System, PCB, & Package Design

BoardSurfers: Training Insights: What’s New in the Allegro PCB Editor Basic Techniques Course

anandd — Tue, 20 Sep 2022 14:32:00 GMT

The Allegro PCB Editor Basic Techniques course provides all the essential training required to start working with Allegro® PCB Editor. The course covers all the design tasks, including padstack and symbol creation, logic import, constraints setup...(read more)

Modern Thermal Analysis Overcomes Complex Electronic Design Issues

Sherry Hess — Tue, 13 Sep 2022 14:53:00 GMT

By combining finite element analysis with computational fluid dynamics, designers can perform complete thermal system analysis using a single tool.(read more)

BoardSurfers: Managing Design Constraints Efficiently Using Constraint Sets

Dhruv Prakash — Wed, 07 Sep 2022 13:44:00 GMT

A constraint is a user-defined property, or a rule, applied to a physical object, such as a net, pin, or via in a design. There are a number of constraints that can be applied to an object based on its type and behavior. For example, you can define t...(read more)

This Month in IDA

Sherry Hess — Tue, 06 Sep 2022 15:17:00 GMT

IDA activities in August showcased two video interviews with David Maliniak of Microwaves & RF magazine. New posts, datasheets, application notes and white papers highlight multiphysics analysis spanning SI, PI, thermal, EM and microwave analysis domains are also featured.(read more)

Quickchat Video Interview: Introducing Cadence Optimality and OnCloud for Systems Analysis and Signoff

Sherry Hess — Tue, 30 Aug 2022 15:05:00 GMT

Microwaves & RF's David Maliniak interviews Sherry Hess of Cadence about recently announced products of Optimality and OnCloud.(read more)

BoardSurfers: Managing Silkscreen Data Using Allegro 3D Canvas

anandd — Wed, 24 Aug 2022 13:30:00 GMT

The silkscreen layer plays a crucial role in the assembly, repair, and testing of a PCB. You can add a variety of information to this layer, such as the location of the components, polarity, component orientation, on-off switches, LEDs, and testpoint...(read more)

Sigrity and Systems Analysis 2022.1 HF2 Release Now Available

SigrityReleaseTeam — Tue, 23 Aug 2022 17:45:00 GMT

The Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2022.1 HF2 release is now available for download at Cadence Downloads. For the list of CCRs fixed in the 2022.1 HF2 release, see the README.txt file in the installation hierarchy.(read more)

Clarity Encrypted Connectors!

Sherry Hess — Mon, 22 Aug 2022 00:25:00 GMT

Cadence Clarity 3D Solver supports encrypted component models! Using this functionality, vendors can supply their 3D components, such as connectors, to end customers without revealing the physical IP of these designs. The first connector vendor to take advantage of this functionality is Japan Aviation Electronics (JAE),(read more)

BoardSurfers: Training Insights: User Interface Enhancements for Allegro Layout Editors

ACat299612 — Fri, 19 Aug 2022 12:03:00 GMT

If you have seen any images or demonstrations of the 17.4-2019 release, the GUI may look ...(read more)

Japan Aviation Electronics is First to Support IP Protected Models for Cadence Clarity 3D Solver

Sigrity — Tue, 16 Aug 2022 04:08:00 GMT

With the latest release (Sigrity and Systems Analysis 2022.1 HF2) of Clarity 3D Solver, support for encrypted component models is now available. With this functionality, vendors that supply 3D components, such as connectors, can now merge their...(read more)

Overcoming Thermal Challenges in Modern Electronic Design

Sherry Hess — Tue, 09 Aug 2022 14:24:00 GMT

Melika Roshandell talks with David Malinak in a Microwaves & RF QuickChat video about the thermal challenges in today’s complex electronic designs and how the Celsius solver uniquely addresses them.(read more)

This Month in IDA

Sherry Hess — Mon, 08 Aug 2022 02:55:00 GMT

IDA activities in July included an endorsement from X-Fab for EMX as well as multiple multiphysics blog posts spanning SI, PI, thermal, EM and microwave analysis domains.(read more)

Cadence at IMS 2022

StandingWaves — Tue, 02 Aug 2022 01:49:00 GMT

RF Design Solutions for Next-Generation Products The International Microwave Symposium (IMS2022), otherwise known as Microwave Week, was recently held (June 19-24) at the Denver Convention center, returning to its long-standing g...(read more)

X-FAB's Innovative Communication and Automotive Designs: Powered by Cadence EMX Planar 3D Solver

Sherry Hess — Sun, 31 Jul 2022 17:01:00 GMT

Using the EMX solver, X-FAB design engineers can efficiently develop next-generation RF technology for the latest communication standards (including sub-6GHz 5G, mmWave, UWB, etc.), which are enabling technologies for communications and electric vehicle (EV) wireless applications. (read more)

SI/PI Simulation and Measurement Correlation Forum

Maxwell86 — Thu, 28 Jul 2022 04:13:00 GMT

Join this insightful on-demand webinar event "SI/PI Simulation and Measurement Correlation Forum" available through Signal Integrity Journal that features industry expert presentations ranging from chip to package to complex board designs.(read more)