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		<title>Semiconductor International - Yield Management News</title>
		<link>http://www.semiconductor.net</link>
		<pubDate>Mon, 09 Nov 2009 04:33:45 MST</pubDate>
		<description />
		<language>eng</language>
		<copyright>Copyright 2009 Reed Business Information. Subject to its Terms of Use (http://www.semiconductor.net/info/terms-and-conditions.php)</copyright>
		


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			<title>Co-Design Tools Moving Closer to Goal</title>
			<link>http://www.semiconductor.net/article/356945-Co_Design_Tools_Moving_Closer_to_Goal.php?rssid=20227</link>
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			<pubDate>Tue, 06 Oct 2009 18:08:10 GMT</pubDate>
			<description>As chip/package co-design becomes increasingly complex, design tools must keep pace to ensure...</description>
		</item>
										<item>
			<title>CyberOptics Founder Steven Case Killed in Plane Crash</title>
			<link>http://www.semiconductor.net/article/294851-CyberOptics_Founder_Steven_Case_Killed_in_Plane_Crash.php?rssid=20227</link>
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			<pubDate>Wed, 17 Jun 2009 18:18:57 GMT</pubDate>
			<description>CyberOptics said its chairman and founder Steven Case died Tuesday night when the small plane he...</description>
		</item>
										<item>
			<title>Komatsu Laser Marks on Silicon Surface</title>
			<link>http://www.semiconductor.net/article/277771-Komatsu_Laser_Marks_on_Silicon_Surface.php?rssid=20227</link>
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			<pubDate>Tue, 02 Jun 2009 13:07:00 GMT</pubDate>
			<description>Komatsu Engineering Corp. said it has developed a laser marker that can better identify...</description>
		</item>
										<item>
			<title>Everspin MRAM Cited for Zero Defects</title>
			<link>http://www.semiconductor.net/article/232764-Everspin_MRAM_Cited_for_Zero_Defects.php?rssid=20227</link>
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			<pubDate>Mon, 18 May 2009 14:11:00 GMT</pubDate>
			<description>Everspin Technologies, a venture-backed MRAM manufacturer that spun out of Freescale last year,...</description>
		</item>
										<item>
			<title>Mentor Enhancing Yield Diagnostics Tool</title>
			<link>http://www.semiconductor.net/article/231572-Mentor_Enhancing_Yield_Diagnostics_Tool.php?rssid=20227</link>
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			<pubDate>Wed, 06 May 2009 16:00:00 GMT</pubDate>
			<description>Mentor Graphics is adding more powerful statistical analysis techniques to its yield diagnostics...</description>
		</item>
										<item>
			<title>IMEC Sends Memory DFM Tool to Samsung Electronics</title>
			<link>http://www.semiconductor.net/article/209639-IMEC_Sends_Memory_DFM_Tool_to_Samsung_Electronics.php?rssid=20227</link>
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			<pubDate>Tue, 21 Apr 2009 15:37:00 GMT</pubDate>
			<description>IMEC has transferred its Memory Variability Aware Modeling tool to Samsung Electronics. The...</description>
		</item>
										<item>
			<title>IDMs, Fabless Face Reliability Challenges</title>
			<link>http://www.semiconductor.net/article/204669-IDMs_Fabless_Face_Reliability_Challenges.php?rssid=20227</link>
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			<pubDate>Wed, 15 Apr 2009 15:23:00 GMT</pubDate>
			<description>Managers from Broadcom, Intel and Xilinx are among the invited speakers at the upcoming...</description>
		</item>
										<item>
			<title>3-D Equals Two Generations of Scaling</title>
			<link>http://www.semiconductor.net/article/204956-3_D_Equals_Two_Generations_of_Scaling.php?rssid=20227</link>
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			<pubDate>Thu, 02 Apr 2009 21:26:00 GMT</pubDate>
			<description>North Carolina State Professor Paul Franzon said the need for 3-D ICs is becoming more acute as...</description>
		</item>
										<item>
			<title>Semilab Acquires AMS, QC Solutions</title>
			<link>http://www.semiconductor.net/article/201907-Semilab_Acquires_AMS_QC_Solutions.php?rssid=20227</link>
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			<pubDate>Tue, 31 Mar 2009 15:45:00 GMT</pubDate>
			<description>Semilab (Budapest, Hungary) has formed a Massachusetts division made up of newly acquired...</description>
		</item>
										<item>
			<title>Source-Mask Optimization Continues on Track</title>
			<link>http://www.semiconductor.net/article/197223-Source_Mask_Optimization_Continues_on_Track.php?rssid=20227</link>
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			<pubDate>Fri, 27 Feb 2009 15:49:00 GMT</pubDate>
			<description>IBM and Mentor Graphics provided an update on their effort to develop source-mask optimization...</description>
		</item>
										<item>
			<title>Ziptronix to License 3-D Bonding Technologies</title>
			<link>http://www.semiconductor.net/article/201550-Ziptronix_to_License_3_D_Bonding_Technologies.php?rssid=20227</link>
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			<pubDate>Tue, 03 Feb 2009 14:27:00 GMT</pubDate>
			<description>Ziptronix is crafting licensing strategies for its patented 3-D IC bonding technologies that are...</description>
		</item>
										<item>
			<title>Demand Spikes for Multi-Site Testing</title>
			<link>http://www.semiconductor.net/article/196643-Demand_Spikes_for_Multi_Site_Testing.php?rssid=20227</link>
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			<pubDate>Thu, 22 Jan 2009 14:03:00 GMT</pubDate>
			<description>Multi-site testing of SoC devices is now emerging as a major trend to drive down the cost of...</description>
		</item>
										<item>
			<title>Foundries, High-k on Program at International Reliability Physics Symposium</title>
			<link>http://www.semiconductor.net/article/198598-Foundries_High_k_on_Program_at_International_Reliability_Physics_Symposium.php?rssid=20227</link>
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			<pubDate>Tue, 06 Jan 2009 15:20:00 GMT</pubDate>
			<description>The International Reliability Physics Symposium (IRPS), planned for April 26-30 in Montreal,...</description>
		</item>
										<item>
			<title>TI Blitzes to Improve Fab Productivity</title>
			<link>http://www.semiconductor.net/article/201300-TI_Blitzes_to_Improve_Fab_Productivity.php?rssid=20227</link>
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			<pubDate>Wed, 29 Oct 2008 15:47:00 GMT</pubDate>
			<description>Texas Instruments Inc. has used rapid improvement events, or kaizen blitzes, to sharply improve...</description>
		</item>
										<item>
			<title>ISMI Outlines 450 mm Wafer, NGF Roadmaps</title>
			<link>http://www.semiconductor.net/article/197761-ISMI_Outlines_450_mm_Wafer_NGF_Roadmaps.php?rssid=20227</link>
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			<pubDate>Mon, 27 Oct 2008 15:26:00 GMT</pubDate>
			<description>ISMI managers described progress at the 450 mm wafer Interoperability Test Bed, and described...</description>
		</item>
										<item>
			<title>Despite Losses, Toshiba to Continue Aggressive Investments</title>
			<link>http://www.semiconductor.net/article/200752-Despite_Losses_Toshiba_to_Continue_Aggressive_Investments.php?rssid=20227</link>
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			<pubDate>Wed, 22 Oct 2008 15:49:00 GMT</pubDate>
			<description>In a keynote speech at the ISMI Manufacturing Symposium, Toshiba executive Masakazu Kakumu said...</description>
		</item>
										<item>
			<title>SoftJin Rolls Out Mask Defect Analysis Tool</title>
			<link>http://www.semiconductor.net/article/197438-SoftJin_Rolls_Out_Mask_Defect_Analysis_Tool.php?rssid=20227</link>
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			<pubDate>Thu, 25 Sep 2008 15:06:00 GMT</pubDate>
			<description>SoftJin Technologies said it has developed a mask defect analysis tool that initially supports...</description>
		</item>
										<item>
			<title>Carl Zeiss SMT to Acquire Israeli Start-Up Pixer Technology</title>
			<link>http://www.semiconductor.net/article/204330-Carl_Zeiss_SMT_to_Acquire_Israeli_Start_Up_Pixer_Technology.php?rssid=20227</link>
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			<pubDate>Thu, 07 Aug 2008 15:20:00 GMT</pubDate>
			<description>Carl Zeiss SMT is acquiring Pixer Technology Ltd., a 30-person company that offers photomask...</description>
		</item>
										<item>
			<title>ATE Industry Maneuvers Around ‘Perfect Storm’ of Issues at 90 nm and Below</title>
			<link>http://www.semiconductor.net/article/196600-ATE_Industry_Maneuvers_Around_Perfect_Storm_of_Issues_at_90_nm_and_Below.php?rssid=20227</link>
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			<pubDate>Thu, 12 Jun 2008 14:32:00 GMT</pubDate>
			<description>The combination of discrete challenges, design sensitivity and integration issues are creating...</description>
		</item>
										<item>
			<title>How to Detect Non-Overlay Misalignment Errors?</title>
			<link>http://www.semiconductor.net/article/207983-How_to_Detect_Non_Overlay_Misalignment_Errors_.php?rssid=20227</link>
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			<pubDate>Thu, 08 May 2008 14:35:00 GMT</pubDate>
			<description>Engineers at SMIC were confronted with an unusual problem in their DRAM fab — how to detect a...</description>
		</item>
										<item>
			<title>A Better Way to Manage Test Wafers</title>
			<link>http://www.semiconductor.net/article/199798-A_Better_Way_to_Manage_Test_Wafers.php?rssid=20227</link>
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			<pubDate>Thu, 08 May 2008 14:11:00 GMT</pubDate>
			<description>Advanced Micro Devices is in the process of applying lean concepts throughout its organization...</description>
		</item>
										<item>
			<title>Applied Tackles Edge With Inflexion Polishing System</title>
			<link>http://www.semiconductor.net/article/198696-Applied_Tackles_Edge_With_Inflexion_Polishing_System.php?rssid=20227</link>
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			<pubDate>Wed, 07 May 2008 14:24:00 GMT</pubDate>
			<description>Applied Materials introduced the Inflexion edge polishing system that has an integrated wafer...</description>
		</item>
										<item>
			<title>Real Men/Women Do Have Fabs</title>
			<link>http://www.semiconductor.net/article/204117-Real_Men_Women_Do_Have_Fabs.php?rssid=20227</link>
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			<pubDate>Wed, 30 Apr 2008 13:54:00 GMT</pubDate>
			<description>Tom Sonderman, vice president of manufacturing technology at Advanced Micro Devices (AMD,...</description>
		</item>
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			<title>TSMC Sketches 32 nm Rollout Plan for 2009</title>
			<link>http://www.semiconductor.net/article/207109-TSMC_Sketches_32_nm_Rollout_Plan_for_2009.php?rssid=20227</link>
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			<pubDate>Mon, 28 Apr 2008 15:09:00 GMT</pubDate>
			<description>Taiwan Semiconductor Manufacturing Co. Ltd. plans to begin 32 nm production in the third quarter...</description>
		</item>
										<item>
			<title>Intel Tackles EUV Mask Cleans</title>
			<link>http://www.semiconductor.net/article/202317-Intel_Tackles_EUV_Mask_Cleans.php?rssid=20227</link>
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			<pubDate>Wed, 02 Apr 2008 16:24:00 GMT</pubDate>
			<description>At Sematech’s Surface Preparation and Cleaning Conference in Austin, Texas, Intel’s Ted...</description>
		</item>
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			<title>Semiconductor International Announces New Editor-in-Chief</title>
			<link>http://www.semiconductor.net/article/205097-Semiconductor_International_Announces_New_Editor_in_Chief.php?rssid=20227</link>
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			<pubDate>Wed, 26 Mar 2008 19:39:00 GMT</pubDate>
			<description>Laura Peters has been promoted to the position of editor-in-chief of Semiconductor International...</description>
		</item>
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			<title>ITRS Yield Enhancement: The End Justifies The Means</title>
			<link>http://www.semiconductor.net/article/203693-ITRS_Yield_Enhancement_The_End_Justifies_The_Means.php?rssid=20227</link>
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			<pubDate>Wed, 12 Mar 2008 06:00:00 GMT</pubDate>
			<description>The 2007 Update of the Yield Enhancement chapter of the International Technology Roadmap for...</description>
		</item>
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			<title>IBM Brings Hitachi Into Albany Ecosystem</title>
			<link>http://www.semiconductor.net/article/203954-IBM_Brings_Hitachi_Into_Albany_Ecosystem.php?rssid=20227</link>
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			<pubDate>Tue, 11 Mar 2008 10:29:00 GMT</pubDate>
			<description>IBM and Hitachi researchers will work together on metrology challenges arising at the 22 nm node...</description>
		</item>
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			<title>SPIE: Metrology Must Provide More Accuracy</title>
			<link>http://www.semiconductor.net/article/208228-SPIE_Metrology_Must_Provide_More_Accuracy.php?rssid=20227</link>
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			<pubDate>Wed, 27 Feb 2008 13:39:00 GMT</pubDate>
			<description>At the SPIE Advanced Lithography Conference being held this week in San Jose, several of the...</description>
		</item>
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			<title>Chipworks Offers ICInside Browser for Circuit Analysis</title>
			<link>http://www.semiconductor.net/article/207907-Chipworks_Offers_ICInside_Browser_for_Circuit_Analysis.php?rssid=20227</link>
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			<pubDate>Tue, 05 Feb 2008 14:58:00 GMT</pubDate>
			<description>Reverse engineering firm Chipworks (Ottowa, Canada) has developed software called ICInside...</description>
		</item>
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			<title>Sematech Announces Meetings Lineup for 2008</title>
			<link>http://www.semiconductor.net/article/200749-Sematech_Announces_Meetings_Lineup_for_2008.php?rssid=20227</link>
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			<pubDate>Thu, 24 Jan 2008 16:34:00 GMT</pubDate>
			<description>Sematech announced its 2008 meetings on lithography and other semiconductor-related research...</description>
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			<title>Hutcheson: 2025 Likely Date for 450 mm</title>
			<link>http://www.semiconductor.net/article/204850-Hutcheson_2025_Likely_Date_for_450_mm.php?rssid=20227</link>
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			<pubDate>Wed, 16 Jan 2008 16:05:00 GMT</pubDate>
			<description>The 450 mm wafer transition will be delayed until around 2025, in part because of a reluctance...</description>
		</item>
										<item>
			<title>MIRAI Team Studies Threshold Voltage Variation Causes</title>
			<link>http://www.semiconductor.net/article/205285-MIRAI_Team_Studies_Threshold_Voltage_Variation_Causes.php?rssid=20227</link>
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			<pubDate>Mon, 07 Jan 2008 15:33:00 GMT</pubDate>
			<description>A team of researchers at Japan’s MIRAI research consortium has studied the role of dopant...</description>
		</item>
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			<title>Applied Signs Deals for Equipment Services, PV Production Line</title>
			<link>http://www.semiconductor.net/article/199288-Applied_Signs_Deals_for_Equipment_Services_PV_Production_Line.php?rssid=20227</link>
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			<pubDate>Wed, 14 Nov 2007 12:54:00 GMT</pubDate>
			<description>In twin moves with Asian customers, Applied Materials Inc. said it has signed a major services...</description>
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			<title>Lithography, Test Among Cost Challenges</title>
			<link>http://www.semiconductor.net/article/202181-Lithography_Test_Among_Cost_Challenges.php?rssid=20227</link>
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			<pubDate>Thu, 08 Nov 2007 15:26:00 GMT</pubDate>
			<description>Equipment productivity has skyrocketed over the past five years, as measured by slices per hour,...</description>
		</item>
										<item>
			<title>NanoLab Technologies Selects Semicaps for Fault Localization</title>
			<link>http://www.semiconductor.net/article/197286-NanoLab_Technologies_Selects_Semicaps_for_Fault_Localization.php?rssid=20227</link>
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			<pubDate>Tue, 06 Nov 2007 15:09:00 GMT</pubDate>
			<description>Semicaps Pte. Ltd. (Singapore) announced at the International Symposium for Testing and Failure...</description>
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			<title>NGF Plan Seeks Reduced First Wafer Delay</title>
			<link>http://www.semiconductor.net/article/199209-NGF_Plan_Seeks_Reduced_First_Wafer_Delay.php?rssid=20227</link>
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			<pubDate>Wed, 31 Oct 2007 14:10:00 GMT</pubDate>
			<description>The 19-point Next Generation Factory (NGF) initiative received much of the attention at the...</description>
		</item>
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			<title>Odyssey Design-for-Test Speeds Yield Ramp</title>
			<link>http://www.semiconductor.net/article/201927-Odyssey_Design_for_Test_Speeds_Yield_Ramp.php?rssid=20227</link>
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			<pubDate>Wed, 24 Oct 2007 09:21:00 GMT</pubDate>
			<description>The Odyssey design for test (DFT) module from Synopsys allows engineers to leverage...</description>
		</item>
										<item>
			<title>NGF Group Seeks 300 mm Fab Productivity</title>
			<link>http://www.semiconductor.net/article/204842-NGF_Group_Seeks_300_mm_Fab_Productivity.php?rssid=20227</link>
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			<pubDate>Thu, 13 Sep 2007 15:32:00 GMT</pubDate>
			<description>A Next Generation Factory meeting being held in Austin Thursday by six device manufacturers and...</description>
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			<title>Cadence, Stratosphere Target 45 nm Variability</title>
			<link>http://www.semiconductor.net/article/203445-Cadence_Stratosphere_Target_45_nm_Variability.php?rssid=20227</link>
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			<pubDate>Mon, 10 Sep 2007 06:00:00 GMT</pubDate>
			<description>Stratosphere Solutions and Cadence Design Systems said they will jointly tackle a critical...</description>
		</item>
										<item>
			<title>Group of 10 to Tackle Killer Particles</title>
			<link>http://www.semiconductor.net/article/200696-Group_of_10_to_Tackle_Killer_Particles.php?rssid=20227</link>
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			<pubDate>Wed, 05 Sep 2007 19:00:00 GMT</pubDate>
			<description>A group of 10 companies and research institutes is forming to tackle nanoparticles, a yield...</description>
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										<item>
			<title>Lean Manufacturing Courses Precede ISMI Symposium</title>
			<link>http://www.semiconductor.net/article/207959-Lean_Manufacturing_Courses_Precede_ISMI_Symposium.php?rssid=20227</link>
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			<pubDate>Thu, 23 Aug 2007 15:07:00 GMT</pubDate>
			<description>Lean manufacturing will be among the courses offered to semiconductor professionals during the...</description>
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			<title>Cadence Acquires Clear Shape Technologies</title>
			<link>http://www.semiconductor.net/article/198931-Cadence_Acquires_Clear_Shape_Technologies.php?rssid=20227</link>
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			<pubDate>Thu, 16 Aug 2007 19:10:00 GMT</pubDate>
			<description>Cadence Design Systems Inc. announced that it is acquiring Clear Shape Technologies Inc. to...</description>
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			<title>Dongbu HiTek Adopts Unified PDF Solution</title>
			<link>http://www.semiconductor.net/article/201791-Dongbu_HiTek_Adopts_Unified_PDF_Solution.php?rssid=20227</link>
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			<pubDate>Tue, 07 Aug 2007 13:29:00 GMT</pubDate>
			<description>PDF Solutions Inc. said today that Korean foundry Dongbu HiTek has selected PDF’s tools to...</description>
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										<item>
			<title>SEC Settles KLA Options Fraud; Still Pursuing Ex-CEO</title>
			<link>http://www.semiconductor.net/article/204084-SEC_Settles_KLA_Options_Fraud_Still_Pursuing_Ex_CEO.php?rssid=20227</link>
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			<pubDate>Thu, 26 Jul 2007 12:08:00 GMT</pubDate>
			<description>The Securities and Exchange Commission announced Wednesday that fraud charges against KLA-Tencor...</description>
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										<item>
			<title>AMD's Grose to Keynote ISMI Symposium</title>
			<link>http://www.semiconductor.net/article/203829-AMD_s_Grose_to_Keynote_ISMI_Symposium.php?rssid=20227</link>
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			<pubDate>Tue, 24 Jul 2007 15:18:00 GMT</pubDate>
			<description>Douglas Grose, a senior vice president at Advanced Micro Devices (AMD, Sunnyvale, Calif.), and...</description>
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										<item>
			<title>Cadence Acquisition of Invarium Could Change DFM Market</title>
			<link>http://www.semiconductor.net/article/202266-Cadence_Acquisition_of_Invarium_Could_Change_DFM_Market.php?rssid=20227</link>
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			<pubDate>Thu, 12 Jul 2007 20:37:00 GMT</pubDate>
			<description>Cadence Design Systems Inc., until now an also-ran in the market for DFM implementation...</description>
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										<item>
			<title>ASML to Acquire Brion Technologies</title>
			<link>http://www.semiconductor.net/article/208448-ASML_to_Acquire_Brion_Technologies.php?rssid=20227</link>
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			<pubDate>Tue, 19 Dec 2006 20:30:00 GMT</pubDate>
			<description>Litho tool manufacturer ASML will acquire the computational lithography tool developer for $270M...</description>
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										<item>
			<title>Sierra and Mentor Collaborate on Litho-Friendly Design</title>
			<link>http://www.semiconductor.net/article/197980-Sierra_and_Mentor_Collaborate_on_Litho_Friendly_Design.php?rssid=20227</link>
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			<pubDate>Tue, 01 Aug 2006 06:00:00 GMT</pubDate>
			<description>Sierra Design Automation Inc. (Santa Clara, Calif.) is teaming up with Mentor Graphics (San...</description>
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										<item>
			<title>TSMC and UMC Intro Different 65 nm DFM Solutions</title>
			<link>http://www.semiconductor.net/article/204233-TSMC_and_UMC_Intro_Different_65_nm_DFM_Solutions.php?rssid=20227</link>
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			<pubDate>Tue, 01 Aug 2006 06:00:00 GMT</pubDate>
			<description>TSMC has unveiled a 65 nm design for manufacturing (DFM) compliance design support ecosystem...</description>
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										<item>
			<title>Aprio Advances Incremental OPC Strategy</title>
			<link>http://www.semiconductor.net/article/206279-Aprio_Advances_Incremental_OPC_Strategy.php?rssid=20227</link>
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			<pubDate>Tue, 21 Feb 2006 07:00:00 GMT</pubDate>
			<description>SPIE: Aprio Technologies takes an incremental approach to mask data...</description>
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										<item>
			<title>Brion Intros Predictable Full-Chip OPC</title>
			<link>http://www.semiconductor.net/article/207025-Brion_Intros_Predictable_Full_Chip_OPC.php?rssid=20227</link>
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			<pubDate>Tue, 21 Feb 2006 07:00:00 GMT</pubDate>
			<description>SPIE: Several companies are working on improving the accuracy of their OPC models. Brion...</description>
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										<item>
			<title>Company News</title>
			<link>http://www.semiconductor.net/article/198799-Company_News.php?rssid=20227</link>
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			<pubDate>Fri, 01 Jul 2005 06:00:00 GMT</pubDate>
			<description>...</description>
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										<item>
			<title>Understanding, Reducing Copper Defects</title>
			<link>http://www.semiconductor.net/article/205495-Understanding_Reducing_Copper_Defects.php?rssid=20227</link>
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			<pubDate>Wed, 01 Aug 2001 06:00:00 GMT</pubDate>
			<description>With copper processes beginning to enter full-scale production, a number of researchers are...</description>
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										<item>
			<title>The Power of E-Manufacturing</title>
			<link>http://www.semiconductor.net/article/204150-The_Power_of_E_Manufacturing.php?rssid=20227</link>
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			<pubDate>Sun, 01 Jul 2001 06:00:00 GMT</pubDate>
			<description>...</description>
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										<item>
			<title>Improving Copper Interconnect Reliability</title>
			<link>http://www.semiconductor.net/article/206803-Improving_Copper_Interconnect_Reliability.php?rssid=20227</link>
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			<pubDate>Sun, 01 Jul 2001 06:00:00 GMT</pubDate>
			<description>Though copper interconnects are known for their better electromigration (EM) resistance than...</description>
		</item>
										<item>
			<title>AMD Employs ESD Control for Photomasks</title>
			<link>http://www.semiconductor.net/article/198704-AMD_Employs_ESD_Control_for_Photomasks.php?rssid=20227</link>
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			<pubDate>Fri, 01 Jun 2001 06:00:00 GMT</pubDate>
			<description>Advanced Micro Devices (AMD, Sunnyvale, Calif.) is successfully using an ESD (electrostatic...</description>
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										<item>
			<title>Company News</title>
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			<pubDate>Fri, 01 Jun 2001 06:00:00 GMT</pubDate>
			<description>Boxer Cross (Menlo Park, Calif.) shipped a BX-10 ultrashallow junction measurement system to...</description>
		</item>
										<item>
			<title>Using a Learning Machine to Control Key Yield Metrics</title>
			<link>http://www.semiconductor.net/article/203701-Using_a_Learning_Machine_to_Control_Key_Yield_Metrics.php?rssid=20227</link>
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			<pubDate>Tue, 01 May 2001 06:00:00 GMT</pubDate>
			<description>Engineers at Agere Systems (Orlando, Fla.), formerly the Microelectronics Group of Lucent...</description>
		</item>
										<item>
			<title>Calibrating CD Metrology Tools to 1 nm</title>
			<link>http://www.semiconductor.net/article/200440-Calibrating_CD_Metrology_Tools_to_1_nm.php?rssid=20227</link>
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			<pubDate>Sun, 01 Apr 2001 07:00:00 GMT</pubDate>
			<description>Without precise reference materials, nanometer-scale calibration of metrology tools-including...</description>
		</item>
										<item>
			<title>Analyzing Failures Using SFA</title>
			<link>http://www.semiconductor.net/article/206931-Analyzing_Failures_Using_SFA.php?rssid=20227</link>
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			<pubDate>Thu, 01 Mar 2001 07:00:00 GMT</pubDate>
			<description>International SEMATECH (Austin, Texas) recently published a report on the use of Signature...</description>
		</item>
										<item>
			<title>Motorola and Infineon Improve APC Strategy</title>
			<link>http://www.semiconductor.net/article/203072-Motorola_and_Infineon_Improve_APC_Strategy.php?rssid=20227</link>
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			<pubDate>Thu, 01 Feb 2001 07:00:00 GMT</pubDate>
			<description>Practically applying APC in a fab environment is one of the cornerstones of the Advanced...</description>
		</item>
										<item>
			<title>Addressing 0.13µm Yield Management Issues</title>
			<link>http://www.semiconductor.net/article/198258-Addressing_0_13_m_Yield_Management_Issues.php?rssid=20227</link>
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			<pubDate>Mon, 01 Jan 2001 07:00:00 GMT</pubDate>
			<description>Tom Long, vice president of corporate marketing at KLA-Tencor Corp. (San Jose), joined the...</description>
		</item>
										<item>
			<title>Test Structures for a faster SOC Yield Ramp</title>
			<link>http://www.semiconductor.net/article/202722-Test_Structures_for_a_faster_SOC_Yield_Ramp.php?rssid=20227</link>
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			<pubDate>Fri, 01 Dec 2000 07:00:00 GMT</pubDate>
			<description>Engineers from Toshiba in Yokohama, Japan, recently proposed new test structures that allow...</description>
		</item>
										<item>
			<title>Four New Yield Models for Deep-Submicron Designs</title>
			<link>http://www.semiconductor.net/article/203377-Four_New_Yield_Models_for_Deep_Submicron_Designs.php?rssid=20227</link>
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			<pubDate>Wed, 01 Nov 2000 07:00:00 GMT</pubDate>
			<description>Below 0.5µm feature sizes, engineers require more accurate models to forecast yields, speed...</description>
		</item>
										<item>
			<title>Company News</title>
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			<pubDate>Sun, 01 Oct 2000 06:00:00 GMT</pubDate>
			<description>Electro Scientific Industries (Portland, Ore.) received orders for multiple units of the...</description>
		</item>
										<item>
			<title>Abrasive-Free Chemical Polishing Could Improve Yields</title>
			<link>http://www.semiconductor.net/article/203170-Abrasive_Free_Chemical_Polishing_Could_Improve_Yields.php?rssid=20227</link>
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			<pubDate>Sun, 01 Oct 2000 06:00:00 GMT</pubDate>
			<description>Researchers from Hitachi (Tokyo) recently developed an abrasive-free polishing (AFP) solution...</description>
		</item>
										<item>
			<title>Framing the In-line Metrology Debate for 0.13-0.10 µm Devices</title>
			<link>http://www.semiconductor.net/article/208535-Framing_the_In_line_Metrology_Debate_for_0_13_0_10_m_Devices.php?rssid=20227</link>
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			<pubDate>Fri, 01 Sep 2000 06:00:00 GMT</pubDate>
			<description>This year's SEMICON West show debuted several in-line metrology solutions aimed at increasing...</description>
		</item>
										<item>
			<title>Improving Yield Prediction Accuracy</title>
			<link>http://www.semiconductor.net/article/208378-Improving_Yield_Prediction_Accuracy.php?rssid=20227</link>
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			<pubDate>Tue, 01 Aug 2000 06:00:00 GMT</pubDate>
			<description>Update to Series As shown in the previous installment of this series, probe yields can be...</description>
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										<item>
			<title>Assessing the Cost-Effectiveness of New Technologies</title>
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			<pubDate>Sat, 01 Jul 2000 06:00:00 GMT</pubDate>
			<description>Update to Series A forecast of wafer probe yields gives a strong indication of the...</description>
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										<item>
			<title>A Better Way of Reducing Monitor Costs</title>
			<link>http://www.semiconductor.net/article/208950-A_Better_Way_of_Reducing_Monitor_Costs.php?rssid=20227</link>
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			<pubDate>Thu, 01 Jun 2000 06:00:00 GMT</pubDate>
			<description>Six months into a joint research project between Intel Corp. (Santa Clara, Calif.) and...</description>
		</item>
										<item>
			<title>Choosing the Best Yield Model for Your Product</title>
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			<pubDate>Mon, 01 May 2000 06:00:00 GMT</pubDate>
			<description>Part 16 of Series Today's complete yield model must meet a tall order of requirements. It must...</description>
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										<item>
			<title>Projecting Yields Using Bitmap Analysis</title>
			<link>http://www.semiconductor.net/article/201244-Projecting_Yields_Using_Bitmap_Analysis.php?rssid=20227</link>
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			<pubDate>Sat, 01 Apr 2000 07:00:00 GMT</pubDate>
			<description>Part 15 of Series Critical area analysis (CAA) is a powerful tool for predicting yields and the...</description>
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										<item>
			<title>Enhancing Yield Using Critical Area Analysis</title>
			<link>http://www.semiconductor.net/article/207668-Enhancing_Yield_Using_Critical_Area_Analysis.php?rssid=20227</link>
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			<pubDate>Wed, 01 Mar 2000 07:00:00 GMT</pubDate>
			<description>Part 14 of Series A simulation tool called critical area analysis (CAA) helps engineers better...</description>
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										<item>
			<title>Step-By-Step Yield Analysis Based on Production Levels</title>
			<link>http://www.semiconductor.net/article/206111-Step_By_Step_Yield_Analysis_Based_on_Production_Levels.php?rssid=20227</link>
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			<pubDate>Tue, 01 Feb 2000 07:00:00 GMT</pubDate>
			<description>Part 13 of Series Using the techniques presented in this series to date, this current...</description>
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										<item>
			<title>Realizing Financial Payback from Yield Improvement</title>
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			<pubDate>Sat, 01 Jan 2000 07:00:00 GMT</pubDate>
			<description>Part 12 of Series Wafer probe yield improvements have a profound impact on a fab's...</description>
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