalent wafers in 2007, while its revenues represent some 50% of the dedicated foundry segment in the semiconductor industry.

About Jordan Valley

Jordan Valley Semiconductors, Ltd. Is the leader of X-ray metrology for advanced semiconductors fabs. We provide semiconductor metrology solutions for thin films front end of line (FEOL) and back end of line (BEOL) based on novel, rapid and non-destructive x-ray technology. We offer a comprehensive family of solutions based on advanced X-Ray Reflectivity (XRR), X-Ray Fluorescence (XRF), X-Ray Fluorescence (XRF), Small-angle X-ray scattering (SAXS) and High Resolution X-Ray Diffractometry (HR XRD). These tools are fully automated, production ready, and ideal for both blanket and patterned wafers. Jordan Valley's x-ray technology enables accurate and precise characterization of all film types metals and dielectrics - including single and multi-layer stacks, high k, metal gate, low k materials. It is also used for strain engineering (SiGe, Si:C) and is used for advanced processes control (<45nm, 32nm) worldwide. Research and development are based in Migdal Ha'Emek, Israel. Manufacturing is based primarily in Migdal Ha'Emek with a secondary location in Durham, United Kingdom. Applications engineering, customer support services, sales and marketing are located in Austin, Texas. http://www.jvsemi.com. Jordan Valley products are used in production by leading semiconductor manufacturers worldwide.

Jordan Valley's primary shareholders are Clal Industries and Investments Ltd. (TASE:CII), Elron Electronic Industries Ltd. (Nasdaq: ELRN - News).

HSIN-CHU, Taiwan, R.O.C., March 31 /PRNewswire/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330 - News; NYSE: TSM - News) today announced that it has qualified its new 0.18-micron embedded flash (embFlash) process technology family that targets a wide range of applications. The new family includes a baseline 1.8 to 5 volt standard process, an ultra-low leakage process, and specific automotive-qualified embedded Flash IP.

"This extended featured-rich 0.18-micron embedded flash family demonstrates the emphasis that TSMC places on serving the analog, power sensitive and automotive markets. The breadth of applications that this family targets is unprecedented and reflects the growing market demand for technology that is both broad in scope, yet precise in its application," said George Liu, director, Mainstream Technology Business.

The baseline 0.18-micron 1.8V/5V embFlash process supports enhanced analog performance and traditional 5 volt I/O interface applications. The true 5 volt I/Os achieve better performance in a smaller footprint than similar 5 volt I/Os built on higher voltage devices.

The process features a single low voltage Flash IP that operates fully functions at 1.8 volts. Several Flash IP macros and a customization service are available now. The new process is ideal for large appliance motor controls on refrigerators, washing machines and air conditioners.

The TSMC 0.18-micron Ultra-Low-Leakage (uLL) embFlash process operates at 1.8V and features a 95% leakage reduction compared to the baseline process. Built upon the uLL devices, CPU, standard cell library, and SRAM can save up to 85%, 90%, and 95% standby current respectively compared to the baseline process. A low power Flash IP supports up to 80% lower standby current and 60% lower active current with the Flash IP compiler expected to be available in Q3 this year.

The uLL process is particularly suitable for power-sensitive and portable devices.

The High-Data-Retention (HDR) member of the 0.18-micron embedded flash family operates at 1.8V/3.3V and has been qualified for automotive quality requirement AEC-Q100. Extensive test methodology has also been developed to meet the stringent automotive ppm requirements in powertrain, security systems, body systems, and infotainment.

The TSMC's 0.18-micron process requires only seven mask layers to implement the embedded flash features and is now ready for production in Fab 3.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 exceeded 9 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch - GigaFabs (TM), four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

Custom and analog design productivity has become a major issue at advanced process nodes, and PDK development and availability is a key bottleneck in new process technology adoption. The objectives of the collaboration are to reduce the time and effort needed for nanometer PDK development, to better optimize PDK devices for ultra-complex design rules, to facilitate creation of sophisticated devices such as spiral inductors and differential pairs, and to optimize run-time performance of PDK devices in system-on-chip (SoC) designs.

“Ciranova’s PyCell technology and advanced architecture provides native support of interoperable PDKs, which are an integral part of our Open Innovation Platform™, to facilitate and accelerate designers' innovations in analog and full custom designs,” said Fu-Chieh Hsu, vice president of Design & Technology Platform at TSMC. “We are collaborating with Ciranova to develop the industry’s first interoperable PDK, a single PDK that supports multiple design environments. We continue to work with Ciranova and the interoperable PDK Library (IPL) Alliance to accelerate the deployment and adoption of interoperable PDK across the industry.”

“Every leading-edge SoC company in the world is under pressure to ramp more advanced design kits faster, despite limited time and resources,” said Eric Filseth, CEO of Ciranova. “TSMC is the foundry gold standard, and we’re excited to be working with them to push the state of the art of PDKs forward.”

About PyCells

Ciranova interoperable PyCells are a next-generation approach to parameterized cell development for custom IC design. Unlike older PCell approaches, the PyCell architecture is design-rule aware and generates DRC-correct device geometry automatically; the result is a major reduction in user coding effort, particularly at nanometer process nodes. PyCells run in any OpenAccess-capable EDA tool, and were selected as the physical foundation for the Interoperable PDK Alliance at http://www.iplnow.com. The PyCell Studio™ development system is a free download from http://www.ciranova.com.

About TSMC

TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company’s total managed capacity in 2008 exceeded 9.3 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch - GIGAFABs ™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.

About Ciranova

Ciranova is an electronic design automation (EDA) company focused on very large productivity improvements in analog, RF and mixed-signal IC physical design. Complementary to existing design flows, Ciranova technology dramatically reduces the time and effort needed to develop device-level layout at both the circuit and PDK levels, while delivering results of equal or better quality than purely handcrafted methods. Ciranova supports the Si2 OpenAccess database. For more information please visit http://www.ciranova.com.

TSMC
Wendy Matthews, +1-408-382-8030
wmatthews@tsmc.com
or
Ciranova, Inc.
Dave Millman, +1-408-553-608
dave@ciranova.com