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Subject to its Terms of Use (http://www.semiconductor.net/info/terms-and-conditions.php) http://www.semiconductor.net/article/367207-Sematech_3_D_Program_Provides_Lessons.php?rssid=20225 http://www.semiconductor.net/article/367207-Sematech_3_D_Program_Provides_Lessons.php?rssid=20225 Mon, 02 Nov 2009 18:34:14 GMT Sematech's 3-D interconnect program has provided the equipment and materials industry with a... http://www.semiconductor.net/article/366142-ISMI_450_mm_Program_Moving_to_Next_Stage.php?rssid=20225 http://www.semiconductor.net/article/366142-ISMI_450_mm_Program_Moving_to_Next_Stage.php?rssid=20225 Fri, 23 Oct 2009 13:29:41 GMT The ISMI 450 mm wafer program is moving to a new stage, going beyond wafer handling to blanket... http://www.semiconductor.net/article/358223-IEDM_Confronts_Logic_Scaling_Challenges.php?rssid=20225 http://www.semiconductor.net/article/358223-IEDM_Confronts_Logic_Scaling_Challenges.php?rssid=20225 Thu, 15 Oct 2009 15:25:48 GMT The International Electron Devices Meeting (IEDM), set for Dec. 6-9 in Baltimore, includes... http://www.semiconductor.net/article/358034-High_Power_Transistors_Emerge_at_CEATEC.php?rssid=20225 http://www.semiconductor.net/article/358034-High_Power_Transistors_Emerge_at_CEATEC.php?rssid=20225 Wed, 14 Oct 2009 14:56:35 GMT Sanken, Fujitsu Laboratories, and other Japanese companies introduced high-power transistors,... http://www.semiconductor.net/article/357702-SOI_Reduces_Dynamic_Power_Wafer_Costs_Coming_Down.php?rssid=20225 http://www.semiconductor.net/article/357702-SOI_Reduces_Dynamic_Power_Wafer_Costs_Coming_Down.php?rssid=20225 Mon, 12 Oct 2009 15:48:42 GMT Silicon-on-insulator (SOI) technology is seeking to penetrate the high-volume market for mobile... http://www.semiconductor.net/article/356905-Qualcomm_s_Nowak_3_D_Faces_Cost_Issues.php?rssid=20225 http://www.semiconductor.net/article/356905-Qualcomm_s_Nowak_3_D_Faces_Cost_Issues.php?rssid=20225 Tue, 06 Oct 2009 14:10:48 GMT Qualcomm Director of Advanced Technology Matt Nowak outlined the cost and technology challenges... http://www.semiconductor.net/article/354546-IBM_Readies_32_nm_eDRAM_With_Low_Latency.php?rssid=20225 http://www.semiconductor.net/article/354546-IBM_Readies_32_nm_eDRAM_With_Low_Latency.php?rssid=20225 Fri, 18 Sep 2009 20:57:03 GMT IBM unveiled a 32 nm SOI embedded DRAM, and will provide details at the upcoming IEDM in... http://www.semiconductor.net/article/353759-Intel_Ramping_32_nm_Manufacturing_in_Oregon.php?rssid=20225 http://www.semiconductor.net/article/353759-Intel_Ramping_32_nm_Manufacturing_in_Oregon.php?rssid=20225 Mon, 14 Sep 2009 13:06:20 GMT Intel is shipping "large numbers" of 32 nm samples of its Westmere processor to PC vendors for... http://www.semiconductor.net/article/339622-Elpida_Develops_3_D_Stacked_8_Gb_DRAM.php?rssid=20225 http://www.semiconductor.net/article/339622-Elpida_Develops_3_D_Stacked_8_Gb_DRAM.php?rssid=20225 Fri, 04 Sep 2009 20:01:55 GMT Elpida Memory said it employed copper through-silicon vias in an 8 Gb DRAM that includes eight 1... http://www.semiconductor.net/article/339396-Hitachi_Creates_MEMS_Sensor_Process.php?rssid=20225 http://www.semiconductor.net/article/339396-Hitachi_Creates_MEMS_Sensor_Process.php?rssid=20225 Thu, 03 Sep 2009 13:12:08 GMT Hitachi researchers have developed a method to form cavities in the interconnect layers of CMOS... http://www.semiconductor.net/article/327792-Yale_Team_Creates_Ferroelectric_DRAM.php?rssid=20225 http://www.semiconductor.net/article/327792-Yale_Team_Creates_Ferroelectric_DRAM.php?rssid=20225 Mon, 17 Aug 2009 20:15:53 GMT A Yale University team led by Professor T.P. Ma has proposed a DRAM that marries a ferroelectric... http://www.semiconductor.net/article/327643-Samsung_Upgrading_Austin_NAND_Fab.php?rssid=20225 http://www.semiconductor.net/article/327643-Samsung_Upgrading_Austin_NAND_Fab.php?rssid=20225 Fri, 14 Aug 2009 19:44:38 GMT Samsung said it will convert an older 200 mm DRAM fab in Austin into a copper BEOL for the... http://www.semiconductor.net/article/326397-Poly_Gate_Patterning_for_22_nm_Logic.php?rssid=20225 http://www.semiconductor.net/article/326397-Poly_Gate_Patterning_for_22_nm_Logic.php?rssid=20225 Tue, 04 Aug 2009 12:48:48 GMT Gridded design rules, a layout architecture in which each device layer has circuits snapped to a... http://www.semiconductor.net/article/316680-GlobalFoundries_Nabs_STMicro_as_Customer.php?rssid=20225 http://www.semiconductor.net/article/316680-GlobalFoundries_Nabs_STMicro_as_Customer.php?rssid=20225 Wed, 29 Jul 2009 11:07:38 GMT GlobalFoundries said it has signed up STMicroelectronics as the first customer for its low-power... http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20225 http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20225 Tue, 28 Jul 2009 15:11:43 GMT GlobalFoundries plans to introduce embedded silicon carbon (eSiC) to strain the nFET transistors... http://www.semiconductor.net/article/316566-Pad_Conditioner_Improves_CMP_Efficiency.php?rssid=20225 http://www.semiconductor.net/article/316566-Pad_Conditioner_Improves_CMP_Efficiency.php?rssid=20225 Tue, 28 Jul 2009 13:02:30 GMT Optimization of CMP processes is typically carried out using monitor wafers with off-line... http://www.semiconductor.net/article/316223-More_on_Sematech_s_TSV_Interconnect_Program.php?rssid=20225 http://www.semiconductor.net/article/316223-More_on_Sematech_s_TSV_Interconnect_Program.php?rssid=20225 Thu, 23 Jul 2009 17:06:42 GMT Sematech qualified an infrared inspection tool that can verify the alignment of through-silicon... http://www.semiconductor.net/article/315628-ISMI_Selects_SSEC_450_mm_Single_Wafer_Cleaner.php?rssid=20225 http://www.semiconductor.net/article/315628-ISMI_Selects_SSEC_450_mm_Single_Wafer_Cleaner.php?rssid=20225 Fri, 17 Jul 2009 15:09:51 GMT The 3400 series single-wafer cleaning processor from Solid State Equipment Corp. has been chosen... http://www.semiconductor.net/article/314995-Entegris_Advances_300_mm_Wafer_Environment_Control.php?rssid=20225 http://www.semiconductor.net/article/314995-Entegris_Advances_300_mm_Wafer_Environment_Control.php?rssid=20225 Mon, 13 Jul 2009 14:19:13 GMT Entegris Inc. announced several new enhancements to its Spectra line of 300 mm FOUPs to reduce... http://www.semiconductor.net/article/307479-ISMI_to_Report_Progress_at_SEMICON_West.php?rssid=20225 http://www.semiconductor.net/article/307479-ISMI_to_Report_Progress_at_SEMICON_West.php?rssid=20225 Mon, 06 Jul 2009 15:16:40 GMT At next week's SEMICON West show, ISMI will meet the supplier community to discuss progress with... http://www.semiconductor.net/article/307037-Sematech_Crafts_ZIL_Solution_for_16_nm.php?rssid=20225 http://www.semiconductor.net/article/307037-Sematech_Crafts_ZIL_Solution_for_16_nm.php?rssid=20225 Mon, 29 Jun 2009 15:34:37 GMT Sematech researchers said a zero interface layer (ZIL) approach has been demonstrated, and may... http://www.semiconductor.net/article/295755-SEMICON_West_Session_Focuses_on_22_nm_Lithography.php?rssid=20225 http://www.semiconductor.net/article/295755-SEMICON_West_Session_Focuses_on_22_nm_Lithography.php?rssid=20225 Thu, 25 Jun 2009 18:39:11 GMT Moderated by Semiconductor International Executive Editor Aaron Hand, the "Lithography... http://www.semiconductor.net/article/295251-Thin_SOI_Devices_Shine_at_VLSI_Symposium.php?rssid=20225 http://www.semiconductor.net/article/295251-Thin_SOI_Devices_Shine_at_VLSI_Symposium.php?rssid=20225 Thu, 18 Jun 2009 14:13:00 GMT At the 2009 Symposium on VLSI Technology in Kyoto, Japan, an IBM R&D team described fully... http://www.semiconductor.net/article/294804-NEC_s_MRAM_Uses_Vertical_Magnetic_Spin.php?rssid=20225 http://www.semiconductor.net/article/294804-NEC_s_MRAM_Uses_Vertical_Magnetic_Spin.php?rssid=20225 Wed, 17 Jun 2009 13:48:22 GMT NEC presented a spintronics MRAM cell at the Symposium on VLSI Technology in Kyoto, Japan. The... http://www.semiconductor.net/article/294639-Alliance_Members_Tout_Oxide_EOT_Advance.php?rssid=20225 http://www.semiconductor.net/article/294639-Alliance_Members_Tout_Oxide_EOT_Advance.php?rssid=20225 Tue, 16 Jun 2009 15:24:33 GMT Researchers from GlobalFoundries and IBM Research went to the 2009 Symposium on VLSI Technology... http://www.semiconductor.net/article/279085-IMEC_Tips_10_nm_Options_at_Tech_Forum.php?rssid=20225 http://www.semiconductor.net/article/279085-IMEC_Tips_10_nm_Options_at_Tech_Forum.php?rssid=20225 Thu, 11 Jun 2009 13:40:11 GMT IMEC Fellow Marc Heyns described R&D directions at the consortium's recent technology forum,... http://www.semiconductor.net/article/278860-EUV_Reduced_to_an_Engineering_Problem.php?rssid=20225 http://www.semiconductor.net/article/278860-EUV_Reduced_to_an_Engineering_Problem.php?rssid=20225 Tue, 09 Jun 2009 16:15:36 GMT EUV seems to be finally at the stage of "just an engineering problem," though a sufficiently... http://www.semiconductor.net/article/278834-Novellus_Improves_Clean_Process_for_Speed_Max_Gapfill_Tool.php?rssid=20225 http://www.semiconductor.net/article/278834-Novellus_Improves_Clean_Process_for_Speed_Max_Gapfill_Tool.php?rssid=20225 Tue, 09 Jun 2009 14:19:27 GMT Novellus said it has improved the in situ clean steps for its CVD gapfill platform, reducing... http://www.semiconductor.net/article/278179-SEMICON_West_Timans_to_Present_on_Millisecond_Annealing.php?rssid=20225 http://www.semiconductor.net/article/278179-SEMICON_West_Timans_to_Present_on_Millisecond_Annealing.php?rssid=20225 Fri, 05 Jun 2009 15:25:00 GMT Paul Timans, director of technology for the RTP Products Business Unit at Mattson Technology... http://www.semiconductor.net/article/278341-What_s_New_at_SEMICON_West_2009_.php?rssid=20225 http://www.semiconductor.net/article/278341-What_s_New_at_SEMICON_West_2009_.php?rssid=20225 Fri, 05 Jun 2009 14:34:00 GMT The most prominent new addition to the SEMICON West show this year is Extreme Electronics, a... http://www.semiconductor.net/article/278328-Samsung_s_Kim_Claims_No_Limit_to_Scaling.php?rssid=20225 http://www.semiconductor.net/article/278328-Samsung_s_Kim_Claims_No_Limit_to_Scaling.php?rssid=20225 Thu, 04 Jun 2009 17:13:45 GMT Speaking at IMEC's Technology Forum this week, the ever-optimistic Kinam Kim of Samsung... http://www.semiconductor.net/article/278103-IMEC_Expands_Its_Partnership_with_TSMC.php?rssid=20225 http://www.semiconductor.net/article/278103-IMEC_Expands_Its_Partnership_with_TSMC.php?rssid=20225 Wed, 03 Jun 2009 21:39:00 GMT TSMC will base its European R&D at IMEC. The Taiwan-based foundry will play a more active role... http://www.semiconductor.net/article/277547-Entrepix_Key_to_Schiltron_s_Prototypes.php?rssid=20225 http://www.semiconductor.net/article/277547-Entrepix_Key_to_Schiltron_s_Prototypes.php?rssid=20225 Mon, 01 Jun 2009 10:01:00 GMT Schiltron, a startup with a thin-film transistor 3-D memory architecture, said Entrepix, a CMP... http://www.semiconductor.net/article/277377-Confluense_Readies_CMP_Pad_Surface_Manager.php?rssid=20225 http://www.semiconductor.net/article/277377-Confluense_Readies_CMP_Pad_Surface_Manager.php?rssid=20225 Thu, 28 May 2009 20:28:00 GMT Confluense LLC (Allentown, Pa.) said its pad conditioning system, called Pad Surface Manager,... http://www.semiconductor.net/article/277206-Novellus_Advances_PVD_TaN_Barrier_Film.php?rssid=20225 http://www.semiconductor.net/article/277206-Novellus_Advances_PVD_TaN_Barrier_Film.php?rssid=20225 Thu, 28 May 2009 14:40:00 GMT Novellus said its has developed a conformal hollow cathode magnetron (HCM) PVD technology,... http://www.semiconductor.net/article/232926-GlobalFoundries_and_T_RAM_to_Tackle_Advanced_Nodes.php?rssid=20225 http://www.semiconductor.net/article/232926-GlobalFoundries_and_T_RAM_to_Tackle_Advanced_Nodes.php?rssid=20225 Tue, 19 May 2009 13:35:00 GMT T-RAM Semiconductor, which develops embedded memory IP based on thyristor technology, will work... http://www.semiconductor.net/article/232542-Novellus_Adapts_Resist_Strip_for_3X_Node.php?rssid=20225 http://www.semiconductor.net/article/232542-Novellus_Adapts_Resist_Strip_for_3X_Node.php?rssid=20225 Thu, 14 May 2009 15:39:00 GMT Novellus Systems said it has developed a photoresist stripping process that meets the challenges... http://www.semiconductor.net/article/232200-Freescale_Taking_Nanocrystal_Flash_to_Production.php?rssid=20225 http://www.semiconductor.net/article/232200-Freescale_Taking_Nanocrystal_Flash_to_Production.php?rssid=20225 Mon, 11 May 2009 16:19:00 GMT After five years of technology development, Freescale said it is ready to move nanocrystal flash... http://www.semiconductor.net/article/231189-2009_IITC_to_Consider_Metals_for_22_nm.php?rssid=20225 http://www.semiconductor.net/article/231189-2009_IITC_to_Consider_Metals_for_22_nm.php?rssid=20225 Mon, 04 May 2009 15:45:00 GMT The upcoming International Interconnect Technology Conference (IITC) will consider a variety of... http://www.semiconductor.net/article/209744-2009_VLSI_Technology_Symposium_Takes_Up_Heterogeneous_IC_Challenges.php?rssid=20225 http://www.semiconductor.net/article/209744-2009_VLSI_Technology_Symposium_Takes_Up_Heterogeneous_IC_Challenges.php?rssid=20225 Wed, 22 Apr 2009 16:11:00 GMT The time for first introduction of heterogeneous ICs — based on germanium or SiGe PFET... http://www.semiconductor.net/article/200711-IBM_Alliance_Ready_With_28_nm_Eval_Kits.php?rssid=20225 http://www.semiconductor.net/article/200711-IBM_Alliance_Ready_With_28_nm_Eval_Kits.php?rssid=20225 Thu, 16 Apr 2009 16:07:00 GMT The IBM-led alliance said the evaluation kits for its 28 nm technology are now available, with... http://www.semiconductor.net/article/198545-Inlustra_Starts_Nonpolar_GaN_Production.php?rssid=20225 http://www.semiconductor.net/article/198545-Inlustra_Starts_Nonpolar_GaN_Production.php?rssid=20225 Tue, 14 Apr 2009 14:51:00 GMT Inlustra said it is beginning to deliver nonpolar GaN substrates to customers. Started in 2005... http://www.semiconductor.net/article/202241-Post_RIE_BEOL_Cleaning_Gains_Attention.php?rssid=20225 http://www.semiconductor.net/article/202241-Post_RIE_BEOL_Cleaning_Gains_Attention.php?rssid=20225 Wed, 08 Apr 2009 16:18:00 GMT Cleaning leading-edge copper interconnect layers has become a major challenge, particularly as... http://www.semiconductor.net/article/206409-ISMI_Readies_450_mm_Equipment_Metrics.php?rssid=20225 http://www.semiconductor.net/article/206409-ISMI_Readies_450_mm_Equipment_Metrics.php?rssid=20225 Tue, 07 Apr 2009 15:12:00 GMT The ISMI 450 mm program is moving from wafer handling tests to developing guidelines for early... http://www.semiconductor.net/article/204956-3_D_Equals_Two_Generations_of_Scaling.php?rssid=20225 http://www.semiconductor.net/article/204956-3_D_Equals_Two_Generations_of_Scaling.php?rssid=20225 Thu, 02 Apr 2009 21:26:00 GMT North Carolina State Professor Paul Franzon said the need for 3-D ICs is becoming more acute as... http://www.semiconductor.net/article/205098-Applied_Disco_to_Develop_Wafer_Thinning_Processes.php?rssid=20225 http://www.semiconductor.net/article/205098-Applied_Disco_to_Develop_Wafer_Thinning_Processes.php?rssid=20225 Mon, 30 Mar 2009 13:43:00 GMT Applied Materials Inc. and Disco Corp. will develop wafer-thinning processes for 3-D... http://www.semiconductor.net/article/208941-FSI_Adds_Steam_to_Photoresist_Clean_Step.php?rssid=20225 http://www.semiconductor.net/article/208941-FSI_Adds_Steam_to_Photoresist_Clean_Step.php?rssid=20225 Thu, 26 Mar 2009 15:35:00 GMT FSI International has developed an all-wet cleaning process that preserves ultrashallow... http://www.semiconductor.net/article/205210-ACM_Research_Claims_Megasonic_Solution.php?rssid=20225 http://www.semiconductor.net/article/205210-ACM_Research_Claims_Megasonic_Solution.php?rssid=20225 Tue, 17 Mar 2009 15:33:00 GMT ACM Research said its Shanghai-based R&D team has developed a megasonic cleaning tool, the Ultra... http://www.semiconductor.net/article/205673-Eclipse_PVD_Tool_Handles_Thinned_Wafers.php?rssid=20225 http://www.semiconductor.net/article/205673-Eclipse_PVD_Tool_Handles_Thinned_Wafers.php?rssid=20225 Thu, 26 Feb 2009 16:24:00 GMT Working with an Austrian mechatronics firm, the OEM Group has developed an MRC Eclipse PVD tool... http://www.semiconductor.net/article/207805-Sumitomo_Buys_Axcelis_Share_of_SEN_Joint_Venture.php?rssid=20225 http://www.semiconductor.net/article/207805-Sumitomo_Buys_Axcelis_Share_of_SEN_Joint_Venture.php?rssid=20225 Thu, 26 Feb 2009 13:42:00 GMT Sumitomo Heavy Industries (SHI) said it will buy the 50% share of the SEN joint venture owned by... http://www.semiconductor.net/article/209390-LFoundry_Ready_With_Analog_MPW_Shuttle.php?rssid=20225 http://www.semiconductor.net/article/209390-LFoundry_Ready_With_Analog_MPW_Shuttle.php?rssid=20225 Tue, 17 Feb 2009 15:36:00 GMT The LFoundry (Landshut, Germany) said it is ready to offer its shuttle service for analog... http://www.semiconductor.net/article/202019-Intel_Makes_32_nm_Jump_Over_Competition.php?rssid=20225 http://www.semiconductor.net/article/202019-Intel_Makes_32_nm_Jump_Over_Competition.php?rssid=20225 Wed, 11 Feb 2009 13:34:00 GMT Intel Corp. demonstrated working 32 nm Westmere microprocessors, and said it is on track for 32... http://www.semiconductor.net/article/197640-Intel_to_Roll_Out_32_nm_MPUs_This_Year.php?rssid=20225 http://www.semiconductor.net/article/197640-Intel_to_Roll_Out_32_nm_MPUs_This_Year.php?rssid=20225 Tue, 10 Feb 2009 15:05:00 GMT Intel said it will begin making 32 nm “Westmere” processors later this year. In a speech... http://www.semiconductor.net/article/196983-AMEC_Plans_DRIE_for_3_D_Interconnects.php?rssid=20225 http://www.semiconductor.net/article/196983-AMEC_Plans_DRIE_for_3_D_Interconnects.php?rssid=20225 Mon, 09 Feb 2009 17:24:00 GMT AMEC (Singapore) has weathered its first year in business, installing etchers at four locations... http://www.semiconductor.net/article/197045-Entrepix_SVTC_Partner_on_CMP_Services.php?rssid=20225 http://www.semiconductor.net/article/197045-Entrepix_SVTC_Partner_on_CMP_Services.php?rssid=20225 Wed, 28 Jan 2009 15:38:00 GMT CMP service vendor Entrepix said it will work with SVTC on 300 mm CMP R&D and foundry services.... http://www.semiconductor.net/article/206906-MIRAI_Project_Targets_Ballistic_Transistor_Operation.php?rssid=20225 http://www.semiconductor.net/article/206906-MIRAI_Project_Targets_Ballistic_Transistor_Operation.php?rssid=20225 Tue, 27 Jan 2009 16:00:00 GMT Japan’s MIRAI project seeks to develop a MOS Schottky barrier source transistor with a channel... http://www.semiconductor.net/article/198032-Lanthanum_Doping_May_Boost_Silicon_FETs.php?rssid=20225 http://www.semiconductor.net/article/198032-Lanthanum_Doping_May_Boost_Silicon_FETs.php?rssid=20225 Tue, 30 Dec 2008 17:11:00 GMT Experts at the recent IEDM said performance gains from strained silicon are saturating, causing... http://www.semiconductor.net/article/204488-Elpida_in_Talks_With_Taiwan_DRAM_Makers.php?rssid=20225 http://www.semiconductor.net/article/204488-Elpida_in_Talks_With_Taiwan_DRAM_Makers.php?rssid=20225 Mon, 29 Dec 2008 16:15:00 GMT Japan’s Elpida Memory is discussing a possible four-way merger that would combine it with... http://www.semiconductor.net/article/202498-Flash_Vendors_Facing_Scaling_Challenges.php?rssid=20225 http://www.semiconductor.net/article/202498-Flash_Vendors_Facing_Scaling_Challenges.php?rssid=20225 Tue, 23 Dec 2008 16:27:00 GMT Toshiba engineers said at the recent IEDM that they have improved on the SONOS flash structure,... http://www.semiconductor.net/article/204355-Leading_Edge_Logic_Processes_Presented_at_IEDM_Session.php?rssid=20225 http://www.semiconductor.net/article/204355-Leading_Edge_Logic_Processes_Presented_at_IEDM_Session.php?rssid=20225 Thu, 18 Dec 2008 16:20:00 GMT AMD, IBM and its Fishkill Alliance partners, Intel, an NEC-Toshiba collaborative effort and TSMC... http://www.semiconductor.net/article/207354-How_Intel_Made_CMP_Work_for_High_k.php?rssid=20225 http://www.semiconductor.net/article/207354-How_Intel_Made_CMP_Work_for_High_k.php?rssid=20225 Thu, 18 Dec 2008 12:10:00 GMT Joe Steigerwald, director of CMP technology at Intel, described the CMP process improvements... http://www.semiconductor.net/article/197404-IEDM_Panel_Processing_Costs_Headed_Up.php?rssid=20225 http://www.semiconductor.net/article/197404-IEDM_Panel_Processing_Costs_Headed_Up.php?rssid=20225 Wed, 17 Dec 2008 14:27:00 GMT With more expensive tools and new process modules coming, IC manufacturers will struggle to... http://www.semiconductor.net/article/197484-Intel_Sees_PMOS_Gain_With_110_Silicon.php?rssid=20225 http://www.semiconductor.net/article/197484-Intel_Sees_PMOS_Gain_With_110_Silicon.php?rssid=20225 Tue, 16 Dec 2008 14:55:00 GMT At the 2008 International Electron Devices Meeting (IEDM), speakers from Intel and Fujitsu... http://www.semiconductor.net/article/199881-Multigate_FETs_A_Risky_Proposition.php?rssid=20225 http://www.semiconductor.net/article/199881-Multigate_FETs_A_Risky_Proposition.php?rssid=20225 Mon, 15 Dec 2008 12:53:00 GMT After years of R&D, multi-gate devices (MuGFETs) with vertical structures still fall into the... http://www.semiconductor.net/article/198210-Intel_to_Describe_32_nm_Logic_Process_New_45_nm_SoC_Platform_at_2008_IEDM.php?rssid=20225 http://www.semiconductor.net/article/198210-Intel_to_Describe_32_nm_Logic_Process_New_45_nm_SoC_Platform_at_2008_IEDM.php?rssid=20225 Wed, 10 Dec 2008 16:53:00 GMT Intel will provide some details of its 32 nm logic process in a late paper at next week’s... http://www.semiconductor.net/article/203845-ATMI_and_Ovonyx_Bring_MOCVD_to_PCMs.php?rssid=20225 http://www.semiconductor.net/article/203845-ATMI_and_Ovonyx_Bring_MOCVD_to_PCMs.php?rssid=20225 Tue, 09 Dec 2008 16:42:00 GMT ATMI and Ovonyx said they have demonstrated the ability to use MOCVD to fill high-aspect-ratio... http://www.semiconductor.net/article/200144-Ulvac_Readies_Resist_Residue_Removal_Tool.php?rssid=20225 http://www.semiconductor.net/article/200144-Ulvac_Readies_Resist_Residue_Removal_Tool.php?rssid=20225 Fri, 05 Dec 2008 22:50:00 GMT Ulvac Inc. demonstrated its recently released residue removal tool at SEMICON Japan. The Enviro... http://www.semiconductor.net/article/196702-Applied_Announces_TSV_Etcher_In_Fab_Mask_Inspection_Capability.php?rssid=20225 http://www.semiconductor.net/article/196702-Applied_Announces_TSV_Etcher_In_Fab_Mask_Inspection_Capability.php?rssid=20225 Mon, 01 Dec 2008 17:25:00 GMT Applied Materials Inc. announced its Silvia deep silicon etcher for creation of the smooth... http://www.semiconductor.net/article/204220-SUSS_MicroTec_Names_New_CEO.php?rssid=20225 http://www.semiconductor.net/article/204220-SUSS_MicroTec_Names_New_CEO.php?rssid=20225 Tue, 25 Nov 2008 18:49:00 GMT Frank Averdung, currently managing director at Carl Zeiss SMS, will move into the CEO position... http://www.semiconductor.net/article/207345-TSMC_Begins_Production_of_40_nm_Designs.php?rssid=20225 http://www.semiconductor.net/article/207345-TSMC_Begins_Production_of_40_nm_Designs.php?rssid=20225 Mon, 17 Nov 2008 14:00:00 GMT TSMC said it is now in production of 40 nm designs for a wide variety of customers, ranging from... http://www.semiconductor.net/article/202242-IBM_Offers_45_nm_SOI_Foundry_Solution.php?rssid=20225 http://www.semiconductor.net/article/202242-IBM_Offers_45_nm_SOI_Foundry_Solution.php?rssid=20225 Mon, 10 Nov 2008 14:48:00 GMT IBM is offering a 45 nm SOI foundry solution to customers seeking to reduce active power... http://www.semiconductor.net/article/203402-Logic_Technologies_Face_Off_at_IEDM.php?rssid=20225 http://www.semiconductor.net/article/203402-Logic_Technologies_Face_Off_at_IEDM.php?rssid=20225 Tue, 28 Oct 2008 16:07:00 GMT At the International Electron Devices Meeting (IEDM) planned for Dec. 15-17 in San Francisco,... http://www.semiconductor.net/article/197761-ISMI_Outlines_450_mm_Wafer_NGF_Roadmaps.php?rssid=20225 http://www.semiconductor.net/article/197761-ISMI_Outlines_450_mm_Wafer_NGF_Roadmaps.php?rssid=20225 Mon, 27 Oct 2008 15:26:00 GMT ISMI managers described progress at the 450 mm wafer Interoperability Test Bed, and described... http://www.semiconductor.net/article/199097-IMEC_Calls_EUV_Performance_Impressive_.php?rssid=20225 http://www.semiconductor.net/article/199097-IMEC_Calls_EUV_Performance_Impressive_.php?rssid=20225 Thu, 23 Oct 2008 10:14:00 GMT After only five months’ experience with a new source on its Alpha Demo Tool (ADT), Kurt Ronse,... http://www.semiconductor.net/article/200752-Despite_Losses_Toshiba_to_Continue_Aggressive_Investments.php?rssid=20225 http://www.semiconductor.net/article/200752-Despite_Losses_Toshiba_to_Continue_Aggressive_Investments.php?rssid=20225 Wed, 22 Oct 2008 15:49:00 GMT In a keynote speech at the ISMI Manufacturing Symposium, Toshiba executive Masakazu Kakumu said... http://www.semiconductor.net/article/197827-IMEC_Has_Air_Gaps_in_Post_22_nm_Roadmap_for_Interconnects.php?rssid=20225 http://www.semiconductor.net/article/197827-IMEC_Has_Air_Gaps_in_Post_22_nm_Roadmap_for_Interconnects.php?rssid=20225 Tue, 21 Oct 2008 15:50:00 GMT Though copper will clearly remain the interconnect material of choice, there may be some... http://www.semiconductor.net/article/199870-Kovio_Demonstrates_RFID_Tags_Using_Printed_Electronics.php?rssid=20225 http://www.semiconductor.net/article/199870-Kovio_Demonstrates_RFID_Tags_Using_Printed_Electronics.php?rssid=20225 Thu, 16 Oct 2008 15:27:00 GMT Kovio Inc. (Milpitas, Calif.) announced today at a conference in Chicago that it is... http://www.semiconductor.net/article/196929-NEXX_Licenses_Alchimer_s_Coating_Technology.php?rssid=20225 http://www.semiconductor.net/article/196929-NEXX_Licenses_Alchimer_s_Coating_Technology.php?rssid=20225 Wed, 08 Oct 2008 17:07:00 GMT Alchimer SA (Paris) said it has licensed its eG ViaCoat product for creating conformal copper... http://www.semiconductor.net/article/209089-Common_Platform_Participants_Rate_High_k_as_Good_Mobile_Fit.php?rssid=20225 http://www.semiconductor.net/article/209089-Common_Platform_Participants_Rate_High_k_as_Good_Mobile_Fit.php?rssid=20225 Thu, 02 Oct 2008 14:50:00 GMT The Common Platform Technology Forum centered on partnering to defray ever-increasing R&D costs.... http://www.semiconductor.net/article/206524-3_D_Startup_Is_Ahead_of_Its_Time.php?rssid=20225 http://www.semiconductor.net/article/206524-3_D_Startup_Is_Ahead_of_Its_Time.php?rssid=20225 Wed, 01 Oct 2008 13:12:00 GMT As the 3-D integration infrastructure evolves, it is becoming clear that low-cost, reliable... http://www.semiconductor.net/article/197625-Common_Platform_Partners_Slot_HKMG_Implementation.php?rssid=20225 http://www.semiconductor.net/article/197625-Common_Platform_Partners_Slot_HKMG_Implementation.php?rssid=20225 Tue, 30 Sep 2008 13:54:00 GMT The Common Platform Technology Forum taking place today in Silicon Valley will focus on the... http://www.semiconductor.net/article/203006-Citing_High_k_Costs_TSMC_Plans_Dual_Track_28_nm_Solutions_in_2010.php?rssid=20225 http://www.semiconductor.net/article/203006-Citing_High_k_Costs_TSMC_Plans_Dual_Track_28_nm_Solutions_in_2010.php?rssid=20225 Mon, 29 Sep 2008 11:22:00 GMT TSMC said it will offer both silicon oxynitride (SiON) and high-k/metal gate solutions at the 28... http://www.semiconductor.net/article/199420-Mass_Storage_Pins_Progress_Hopes_on_Aggressive_Litho.php?rssid=20225 http://www.semiconductor.net/article/199420-Mass_Storage_Pins_Progress_Hopes_on_Aggressive_Litho.php?rssid=20225 Fri, 26 Sep 2008 18:45:00 GMT Storage requirements in HDDs and SSDs are increasing at a rate that will require fast progress... http://www.semiconductor.net/article/197903-Oxford_Instruments_Sells_MBE_Business_to_Riber_SA.php?rssid=20225 http://www.semiconductor.net/article/197903-Oxford_Instruments_Sells_MBE_Business_to_Riber_SA.php?rssid=20225 Tue, 23 Sep 2008 14:33:00 GMT Oxford Instruments said it has sold the molecular beam epitaxy (MBE) business operated by... http://www.semiconductor.net/article/203251-NEC_Electronics_Joins_Fishkill_Alliance.php?rssid=20225 http://www.semiconductor.net/article/203251-NEC_Electronics_Joins_Fishkill_Alliance.php?rssid=20225 Thu, 11 Sep 2008 16:08:00 GMT NEC Electronics has joined the IBM-led Fishkill Alliance, with a goal of implementing NEC’s... http://www.semiconductor.net/article/209347-Gordon_Moore_to_Receive_IEEE_Medal_of_Honor.php?rssid=20225 http://www.semiconductor.net/article/209347-Gordon_Moore_to_Receive_IEEE_Medal_of_Honor.php?rssid=20225 Mon, 08 Sep 2008 15:16:00 GMT Known widely for his prediction of the doubling of transistors on a chip, Gordon E. Moore,... http://www.semiconductor.net/article/199682-Tegal_Acquires_Alcatel_Micro_Machining_Systems_in_DRIE_Move_Aimed_at_TSVs.php?rssid=20225 http://www.semiconductor.net/article/199682-Tegal_Acquires_Alcatel_Micro_Machining_Systems_in_DRIE_Move_Aimed_at_TSVs.php?rssid=20225 Wed, 03 Sep 2008 16:15:00 GMT Tegal Corp. said it will acquire product lines from Alcatel Micro Machining Systems, giving it a... http://www.semiconductor.net/article/204709-IBM_Alliance_Builds_22_nm_SRAM_Cell.php?rssid=20225 http://www.semiconductor.net/article/204709-IBM_Alliance_Builds_22_nm_SRAM_Cell.php?rssid=20225 Mon, 18 Aug 2008 15:42:00 GMT IBM and its semiconductor research partners said they have built a working 22 nm SRAM cell with... http://www.semiconductor.net/article/203111-Alchimer_Claims_Fully_Wet_Via_Solution.php?rssid=20225 http://www.semiconductor.net/article/203111-Alchimer_Claims_Fully_Wet_Via_Solution.php?rssid=20225 Fri, 01 Aug 2008 13:49:00 GMT Alchimer SA said experiments have shown that its “electrografting” technology can handle... http://www.semiconductor.net/article/205363-Memory_Moves_to_Megafabs_for_NAND.php?rssid=20225 http://www.semiconductor.net/article/205363-Memory_Moves_to_Megafabs_for_NAND.php?rssid=20225 Thu, 17 Jul 2008 14:00:00 GMT At SEMICON West, companies were discussing wafer processing tools, automation equipment and... http://www.semiconductor.net/article/207127-Roadmap_Signals_Showstoppers.php?rssid=20225 http://www.semiconductor.net/article/207127-Roadmap_Signals_Showstoppers.php?rssid=20225 Thu, 17 Jul 2008 14:00:00 GMT The overall theme of the 2008 update to the International Technology Roadmap for Semiconductors... http://www.semiconductor.net/article/197453-OEM_Group_Buys_Legends_Tools_From_Applied.php?rssid=20225 http://www.semiconductor.net/article/197453-OEM_Group_Buys_Legends_Tools_From_Applied.php?rssid=20225 Wed, 16 Jul 2008 14:00:00 GMT The OEM Group has acquired the “Legacy” tools from Applied Materials, bringing the Eclipse... http://www.semiconductor.net/article/199140-When_Will_450_mm_Make_Economic_Sense_.php?rssid=20225 http://www.semiconductor.net/article/199140-When_Will_450_mm_Make_Economic_Sense_.php?rssid=20225 Wed, 16 Jul 2008 01:22:00 GMT There is an industry-wide curiosity about the reality behind a wafer size transition to 450 mm.... http://www.semiconductor.net/article/196869-Novellus_Debuts_Deposition_Tools_During_West.php?rssid=20225 http://www.semiconductor.net/article/196869-Novellus_Debuts_Deposition_Tools_During_West.php?rssid=20225 Tue, 15 Jul 2008 14:00:00 GMT Novellus Systems (San Jose) unveiled two tools at the Yerba Buena Center of Arts during SEMICON... http://www.semiconductor.net/article/208427-Intermolecular_Speeds_R_D_for_Elpida_s_Next_Gen_Memory.php?rssid=20225 http://www.semiconductor.net/article/208427-Intermolecular_Speeds_R_D_for_Elpida_s_Next_Gen_Memory.php?rssid=20225 Tue, 15 Jul 2008 06:37:00 GMT Intermolecular Inc. (San Jose) today announced a new collaborative development program (CDP) and... http://www.semiconductor.net/article/207509-Etcher_Tuned_for_Double_Patterning_Advanced_Gates.php?rssid=20225 http://www.semiconductor.net/article/207509-Etcher_Tuned_for_Double_Patterning_Advanced_Gates.php?rssid=20225 Sun, 13 Jul 2008 23:25:00 GMT Lam introduced the Versys Kiyo3x Conductor etch platform, the capabilities of which can be... http://www.semiconductor.net/article/206689-BASF_Evonik_to_Develop_Ceria_Based_Slurries.php?rssid=20225 http://www.semiconductor.net/article/206689-BASF_Evonik_to_Develop_Ceria_Based_Slurries.php?rssid=20225 Thu, 03 Jul 2008 14:44:00 GMT BASF and specialty chemicals provider Evonik Industries AG will collaborate on the development... http://www.semiconductor.net/article/201516-TSV_Apps_Need_TSV_Tools.php?rssid=20225 http://www.semiconductor.net/article/201516-TSV_Apps_Need_TSV_Tools.php?rssid=20225 Tue, 01 Jul 2008 15:00:00 GMT While key applications in CMOS image sensors and stacked memories continue to drive 3-D... http://www.semiconductor.net/article/196414-SMIC_Lays_Foundation_for_Shenzhen_Fab.php?rssid=20225 http://www.semiconductor.net/article/196414-SMIC_Lays_Foundation_for_Shenzhen_Fab.php?rssid=20225 Mon, 30 Jun 2008 14:33:00 GMT Semiconductor Manufacturing International Corp. (SMIC) kicked off construction of the 200 mm fab... http://www.semiconductor.net/article/197648-IBM_Takes_Gloves_Off_for_32_nm_Low_Power_Competition_With_TSMC.php?rssid=20225 http://www.semiconductor.net/article/197648-IBM_Takes_Gloves_Off_for_32_nm_Low_Power_Competition_With_TSMC.php?rssid=20225 Thu, 26 Jun 2008 16:48:00 GMT IBM engineers described the Fishkill alliance’s low-power 32 nm process technology, which... http://www.semiconductor.net/article/205420-Sematech_Reports_Progress_at_VLSI_Meeting.php?rssid=20225 http://www.semiconductor.net/article/205420-Sematech_Reports_Progress_at_VLSI_Meeting.php?rssid=20225 Mon, 23 Jun 2008 15:52:00 GMT At the 2008 Symposium on VLSI Technology, Sematech researchers described progress with gallium... http://www.semiconductor.net/article/199516-Intel_Scales_Floating_Body_Cell_Memory.php?rssid=20225 http://www.semiconductor.net/article/199516-Intel_Scales_Floating_Body_Cell_Memory.php?rssid=20225 Thu, 19 Jun 2008 15:51:00 GMT Intel researchers presented a planar floating body cell (FBC) memory at the Symposium on VLSI... http://www.semiconductor.net/article/198965-Aviza_Develops_Etch_PVD_CVD_Tool_for_3_D_IC_R_D.php?rssid=20225 http://www.semiconductor.net/article/198965-Aviza_Develops_Etch_PVD_CVD_Tool_for_3_D_IC_R_D.php?rssid=20225 Tue, 17 Jun 2008 14:22:00 GMT Aviza is offering a small-footprint cluster tool targeted for 3-D ICs using through-silicon vias... http://www.semiconductor.net/article/196900-VLSI_Research_Ranks_Top_Equipment_Vendors.php?rssid=20225 http://www.semiconductor.net/article/196900-VLSI_Research_Ranks_Top_Equipment_Vendors.php?rssid=20225 Wed, 11 Jun 2008 15:50:00 GMT Keithley Instruments, SEN Corp. and Varian Semiconductor came out on top in their respective... http://www.semiconductor.net/article/202390-SMIC_Says_45_nm_Process_Ready_Next_Year.php?rssid=20225 http://www.semiconductor.net/article/202390-SMIC_Says_45_nm_Process_Ready_Next_Year.php?rssid=20225 Tue, 10 Jun 2008 14:15:00 GMT SMIC plans to have its 45 nm process in volume production by the second half of 2009, starting... http://www.semiconductor.net/article/199519-Intel_May_Be_Pushing_Applied_to_Buy_ASMI.php?rssid=20225 http://www.semiconductor.net/article/199519-Intel_May_Be_Pushing_Applied_to_Buy_ASMI.php?rssid=20225 Mon, 09 Jun 2008 16:37:00 GMT Gartner Inc. equipment analyst Dean Freeman said the bid by Applied Materials to buy the ALD and... http://www.semiconductor.net/article/201664-Applied_Makes_Unsolicited_Offer_for_ASMI_s_Crown_Jewels.php?rssid=20225 http://www.semiconductor.net/article/201664-Applied_Makes_Unsolicited_Offer_for_ASMI_s_Crown_Jewels.php?rssid=20225 Fri, 06 Jun 2008 12:28:00 GMT ASM International NV (Bilthoven, Netherlands) said it received a verbal offer from Applied... http://www.semiconductor.net/article/205080-IITC_Papers_Range_From_Plasma_Modeling_to_Copper_Encapsulation_Techniques.php?rssid=20225 http://www.semiconductor.net/article/205080-IITC_Papers_Range_From_Plasma_Modeling_to_Copper_Encapsulation_Techniques.php?rssid=20225 Wed, 04 Jun 2008 13:51:00 GMT Papers presented at this week's International Interconnect Technology Conference (IITC) include... http://www.semiconductor.net/article/199136-IMEC_Aixtron_Partner_on_GaN_Deposition.php?rssid=20225 http://www.semiconductor.net/article/199136-IMEC_Aixtron_Partner_on_GaN_Deposition.php?rssid=20225 Tue, 03 Jun 2008 16:48:00 GMT IMEC and Aixtron AG have developed a gallium nitride (GaN) deposition process on 200 mm silicon... http://www.semiconductor.net/article/208422-OmniVision_TSMC_Develop_Sensor_Technology.php?rssid=20225 http://www.semiconductor.net/article/208422-OmniVision_TSMC_Develop_Sensor_Technology.php?rssid=20225 Tue, 27 May 2008 15:13:00 GMT OmniVision Technologies Inc. said it has developed a backside illumination (BSI) image sensor... http://www.semiconductor.net/article/208621-Denso_Develops_Silicon_Carbide_Process.php?rssid=20225 http://www.semiconductor.net/article/208621-Denso_Develops_Silicon_Carbide_Process.php?rssid=20225 Tue, 27 May 2008 13:10:00 GMT Denso Corp., an electronics supplier to Toyota Motor and others, has developed a unique silicon... http://www.semiconductor.net/article/204862-Novellus_Offers_Dry_Strip_Tools_for_High_Volume_Memory_Advanced_Logic.php?rssid=20225 http://www.semiconductor.net/article/204862-Novellus_Offers_Dry_Strip_Tools_for_High_Volume_Memory_Advanced_Logic.php?rssid=20225 Mon, 19 May 2008 16:08:00 GMT Novellus Systems announced two derivatives to its Gamma Express dry strip and clean platform:... http://www.semiconductor.net/article/198696-Applied_Tackles_Edge_With_Inflexion_Polishing_System.php?rssid=20225 http://www.semiconductor.net/article/198696-Applied_Tackles_Edge_With_Inflexion_Polishing_System.php?rssid=20225 Wed, 07 May 2008 14:24:00 GMT Applied Materials introduced the Inflexion edge polishing system that has an integrated wafer... http://www.semiconductor.net/article/200229-Physical_Analysis_Provides_Images_of_45_nm.php?rssid=20225 http://www.semiconductor.net/article/200229-Physical_Analysis_Provides_Images_of_45_nm.php?rssid=20225 Tue, 06 May 2008 13:38:00 GMT Engineers at Chipworks Inc. (Ottawa, Canada) have uncovered many physical details of the 65 and... http://www.semiconductor.net/article/204117-Real_Men_Women_Do_Have_Fabs.php?rssid=20225 http://www.semiconductor.net/article/204117-Real_Men_Women_Do_Have_Fabs.php?rssid=20225 Wed, 30 Apr 2008 13:54:00 GMT Tom Sonderman, vice president of manufacturing technology at Advanced Micro Devices (AMD,... http://www.semiconductor.net/article/201988-TSMC_Ramping_Aggressive_CPU_Process_Push.php?rssid=20225 http://www.semiconductor.net/article/201988-TSMC_Ramping_Aggressive_CPU_Process_Push.php?rssid=20225 Tue, 29 Apr 2008 15:10:00 GMT TSMC is “hiring aggressively” to develop a technology platform for CPU production, said CEO... http://www.semiconductor.net/article/207109-TSMC_Sketches_32_nm_Rollout_Plan_for_2009.php?rssid=20225 http://www.semiconductor.net/article/207109-TSMC_Sketches_32_nm_Rollout_Plan_for_2009.php?rssid=20225 Mon, 28 Apr 2008 15:09:00 GMT Taiwan Semiconductor Manufacturing Co. Ltd. plans to begin 32 nm production in the third quarter... http://www.semiconductor.net/article/205177-Air_Gaps_Unlikely_Becoming_More_Likely_.php?rssid=20225 http://www.semiconductor.net/article/205177-Air_Gaps_Unlikely_Becoming_More_Likely_.php?rssid=20225 Wed, 23 Apr 2008 13:44:00 GMT The upcoming International Interconnect Technology Conference (IITC) will feature papers on the... http://www.semiconductor.net/article/201822-IBM_Alliance_Partners_Open_For_Business_for_32_nm_High_k_Metal_Gate_Designs.php?rssid=20225 http://www.semiconductor.net/article/201822-IBM_Alliance_Partners_Open_For_Business_for_32_nm_High_k_Metal_Gate_Designs.php?rssid=20225 Mon, 14 Apr 2008 16:48:00 GMT IBM and its six process development partners working at Fishkill, N.Y., said their 32 nm design... http://www.semiconductor.net/article/200820-Aviza_Announces_Major_Restructuring.php?rssid=20225 http://www.semiconductor.net/article/200820-Aviza_Announces_Major_Restructuring.php?rssid=20225 Sun, 06 Apr 2008 20:45:00 GMT Aviza Technology Inc. (Scotts Valley, Calif.) said it will undergo a “significant... http://www.semiconductor.net/article/198238-VLSI_Technology_Symposium_Takes_on_Nanowires_FinFETs_High_k_Metal_Gate_Challenges.php?rssid=20225 http://www.semiconductor.net/article/198238-VLSI_Technology_Symposium_Takes_on_Nanowires_FinFETs_High_k_Metal_Gate_Challenges.php?rssid=20225 Tue, 01 Apr 2008 15:46:00 GMT The 2008 VLSI Technology Symposium, planned for June 17-19 in Honolulu, includes presentations... http://www.semiconductor.net/article/199134-TSMC_Readies_40_nm_Process_Technology.php?rssid=20225 http://www.semiconductor.net/article/199134-TSMC_Readies_40_nm_Process_Technology.php?rssid=20225 Mon, 24 Mar 2008 15:41:00 GMT TSMC said its 40 nm technology will see first production in the second quarter, with a 15%... http://www.semiconductor.net/article/206701-Lee_China_Seeks_Equipment_Development.php?rssid=20225 http://www.semiconductor.net/article/206701-Lee_China_Seeks_Equipment_Development.php?rssid=20225 Mon, 24 Mar 2008 11:53:00 GMT China is overly dependent on chip imports and needs to develop its domestic infrastructure for... http://www.semiconductor.net/article/203954-IBM_Brings_Hitachi_Into_Albany_Ecosystem.php?rssid=20225 http://www.semiconductor.net/article/203954-IBM_Brings_Hitachi_Into_Albany_Ecosystem.php?rssid=20225 Tue, 11 Mar 2008 10:29:00 GMT IBM and Hitachi researchers will work together on metrology challenges arising at the 22 nm node... http://www.semiconductor.net/article/202409-Sumitomo_Ups_Ante_for_Axcelis_Offers_6_per_Share.php?rssid=20225 http://www.semiconductor.net/article/202409-Sumitomo_Ups_Ante_for_Axcelis_Offers_6_per_Share.php?rssid=20225 Mon, 10 Mar 2008 16:46:00 GMT Sumitomo Heavy Industries said it will offer $6 for each share of Axcelis Technologies stock,... http://www.semiconductor.net/article/198377-Bardeen_Honored_With_Postage_Stamp.php?rssid=20225 http://www.semiconductor.net/article/198377-Bardeen_Honored_With_Postage_Stamp.php?rssid=20225 Fri, 07 Mar 2008 22:20:00 GMT A United States postage stamp commemorating the achievements of two-time Nobel Prize-winner John... http://www.semiconductor.net/article/201233-ACM_Research_Expanding_in_Shanghai.php?rssid=20225 http://www.semiconductor.net/article/201233-ACM_Research_Expanding_in_Shanghai.php?rssid=20225 Wed, 05 Mar 2008 13:31:00 GMT ACM Research Inc. (Fremont, Calif.) said it plans to expand its Shanghai R&D, production and... http://www.semiconductor.net/article/203629-AMD_Demos_45_nm_Processors_at_CeBit.php?rssid=20225 http://www.semiconductor.net/article/203629-AMD_Demos_45_nm_Processors_at_CeBit.php?rssid=20225 Tue, 04 Mar 2008 14:20:00 GMT AMD said it has demonstrated quad-core processors manufactured at 45 nm design rules at the... http://www.semiconductor.net/article/197308-Freescale_Forging_Ahead_to_45_nm_in_2008.php?rssid=20225 http://www.semiconductor.net/article/197308-Freescale_Forging_Ahead_to_45_nm_in_2008.php?rssid=20225 Tue, 04 Mar 2008 13:23:00 GMT Freescale Semiconductor Inc. will begin sampling networking chips using 45 nm design rules by... http://www.semiconductor.net/article/202107-Oxford_Instruments_Plasma_Technology_Announces_Record_Sales_in_February.php?rssid=20225 http://www.semiconductor.net/article/202107-Oxford_Instruments_Plasma_Technology_Announces_Record_Sales_in_February.php?rssid=20225 Mon, 03 Mar 2008 15:36:00 GMT Oxford Instruments Plasma Technology Ltd. said it received orders for 20 systems in February,... http://www.semiconductor.net/article/201263-Freescale_Pushing_MRAM_Technology_Toward_Automotive_Goal.php?rssid=20225 http://www.semiconductor.net/article/201263-Freescale_Pushing_MRAM_Technology_Toward_Automotive_Goal.php?rssid=20225 Thu, 28 Feb 2008 14:41:00 GMT Freescale Semiconductor is gradually moving its magneto-resistive random access memory (MRAM)... http://www.semiconductor.net/article/200923-Applied_Materials_Patterning_Requires_Innovative_Metrology.php?rssid=20225 http://www.semiconductor.net/article/200923-Applied_Materials_Patterning_Requires_Innovative_Metrology.php?rssid=20225 Thu, 28 Feb 2008 13:58:00 GMT Applied Materials (Santa Clara, Calif.) concurrently held its 12th Annual Technology Forum with... http://www.semiconductor.net/article/207074-RHEM_IBM_to_Collaborate_on_CMP_Technology.php?rssid=20225 http://www.semiconductor.net/article/207074-RHEM_IBM_to_Collaborate_on_CMP_Technology.php?rssid=20225 Wed, 27 Feb 2008 15:04:00 GMT Rohm and Haas Electronic Materials (RHEM), CMP Technologies (Phoenix), a supplier of polishing... http://www.semiconductor.net/article/202470-Implant_Sciences_Seeks_to_Sell_its_Core_Implant_Services_Unit.php?rssid=20225 http://www.semiconductor.net/article/202470-Implant_Sciences_Seeks_to_Sell_its_Core_Implant_Services_Unit.php?rssid=20225 Thu, 21 Feb 2008 15:46:00 GMT Implant Sciences Corp. said it plans to sell its “Core” semiconductor subsidiary, which... http://www.semiconductor.net/article/207941-3_D_Analysis_Progressing_to_Meet_Device_Needs.php?rssid=20225 http://www.semiconductor.net/article/207941-3_D_Analysis_Progressing_to_Meet_Device_Needs.php?rssid=20225 Tue, 12 Feb 2008 14:41:00 GMT Although there are several tools and concepts available, the analysis of ultrashallow junctions... http://www.semiconductor.net/article/200445-Sumitomo_Makes_Takeover_Bid_for_Axcelis.php?rssid=20225 http://www.semiconductor.net/article/200445-Sumitomo_Makes_Takeover_Bid_for_Axcelis.php?rssid=20225 Mon, 11 Feb 2008 23:56:00 GMT Sumitomo Heavy Industries (Tokyo) unveiled a takeover bid, valued at $544M, for ion implant... http://www.semiconductor.net/article/200105-Heterogeneous_Channels_A_Goal_of_EC_s_Duallogic_Project.php?rssid=20225 http://www.semiconductor.net/article/200105-Heterogeneous_Channels_A_Goal_of_EC_s_Duallogic_Project.php?rssid=20225 Mon, 11 Feb 2008 14:43:00 GMT A European research project aimed at combining germanium channels for the PMOS and III-V... http://www.semiconductor.net/article/197058-TI_Pushes_Junctions_in_45_nm_Transistors.php?rssid=20225 http://www.semiconductor.net/article/197058-TI_Pushes_Junctions_in_45_nm_Transistors.php?rssid=20225 Thu, 07 Feb 2008 15:45:00 GMT Texas Instruments Inc. created “significantly more abrupt junctions" and thinned the gate... http://www.semiconductor.net/article/204314-SMIC_to_Expand_With_Two_Fabs_in_Shenzhen.php?rssid=20225 http://www.semiconductor.net/article/204314-SMIC_to_Expand_With_Two_Fabs_in_Shenzhen.php?rssid=20225 Wed, 30 Jan 2008 13:55:00 GMT Semiconductor Manufacturing International Corp. (SMIC, Shanghai) said it will build an R&D... http://www.semiconductor.net/article/196562-Lam_Research_Sees_Foundry_Spending_as_Bright_Hope_for_2008.php?rssid=20225 http://www.semiconductor.net/article/196562-Lam_Research_Sees_Foundry_Spending_as_Bright_Hope_for_2008.php?rssid=20225 Fri, 25 Jan 2008 20:25:00 GMT Lam Research Corp. CEO Steve Newberry said foundry capital investments could increase sharply in... http://www.semiconductor.net/article/201659-Roadmap_Dictated_by_Flash_More_Than_Moore.php?rssid=20225 http://www.semiconductor.net/article/201659-Roadmap_Dictated_by_Flash_More_Than_Moore.php?rssid=20225 Fri, 25 Jan 2008 15:41:00 GMT The 2007 edition of the International Technology Roadmap for Semiconductors (ITRS) projects the... http://www.semiconductor.net/article/200749-Sematech_Announces_Meetings_Lineup_for_2008.php?rssid=20225 http://www.semiconductor.net/article/200749-Sematech_Announces_Meetings_Lineup_for_2008.php?rssid=20225 Thu, 24 Jan 2008 16:34:00 GMT Sematech announced its 2008 meetings on lithography and other semiconductor-related research... http://www.semiconductor.net/article/201295-IMEC_to_Establish_Research_Center_in_Hsinchu_Taiwan.php?rssid=20225 http://www.semiconductor.net/article/201295-IMEC_to_Establish_Research_Center_in_Hsinchu_Taiwan.php?rssid=20225 Wed, 23 Jan 2008 16:25:00 GMT IMEC (Leuven, Belgium) said that it has established a representative office, IMEC Taiwan, in the... http://www.semiconductor.net/article/201192-CMOS_on_110_Silicon_May_Have_Cost_Appeal.php?rssid=20225 http://www.semiconductor.net/article/201192-CMOS_on_110_Silicon_May_Have_Cost_Appeal.php?rssid=20225 Wed, 23 Jan 2008 15:01:00 GMT Fabbing CMOS on (110)-oriented silicon may provide a low-cost performance boost, although much... http://www.semiconductor.net/article/198901-Fujitsu_to_Spin_Chip_Operations_Into_New_Subsidiary.php?rssid=20225 http://www.semiconductor.net/article/198901-Fujitsu_to_Spin_Chip_Operations_Into_New_Subsidiary.php?rssid=20225 Mon, 21 Jan 2008 12:08:00 GMT Fujitsu said it will spin-out its semiconductor operations into a subsidiary and shift its... http://www.semiconductor.net/article/204003-Applied_Microstructures_Appoints_Aitchison_as_CEO.php?rssid=20225 http://www.semiconductor.net/article/204003-Applied_Microstructures_Appoints_Aitchison_as_CEO.php?rssid=20225 Tue, 15 Jan 2008 23:57:00 GMT Applied Microstructures Inc. (San Jose), which sells molecular vapor deposition (MVD) equipment... http://www.semiconductor.net/article/198538-Unexpected_nFET_Gains_for_110_Silicon.php?rssid=20225 http://www.semiconductor.net/article/198538-Unexpected_nFET_Gains_for_110_Silicon.php?rssid=20225 Mon, 14 Jan 2008 16:27:00 GMT In what could be a significant breakthrough, Sematech researchers have found major performance... http://www.semiconductor.net/article/203341-Entrepix_Hires_Mello_Adds_SEZ_Capabilities.php?rssid=20225 http://www.semiconductor.net/article/203341-Entrepix_Hires_Mello_Adds_SEZ_Capabilities.php?rssid=20225 Thu, 10 Jan 2008 16:14:00 GMT Entrepix Inc. will add surface conditioning services, based on SEZ technology, as a complement... http://www.semiconductor.net/article/204749-Heterogeneous_CMOS_Gaining_Momentum.php?rssid=20225 http://www.semiconductor.net/article/204749-Heterogeneous_CMOS_Gaining_Momentum.php?rssid=20225 Thu, 10 Jan 2008 15:09:00 GMT Research groups and equipment companies are stepping up research into heterogeneous CMOS. One... http://www.semiconductor.net/article/201918-Toshiba_CEO_Comments_on_SOI.php?rssid=20225 http://www.semiconductor.net/article/201918-Toshiba_CEO_Comments_on_SOI.php?rssid=20225 Wed, 09 Jan 2008 15:32:00 GMT Toshiba Corp. plans to target the Cell processor to its bulk CMOS process, using the modified... http://www.semiconductor.net/article/205285-MIRAI_Team_Studies_Threshold_Voltage_Variation_Causes.php?rssid=20225 http://www.semiconductor.net/article/205285-MIRAI_Team_Studies_Threshold_Voltage_Variation_Causes.php?rssid=20225 Mon, 07 Jan 2008 15:33:00 GMT A team of researchers at Japan’s MIRAI research consortium has studied the role of dopant... http://www.semiconductor.net/article/207686-PCM_Technology_Intel_Says_Probably_but_Hurdles_Remain.php?rssid=20225 http://www.semiconductor.net/article/207686-PCM_Technology_Intel_Says_Probably_but_Hurdles_Remain.php?rssid=20225 Thu, 03 Jan 2008 13:46:00 GMT Al Fazio, Intel Fellow and technology and manufacturing group director, memory technology... http://www.semiconductor.net/article/207930-Interconnect_Conference_Expands_Scope.php?rssid=20225 http://www.semiconductor.net/article/207930-Interconnect_Conference_Expands_Scope.php?rssid=20225 Wed, 02 Jan 2008 13:49:00 GMT After celebrating its 10th anniversary, the International Interconnect Technology Conference... http://www.semiconductor.net/article/201945-IBM_Licenses_45_nm_Technology_to_SMIC.php?rssid=20225 http://www.semiconductor.net/article/201945-IBM_Licenses_45_nm_Technology_to_SMIC.php?rssid=20225 Wed, 26 Dec 2007 12:41:00 GMT IBM Corp. (Armonk, N.Y.) will license its 45 nm bulk CMOS technology to Semiconductor... http://www.semiconductor.net/article/198111-1_THz_InP_Transistor_Claims_Speed_Record.php?rssid=20225 http://www.semiconductor.net/article/198111-1_THz_InP_Transistor_Claims_Speed_Record.php?rssid=20225 Thu, 20 Dec 2007 14:16:00 GMT Northrop Grumman Corp. (Redondo Beach, Calif.) is claiming a new world record for transistor... http://www.semiconductor.net/article/207968-Toshiba_Joins_IBM_Alliance_for_32_nm_Bulk_Process_Development.php?rssid=20225 http://www.semiconductor.net/article/207968-Toshiba_Joins_IBM_Alliance_for_32_nm_Bulk_Process_Development.php?rssid=20225 Tue, 18 Dec 2007 16:37:00 GMT Toshiba Corp. said it will extend its participation in the IBM Alliance. For two years, Toshiba... http://www.semiconductor.net/article/208435-Pellerin_Peers_Down_AMD_Process_Options.php?rssid=20225 http://www.semiconductor.net/article/208435-Pellerin_Peers_Down_AMD_Process_Options.php?rssid=20225 Tue, 18 Dec 2007 14:51:00 GMT Advanced Micro Device's (AMD) John Pellerin, director of logic technology development and the... http://www.semiconductor.net/article/207942-Intel_Takes_45_nm_HKMG_Process_to_IEDM.php?rssid=20225 http://www.semiconductor.net/article/207942-Intel_Takes_45_nm_HKMG_Process_to_IEDM.php?rssid=20225 Fri, 14 Dec 2007 18:30:00 GMT Intel Corp.'s "high-k first, metal gate last" 45 nm process technology, the first to use... http://www.semiconductor.net/article/198103-ISI_Describes_Gen2_Z_RAM_Memory.php?rssid=20225 http://www.semiconductor.net/article/198103-ISI_Describes_Gen2_Z_RAM_Memory.php?rssid=20225 Thu, 13 Dec 2007 12:08:00 GMT Innovative Silicon Inc. (Lausanne, Switzerland) chief scientist Serguei Okhonin described the... http://www.semiconductor.net/article/208617-TSMC_Unveils_45_nm_HP_Process_at_IEDM.php?rssid=20225 http://www.semiconductor.net/article/208617-TSMC_Unveils_45_nm_HP_Process_at_IEDM.php?rssid=20225 Wed, 12 Dec 2007 10:21:00 GMT TSMC presented its high-performance 45 nm process at the International Electron Devices Meeting... http://www.semiconductor.net/article/197349-IMEC_Reports_Progress_on_High_k_Metal_Gates.php?rssid=20225 http://www.semiconductor.net/article/197349-IMEC_Reports_Progress_on_High_k_Metal_Gates.php?rssid=20225 Tue, 11 Dec 2007 16:11:00 GMT At IEEE’s International Electron Devices Meeting (IEDM), IMEC (Leuven, Belgium) reported... http://www.semiconductor.net/article/208220-Equipment_CTOs_See_Memory_Opportunities.php?rssid=20225 http://www.semiconductor.net/article/208220-Equipment_CTOs_See_Memory_Opportunities.php?rssid=20225 Tue, 11 Dec 2007 11:45:00 GMT Equipment technologists came to the International Electron Devices Meeting (IEDM), being held... http://www.semiconductor.net/article/203457-IBM_Alliance_Develops_32_nm_High_k_Metal_Gate_SRAM.php?rssid=20225 http://www.semiconductor.net/article/203457-IBM_Alliance_Develops_32_nm_High_k_Metal_Gate_SRAM.php?rssid=20225 Mon, 10 Dec 2007 04:01:00 GMT The IBM-led Fishkill alliance said it has fabbed a 32 nm SRAM array, using high-k/metal gate... http://www.semiconductor.net/article/198543-Intel_Takes_45_nm_Process_to_IEDM_Shows_Variability_Data.php?rssid=20225 http://www.semiconductor.net/article/198543-Intel_Takes_45_nm_Process_to_IEDM_Shows_Variability_Data.php?rssid=20225 Fri, 07 Dec 2007 13:35:00 GMT Intel researchers will go to next week's IEDM to present details on the 45 nm high-k/metal... http://www.semiconductor.net/article/197529-Sematech_High_k_Research_Goes_On_Stage_at_IEDM.php?rssid=20225 http://www.semiconductor.net/article/197529-Sematech_High_k_Research_Goes_On_Stage_at_IEDM.php?rssid=20225 Thu, 06 Dec 2007 12:01:00 GMT Sematech researchers will present papers on high-k and metal gate research work, flash annealing... http://www.semiconductor.net/article/201473-AMEC_Enters_Etch_HPCVD_Tool_Markets.php?rssid=20225 http://www.semiconductor.net/article/201473-AMEC_Enters_Etch_HPCVD_Tool_Markets.php?rssid=20225 Thu, 06 Dec 2007 01:49:00 GMT Shanghai-based Advanced Micro-Fabrication Equipment Inc. (AMEC)  launched its official entry... http://www.semiconductor.net/article/197572-AMAT_s_FullVision_Lam_s_Coronus_Debut.php?rssid=20225 http://www.semiconductor.net/article/197572-AMAT_s_FullVision_Lam_s_Coronus_Debut.php?rssid=20225 Thu, 29 Nov 2007 14:16:00 GMT Applied Materials announced an improved end-point control system called FullVision for its CMP... http://www.semiconductor.net/article/205549-ASM_Hitachi_Kokusai_Sign_ALD_Licensing_Agreement.php?rssid=20225 http://www.semiconductor.net/article/205549-ASM_Hitachi_Kokusai_Sign_ALD_Licensing_Agreement.php?rssid=20225 Wed, 28 Nov 2007 17:52:00 GMT ASM International has licensed its atomic layer deposition (ALD) patents for batch ALD to... http://www.semiconductor.net/article/206879-IEDM_Late_Papers_Push_pFETs_in_110_Silicon_Germanium_SOI.php?rssid=20225 http://www.semiconductor.net/article/206879-IEDM_Late_Papers_Push_pFETs_in_110_Silicon_Germanium_SOI.php?rssid=20225 Sat, 24 Nov 2007 00:03:00 GMT A trio of late papers accepted for presentation at the upcoming International Electron Devices... http://www.semiconductor.net/article/207092-TEL_Joins_Sematech_s_3_D_Interconnect_Program.php?rssid=20225 http://www.semiconductor.net/article/207092-TEL_Joins_Sematech_s_3_D_Interconnect_Program.php?rssid=20225 Thu, 08 Nov 2007 13:34:00 GMT Tokyo Electron Ltd. officially joined Sematech’s 3-D Interconnect Program. TEL's aimed is... http://www.semiconductor.net/article/205166-Chipworks_Doing_Teardown_of_Matsushita_45_nm_UniPhier.php?rssid=20225 http://www.semiconductor.net/article/205166-Chipworks_Doing_Teardown_of_Matsushita_45_nm_UniPhier.php?rssid=20225 Thu, 01 Nov 2007 15:16:00 GMT Chipworks said it has started its teardown analysis of a Matsushita 45 nm SoC, aimed at... http://www.semiconductor.net/article/203798-Electrografting_Proposed_for_Cu_Seed_Layers.php?rssid=20225 http://www.semiconductor.net/article/203798-Electrografting_Proposed_for_Cu_Seed_Layers.php?rssid=20225 Thu, 01 Nov 2007 13:59:00 GMT A new technique called electrografting has been developed by a small French company called... http://www.semiconductor.net/article/199209-NGF_Plan_Seeks_Reduced_First_Wafer_Delay.php?rssid=20225 http://www.semiconductor.net/article/199209-NGF_Plan_Seeks_Reduced_First_Wafer_Delay.php?rssid=20225 Wed, 31 Oct 2007 14:10:00 GMT The 19-point Next Generation Factory (NGF) initiative received much of the attention at the... http://www.semiconductor.net/article/203840-ISMI_Studying_Common_Equipment_Platform.php?rssid=20225 http://www.semiconductor.net/article/203840-ISMI_Studying_Common_Equipment_Platform.php?rssid=20225 Mon, 29 Oct 2007 13:07:00 GMT The ISMI members are studying a common equipment platform, which may standardize the load ports,... http://www.semiconductor.net/article/200377-Chipworks_Begins_Teardown_of_Intel_45_nm_Penryn_MPUs.php?rssid=20225 http://www.semiconductor.net/article/200377-Chipworks_Begins_Teardown_of_Intel_45_nm_Penryn_MPUs.php?rssid=20225 Fri, 26 Oct 2007 18:23:00 GMT Chipworks, a teardown engineering firm based in Ottowa, said it has gotten its hands on Intel's... http://www.semiconductor.net/article/198497-AMD_Building_Advanced_Development_Center_in_Push_for_Shorter_Cycle_Times.php?rssid=20225 http://www.semiconductor.net/article/198497-AMD_Building_Advanced_Development_Center_in_Push_for_Shorter_Cycle_Times.php?rssid=20225 Fri, 26 Oct 2007 14:53:00 GMT As part of its emphasis on small-batch processing, AMD is building an advanced development... http://www.semiconductor.net/article/200168-PECVD_Could_Take_Low_k_to_2_1.php?rssid=20225 http://www.semiconductor.net/article/200168-PECVD_Could_Take_Low_k_to_2_1.php?rssid=20225 Fri, 19 Oct 2007 19:08:00 GMT At the recent IMEC Annual Research Review Meeting this week, Rudi Cartuyvels, department... http://www.semiconductor.net/article/198535-Nobel_Winners_Aided_Semi_HDD_Research.php?rssid=20225 http://www.semiconductor.net/article/198535-Nobel_Winners_Aided_Semi_HDD_Research.php?rssid=20225 Thu, 11 Oct 2007 11:18:00 GMT The work done by semiconductor industry researchers has intertwined with advances made by the... http://www.semiconductor.net/article/205543-EVG_Installs_Bonding_System_for_Thin_Wafers.php?rssid=20225 http://www.semiconductor.net/article/205543-EVG_Installs_Bonding_System_for_Thin_Wafers.php?rssid=20225 Mon, 08 Oct 2007 11:31:00 GMT EV Group said a semiconductor manufacturer has installed a temporary bonding system for... http://www.semiconductor.net/article/200484-A_Step_Up_for_High_k_CMOS.php?rssid=20225 http://www.semiconductor.net/article/200484-A_Step_Up_for_High_k_CMOS.php?rssid=20225 Mon, 01 Oct 2007 06:00:00 GMT Sematech, a consortium of leading semiconductor manufacturers, began operations in 1988 in... http://www.semiconductor.net/article/209142-ALD_Aimed_at_NAND_Flash_Capacitors.php?rssid=20225 http://www.semiconductor.net/article/209142-ALD_Aimed_at_NAND_Flash_Capacitors.php?rssid=20225 Mon, 24 Sep 2007 14:24:00 GMT Atomic layer deposition (ALD) tools are set to make headway in NAND flash ICs, executives... http://www.semiconductor.net/article/205326-Rohm_Haas_Takes_CMP_Pad_for_Copper_Barriers_to_SEMICON_Taiwan.php?rssid=20225 http://www.semiconductor.net/article/205326-Rohm_Haas_Takes_CMP_Pad_for_Copper_Barriers_to_SEMICON_Taiwan.php?rssid=20225 Wed, 12 Sep 2007 11:56:00 GMT Rohm and Haas Electronic Materials introduced a CMP pad that extends the lifetime compared to... http://www.semiconductor.net/article/204158-Alcatel_Ships_DRIE_Tool_to_MEMS_Foundry.php?rssid=20225 http://www.semiconductor.net/article/204158-Alcatel_Ships_DRIE_Tool_to_MEMS_Foundry.php?rssid=20225 Tue, 11 Sep 2007 16:59:00 GMT Alcatel Micro Machining Systems announced that it has shipped an etching tool to foundry Touch... http://www.semiconductor.net/article/197907-Short_Courses_Kick_Off_IEDM.php?rssid=20225 http://www.semiconductor.net/article/197907-Short_Courses_Kick_Off_IEDM.php?rssid=20225 Tue, 04 Sep 2007 13:07:00 GMT The 2007 International Electron Devices Meeting will be preceded by two short courses on CMOS... http://www.semiconductor.net/article/204047-Lam_Ships_Syndion_Etcher_for_TSV_Interconnects.php?rssid=20225 http://www.semiconductor.net/article/204047-Lam_Ships_Syndion_Etcher_for_TSV_Interconnects.php?rssid=20225 Mon, 20 Aug 2007 21:11:00 GMT Targeting the market for 3-D through-silicon via (TSV) etch, Lam Research said it has shipped... http://www.semiconductor.net/article/206777-Major_IC_Investments_in_China_Coming_Online.php?rssid=20225 http://www.semiconductor.net/article/206777-Major_IC_Investments_in_China_Coming_Online.php?rssid=20225 Fri, 17 Aug 2007 14:20:00 GMT With strong government support, China-based companies continue to expand semiconductor... http://www.semiconductor.net/article/206678-Lam_CEO_Optimistic_About_2008_Demand.php?rssid=20225 http://www.semiconductor.net/article/206678-Lam_CEO_Optimistic_About_2008_Demand.php?rssid=20225 Tue, 24 Jul 2007 22:33:00 GMT Count Steve Newberry, president and CEO of etch vendor Lam Research Corp. (Fremont, Calif.),... http://www.semiconductor.net/article/198985-Novellus_Targets_Equipment_at_Memory_Mega_Fabs.php?rssid=20225 http://www.semiconductor.net/article/198985-Novellus_Targets_Equipment_at_Memory_Mega_Fabs.php?rssid=20225 Fri, 20 Jul 2007 19:12:00 GMT Novellus Systems Inc. (San Jose) saw its stock price rise earlier this SEMICON West week on the... http://www.semiconductor.net/article/206416-Latest_Memory_Activity_in_Japan.php?rssid=20225 http://www.semiconductor.net/article/206416-Latest_Memory_Activity_in_Japan.php?rssid=20225 Thu, 19 Jul 2007 06:00:00 GMT The Japanese semiconductor market depended on the growth of the memory manufacture —... http://www.semiconductor.net/article/208883-Roadmap_Diverges.php?rssid=20225 http://www.semiconductor.net/article/208883-Roadmap_Diverges.php?rssid=20225 Thu, 19 Jul 2007 06:00:00 GMT While the International Technology Roadmap for Semiconductors (ITRS) has traditionally focused... http://www.semiconductor.net/article/198533-Panel_Focus_on_More_Than_Moore.php?rssid=20225 http://www.semiconductor.net/article/198533-Panel_Focus_on_More_Than_Moore.php?rssid=20225 Wed, 18 Jul 2007 06:00:00 GMT The concept of “More Than Moore,” which first appeared in the 2005 International Technology... http://www.semiconductor.net/article/203969-Technology_Economic_Challenges_May_Inhibit_32_nm_Adoption.php?rssid=20225 http://www.semiconductor.net/article/203969-Technology_Economic_Challenges_May_Inhibit_32_nm_Adoption.php?rssid=20225 Wed, 18 Jul 2007 06:00:00 GMT The 32 nm technology generation will face a plethora of technical challenges ranging from... http://www.semiconductor.net/article/204520-Gargini_Talks_Tech_Savvy.php?rssid=20225 http://www.semiconductor.net/article/204520-Gargini_Talks_Tech_Savvy.php?rssid=20225 Wed, 18 Jul 2007 06:00:00 GMT Most people expect that semiconductors will be able to continue along the path of Moore’s Law... http://www.semiconductor.net/article/208701-Challenges_of_Preparing_for_32_22_nm.php?rssid=20225 http://www.semiconductor.net/article/208701-Challenges_of_Preparing_for_32_22_nm.php?rssid=20225 Wed, 18 Jul 2007 06:00:00 GMT With 65 nm manufacturing a reality and 45 nm on the near horizon, IDMs and equipment/materials... http://www.semiconductor.net/article/200822-CEA_Leti_and_Alcatel_Micro_Machining_to_Develop_3_D_Interconnect_Processes.php?rssid=20225 http://www.semiconductor.net/article/200822-CEA_Leti_and_Alcatel_Micro_Machining_to_Develop_3_D_Interconnect_Processes.php?rssid=20225 Tue, 17 Jul 2007 12:38:00 GMT CEA-Leti-Minatec (Grenoble, France) and Alcatel Micro Machining Systems (Annecy, France)... http://www.semiconductor.net/article/196766-AMAT_Takes_Wraps_Off_High_k_Chamber.php?rssid=20225 http://www.semiconductor.net/article/196766-AMAT_Takes_Wraps_Off_High_k_Chamber.php?rssid=20225 Tue, 17 Jul 2007 10:45:00 GMT With logic and NAND flash vendors readying production of high-k/metal gate-enhanced chips,... http://www.semiconductor.net/article/201688-Dataquest_Forecast_Sees_Lull_in_Equipment_Spending.php?rssid=20225 http://www.semiconductor.net/article/201688-Dataquest_Forecast_Sees_Lull_in_Equipment_Spending.php?rssid=20225 Wed, 11 Jul 2007 15:42:00 GMT After a strong 2006, the semiconductor equipment industry is in a lull this year and next,... http://www.semiconductor.net/article/200363-Audio_Interview_Gargini_Outlines_Intel_s_Materials_Strategy.php?rssid=20225 http://www.semiconductor.net/article/200363-Audio_Interview_Gargini_Outlines_Intel_s_Materials_Strategy.php?rssid=20225 Thu, 15 Feb 2007 07:00:00 GMT ISS Europe: Paolo Gargini, Intel Fellow and director of technology strategy at Intel Corp., and... http://www.semiconductor.net/article/207577-Finding_Solutions_to_Continued_Scaling_Efforts.php?rssid=20225 http://www.semiconductor.net/article/207577-Finding_Solutions_to_Continued_Scaling_Efforts.php?rssid=20225 Tue, 06 Feb 2007 07:00:00 GMT ISS Europe:In a keynote address, IBM Fellow Tze-Chiang Chen explored the research challenges for... http://www.semiconductor.net/article/198801-Audio_Interview_HP_Design_Breakthrough_Enables_Faster_Chips.php?rssid=20225 http://www.semiconductor.net/article/198801-Audio_Interview_HP_Design_Breakthrough_Enables_Faster_Chips.php?rssid=20225 Mon, 05 Feb 2007 07:00:00 GMT Senior Editor Alexander E. Braun interviewed Stan Williams, Senior HP Fellow and founding...