http://www.semiconductor.net Mon, 09 Nov 2009 20:31:29 MST eng Copyright 2009 Reed Business Information. Subject to its Terms of Use (http://www.semiconductor.net/info/terms-and-conditions.php) http://www.semiconductor.net/article/367207-Sematech_3_D_Program_Provides_Lessons.php?rssid=20231 http://www.semiconductor.net/article/367207-Sematech_3_D_Program_Provides_Lessons.php?rssid=20231 Mon, 02 Nov 2009 18:34:14 GMT Sematech's 3-D interconnect program has provided the equipment and materials industry with a... http://www.semiconductor.net/article/356945-Co_Design_Tools_Moving_Closer_to_Goal.php?rssid=20231 http://www.semiconductor.net/article/356945-Co_Design_Tools_Moving_Closer_to_Goal.php?rssid=20231 Tue, 06 Oct 2009 18:08:10 GMT As chip/package co-design becomes increasingly complex, design tools must keep pace to ensure... http://www.semiconductor.net/article/356905-Qualcomm_s_Nowak_3_D_Faces_Cost_Issues.php?rssid=20231 http://www.semiconductor.net/article/356905-Qualcomm_s_Nowak_3_D_Faces_Cost_Issues.php?rssid=20231 Tue, 06 Oct 2009 14:10:48 GMT Qualcomm Director of Advanced Technology Matt Nowak outlined the cost and technology challenges... http://www.semiconductor.net/article/339622-Elpida_Develops_3_D_Stacked_8_Gb_DRAM.php?rssid=20231 http://www.semiconductor.net/article/339622-Elpida_Develops_3_D_Stacked_8_Gb_DRAM.php?rssid=20231 Fri, 04 Sep 2009 20:01:55 GMT Elpida Memory said it employed copper through-silicon vias in an 8 Gb DRAM that includes eight 1... http://www.semiconductor.net/article/328092-Illumitex_Launches_Into_HB_LED_Market.php?rssid=20231 http://www.semiconductor.net/article/328092-Illumitex_Launches_Into_HB_LED_Market.php?rssid=20231 Thu, 20 Aug 2009 15:32:26 GMT A new startup, Illumitex, is targeting the high-brightness LED market. Vice President of... http://www.semiconductor.net/article/327981-MEMS_Packaging_Headed_to_Wafer_Level.php?rssid=20231 http://www.semiconductor.net/article/327981-MEMS_Packaging_Headed_to_Wafer_Level.php?rssid=20231 Wed, 19 Aug 2009 15:01:16 GMT MEMS packaging may take an evolutionary leap forward into wafer-level packaging, driven by large... http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20231 http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20231 Tue, 28 Jul 2009 15:11:43 GMT GlobalFoundries plans to introduce embedded silicon carbon (eSiC) to strain the nFET transistors... http://www.semiconductor.net/article/315754-3_D_IC_Technology_Continues_to_Advance.php?rssid=20231 http://www.semiconductor.net/article/315754-3_D_IC_Technology_Continues_to_Advance.php?rssid=20231 Mon, 20 Jul 2009 14:01:19 GMT Despite the downturn, several companies announced 3-D interconnect-related advances at last... http://www.semiconductor.net/article/315189-Soitec_to_Support_IBM_s_3_D_Chip_Effort.php?rssid=20231 http://www.semiconductor.net/article/315189-Soitec_to_Support_IBM_s_3_D_Chip_Effort.php?rssid=20231 Tue, 14 Jul 2009 15:16:44 GMT Soitec said it will work with IBM on its memory-on-digital IC development effort, providing... http://www.semiconductor.net/article/311613-ST_Ericsson_Taking_3_D_to_Mobile_Phones.php?rssid=20231 http://www.semiconductor.net/article/311613-ST_Ericsson_Taking_3_D_to_Mobile_Phones.php?rssid=20231 Thu, 09 Jul 2009 14:49:58 GMT ST-Ericsson has a roadmap for commercial wireless products that includes what could be the first... http://www.semiconductor.net/article/307271-Cost_a_Major_Challenge_for_Advanced_Packaging_Solutions.php?rssid=20231 http://www.semiconductor.net/article/307271-Cost_a_Major_Challenge_for_Advanced_Packaging_Solutions.php?rssid=20231 Thu, 02 Jul 2009 14:16:00 GMT Over the past several years, IDMs have seen the price of silicon fabrication fall, while the... http://www.semiconductor.net/article/307273-New_Packaging_Dimensions_Frontiers.php?rssid=20231 http://www.semiconductor.net/article/307273-New_Packaging_Dimensions_Frontiers.php?rssid=20231 Thu, 02 Jul 2009 16:49:00 GMT Packaging technologies are very much at the fore of industry thinking, driven by ICs at 22 nm... http://www.semiconductor.net/article/307240-Wafer_Level_Packaging_in_Africa_.php?rssid=20231 http://www.semiconductor.net/article/307240-Wafer_Level_Packaging_in_Africa_.php?rssid=20231 Wed, 01 Jul 2009 12:11:34 GMT Yes, Africa. Nemotek Technologie is manufacturing wafer-level optics and packaging in its... http://www.semiconductor.net/article/295445-SUSS_MicroTec_3M_Partner_on_3_D_Bonds.php?rssid=20231 http://www.semiconductor.net/article/295445-SUSS_MicroTec_3M_Partner_on_3_D_Bonds.php?rssid=20231 Mon, 22 Jun 2009 15:54:42 GMT SUSS MicroTec AG (Garching, Germany) and 3M Corp. (Minneapolis) will work together, offering... http://www.semiconductor.net/article/277066-Downturn_to_Spur_Shift_to_3_D_Packaging.php?rssid=20231 http://www.semiconductor.net/article/277066-Downturn_to_Spur_Shift_to_3_D_Packaging.php?rssid=20231 Wed, 27 May 2009 15:01:00 GMT The past several semiconductor downturns have resulted in transitions from one generation of... http://www.semiconductor.net/article/232541-Harman_to_Receive_IEEE_Packaging_Award.php?rssid=20231 http://www.semiconductor.net/article/232541-Harman_to_Receive_IEEE_Packaging_Award.php?rssid=20231 Thu, 14 May 2009 16:14:00 GMT George Harman, a retired NIST scientist, will receive the IEEE Components, Packaging and... http://www.semiconductor.net/article/232188-Emtec_Microscope_Tilts_Light_Source.php?rssid=20231 http://www.semiconductor.net/article/232188-Emtec_Microscope_Tilts_Light_Source.php?rssid=20231 Tue, 12 May 2009 15:03:00 GMT Japan-based Emtec Co. Ltd. has developed an optical microscope that uses a slightly tilted light... http://www.semiconductor.net/article/230886-Amkor_Sees_Rebound_Stable_OSAT_Pricing.php?rssid=20231 http://www.semiconductor.net/article/230886-Amkor_Sees_Rebound_Stable_OSAT_Pricing.php?rssid=20231 Thu, 30 Apr 2009 15:26:00 GMT Amkor Technology executives said they expect revenues to jump ~20% in the second quarter, but... http://www.semiconductor.net/article/210195-TI_Ramps_Up_New_Assembly_Test_Facility.php?rssid=20231 http://www.semiconductor.net/article/210195-TI_Ramps_Up_New_Assembly_Test_Facility.php?rssid=20231 Tue, 28 Apr 2009 13:55:00 GMT Texas Instruments’ newest assembly/test facility expands its overall capacity in the... http://www.semiconductor.net/article/204420-SWCNTs_May_Offer_Cooler_Interconnects.php?rssid=20231 http://www.semiconductor.net/article/204420-SWCNTs_May_Offer_Cooler_Interconnects.php?rssid=20231 Mon, 06 Apr 2009 13:52:00 GMT University at Buffalo engineers recently proved with quantum mechanics that single-walled carbon... http://www.semiconductor.net/article/204956-3_D_Equals_Two_Generations_of_Scaling.php?rssid=20231 http://www.semiconductor.net/article/204956-3_D_Equals_Two_Generations_of_Scaling.php?rssid=20231 Thu, 02 Apr 2009 21:26:00 GMT North Carolina State Professor Paul Franzon said the need for 3-D ICs is becoming more acute as... http://www.semiconductor.net/article/197871-Tessera_Working_WLP_Wafer_Level_Optics.php?rssid=20231 http://www.semiconductor.net/article/197871-Tessera_Working_WLP_Wafer_Level_Optics.php?rssid=20231 Wed, 01 Apr 2009 13:52:00 GMT Demand for wafer-level packaging (WLP) is growing, including packages manufactured at the wafer... http://www.semiconductor.net/article/205098-Applied_Disco_to_Develop_Wafer_Thinning_Processes.php?rssid=20231 http://www.semiconductor.net/article/205098-Applied_Disco_to_Develop_Wafer_Thinning_Processes.php?rssid=20231 Mon, 30 Mar 2009 13:43:00 GMT Applied Materials Inc. and Disco Corp. will develop wafer-thinning processes for 3-D... http://www.semiconductor.net/article/208453-Shin_Etsu_MicroSi_Celebrates_20_Years_20_CAGR.php?rssid=20231 http://www.semiconductor.net/article/208453-Shin_Etsu_MicroSi_Celebrates_20_Years_20_CAGR.php?rssid=20231 Tue, 24 Mar 2009 18:59:00 GMT Having established itself as a provider of silicon, the next step for Shin-Etsu MicroSi is in... http://www.semiconductor.net/article/199411-IMAPS_Panelists_Address_Tough_3_D_Challenges.php?rssid=20231 http://www.semiconductor.net/article/199411-IMAPS_Panelists_Address_Tough_3_D_Challenges.php?rssid=20231 Thu, 19 Mar 2009 15:26:00 GMT A panel of experts at the IMAPS Device Packaging Conference considered the challenges facing 3-D... http://www.semiconductor.net/article/205619-IMEC_Develops_Flexible_System_Integration_Process.php?rssid=20231 http://www.semiconductor.net/article/205619-IMEC_Develops_Flexible_System_Integration_Process.php?rssid=20231 Wed, 11 Mar 2009 14:42:00 GMT Researchers from IMEC and Ghent University have developed an integration process aimed at... http://www.semiconductor.net/article/205673-Eclipse_PVD_Tool_Handles_Thinned_Wafers.php?rssid=20231 http://www.semiconductor.net/article/205673-Eclipse_PVD_Tool_Handles_Thinned_Wafers.php?rssid=20231 Thu, 26 Feb 2009 16:24:00 GMT Working with an Austrian mechatronics firm, the OEM Group has developed an MRC Eclipse PVD tool... http://www.semiconductor.net/article/197626-ASE_Leads_Gartner_Packaging_Market_Share_Ranking.php?rssid=20231 http://www.semiconductor.net/article/197626-ASE_Leads_Gartner_Packaging_Market_Share_Ranking.php?rssid=20231 Wed, 25 Feb 2009 16:17:00 GMT The economic downturn may lead to consolidation in the packaging industry, according to Gartner... http://www.semiconductor.net/article/205247-Applied_Materials_Joins_EMC_3D_Consortium.php?rssid=20231 http://www.semiconductor.net/article/205247-Applied_Materials_Joins_EMC_3D_Consortium.php?rssid=20231 Tue, 24 Feb 2009 15:07:00 GMT Applied Materials is now a member of EMC-3D, the international semiconductor equipment and... http://www.semiconductor.net/article/209241-Leti_and_Brewer_Science_Collaborate_on_3_D_MEMS.php?rssid=20231 http://www.semiconductor.net/article/209241-Leti_and_Brewer_Science_Collaborate_on_3_D_MEMS.php?rssid=20231 Mon, 23 Feb 2009 17:30:00 GMT Léti and Brewer Science said they will strengthen their research collaboration on materials... http://www.semiconductor.net/article/198152-Renesas_Subsidiary_Creates_High_Temp_QFN_Like_Package.php?rssid=20231 http://www.semiconductor.net/article/198152-Renesas_Subsidiary_Creates_High_Temp_QFN_Like_Package.php?rssid=20231 Tue, 17 Feb 2009 14:27:00 GMT A Renesas Technology subsidiary has developed a thermal dissipation package that supports a... http://www.semiconductor.net/article/196983-AMEC_Plans_DRIE_for_3_D_Interconnects.php?rssid=20231 http://www.semiconductor.net/article/196983-AMEC_Plans_DRIE_for_3_D_Interconnects.php?rssid=20231 Mon, 09 Feb 2009 17:24:00 GMT AMEC (Singapore) has weathered its first year in business, installing etchers at four locations... http://www.semiconductor.net/article/204125-Electroglas_Asks_For_Strategic_Advice.php?rssid=20231 http://www.semiconductor.net/article/204125-Electroglas_Asks_For_Strategic_Advice.php?rssid=20231 Thu, 05 Feb 2009 16:48:00 GMT Electroglas Inc., which has been in the semiconductor equipment business for 40 years, said it... http://www.semiconductor.net/article/201550-Ziptronix_to_License_3_D_Bonding_Technologies.php?rssid=20231 http://www.semiconductor.net/article/201550-Ziptronix_to_License_3_D_Bonding_Technologies.php?rssid=20231 Tue, 03 Feb 2009 14:27:00 GMT Ziptronix is crafting licensing strategies for its patented 3-D IC bonding technologies that are... http://www.semiconductor.net/article/207835-Intel_to_Close_Five_Manufacturing_Facilities.php?rssid=20231 http://www.semiconductor.net/article/207835-Intel_to_Close_Five_Manufacturing_Facilities.php?rssid=20231 Thu, 22 Jan 2009 00:26:00 GMT Intel said it will close three assembly and test operations in Asia, and shutter Fab 20 in... http://www.semiconductor.net/article/208996-Wafer_Level_Packaging_Trends_Up_in_2009.php?rssid=20231 http://www.semiconductor.net/article/208996-Wafer_Level_Packaging_Trends_Up_in_2009.php?rssid=20231 Wed, 07 Jan 2009 15:03:00 GMT Wafer-level packaging trends include increasing demand, higher I/O, finer pitch, increased power... http://www.semiconductor.net/article/197835-Shin_Etsu_Support_Jig_Handles_Thin_Wafers_for_Reflow_Soldering.php?rssid=20231 http://www.semiconductor.net/article/197835-Shin_Etsu_Support_Jig_Handles_Thin_Wafers_for_Reflow_Soldering.php?rssid=20231 Mon, 05 Jan 2009 14:53:00 GMT Shin-Etsu Polymer Co. Ltd. has developed a jig for handling thin wafers that can endure 260°C... http://www.semiconductor.net/article/196930-ASAT_Prepares_for_Lower_Sales_in_Fiscal_2Q09.php?rssid=20231 http://www.semiconductor.net/article/196930-ASAT_Prepares_for_Lower_Sales_in_Fiscal_2Q09.php?rssid=20231 Wed, 17 Dec 2008 18:53:00 GMT ASAT Holdings Ltd. today announced that revenue was up in the first quarter of fiscal 2009, but... http://www.semiconductor.net/article/197425-Dalsa_Semiconductor_to_License_Alchimer_s_TSV_Coating_Technology.php?rssid=20231 http://www.semiconductor.net/article/197425-Dalsa_Semiconductor_to_License_Alchimer_s_TSV_Coating_Technology.php?rssid=20231 Wed, 17 Dec 2008 18:24:00 GMT Wafer foundry Dalsa Semiconductor has successfully created conformal copper seed layers on... http://www.semiconductor.net/article/200962-STATS_ChipPAC_to_Lay_Off_1600_in_Latest_Restructuring.php?rssid=20231 http://www.semiconductor.net/article/200962-STATS_ChipPAC_to_Lay_Off_1600_in_Latest_Restructuring.php?rssid=20231 Wed, 17 Dec 2008 17:10:00 GMT STATS ChipPAC Ltd. (Singapore) has responded to the global semiconductor downturn with a... http://www.semiconductor.net/article/197404-IEDM_Panel_Processing_Costs_Headed_Up.php?rssid=20231 http://www.semiconductor.net/article/197404-IEDM_Panel_Processing_Costs_Headed_Up.php?rssid=20231 Wed, 17 Dec 2008 14:27:00 GMT With more expensive tools and new process modules coming, IC manufacturers will struggle to... http://www.semiconductor.net/article/199760-Japan_s_3_D_R_D_Consortium_Takes_Shape.php?rssid=20231 http://www.semiconductor.net/article/199760-Japan_s_3_D_R_D_Consortium_Takes_Shape.php?rssid=20231 Mon, 08 Dec 2008 17:53:00 GMT At SEMICON Japan, managers of the government-backed 3-D IC technology development project... http://www.semiconductor.net/article/204532-IEDM_Showcases_Medical_Device_Research.php?rssid=20231 http://www.semiconductor.net/article/204532-IEDM_Showcases_Medical_Device_Research.php?rssid=20231 Thu, 04 Dec 2008 17:28:00 GMT Researchers from IMEC and several U.S. universities will go to the upcoming IEDM conference with... http://www.semiconductor.net/article/203331-Rudolph_NSX_Selected_for_Inspection_of_TSV_Process.php?rssid=20231 http://www.semiconductor.net/article/203331-Rudolph_NSX_Selected_for_Inspection_of_TSV_Process.php?rssid=20231 Wed, 03 Dec 2008 18:38:00 GMT Rudolph Technologies Inc. said that it has installed an NSX 115 Macro Inspection System at a... http://www.semiconductor.net/article/196702-Applied_Announces_TSV_Etcher_In_Fab_Mask_Inspection_Capability.php?rssid=20231 http://www.semiconductor.net/article/196702-Applied_Announces_TSV_Etcher_In_Fab_Mask_Inspection_Capability.php?rssid=20231 Mon, 01 Dec 2008 17:25:00 GMT Applied Materials Inc. announced its Silvia deep silicon etcher for creation of the smooth... http://www.semiconductor.net/article/208401-3_D_TSV_Need_Standards_and_Thermal_Solutions_to_Advance.php?rssid=20231 http://www.semiconductor.net/article/208401-3_D_TSV_Need_Standards_and_Thermal_Solutions_to_Advance.php?rssid=20231 Wed, 19 Nov 2008 14:46:00 GMT Yesterday’s sessions at the 3-D Architectures for Semiconductor Integration and Packaging... http://www.semiconductor.net/article/199831-3_D_Integration_Lacking_in_Design_and_Test_Support.php?rssid=20231 http://www.semiconductor.net/article/199831-3_D_Integration_Lacking_in_Design_and_Test_Support.php?rssid=20231 Tue, 18 Nov 2008 15:13:00 GMT At a symposium yesterday on 3-D integration, leading expert Philip Garrou detailed the rise of... http://www.semiconductor.net/article/204832-3_D_Integration_Development_Threatened_by_Economic_Uncertainty.php?rssid=20231 http://www.semiconductor.net/article/204832-3_D_Integration_Development_Threatened_by_Economic_Uncertainty.php?rssid=20231 Mon, 17 Nov 2008 14:53:00 GMT As presenters and attendees prepare for the opening of this year’s 3-D Architectures for... http://www.semiconductor.net/article/199068-TMV_An_Enabling_Technology_for_Next_Gen_PoP_Requirements.php?rssid=20231 http://www.semiconductor.net/article/199068-TMV_An_Enabling_Technology_for_Next_Gen_PoP_Requirements.php?rssid=20231 Tue, 04 Nov 2008 14:18:00 GMT After years of R&D, testing and customer evaluations, Amkor’s overmolded/laser ablation... http://www.semiconductor.net/article/199870-Kovio_Demonstrates_RFID_Tags_Using_Printed_Electronics.php?rssid=20231 http://www.semiconductor.net/article/199870-Kovio_Demonstrates_RFID_Tags_Using_Printed_Electronics.php?rssid=20231 Thu, 16 Oct 2008 15:27:00 GMT Kovio Inc. (Milpitas, Calif.) announced today at a conference in Chicago that it is... http://www.semiconductor.net/article/198763-Unisem_Takes_Copper_Wire_Bonding_Process_to_Volume_Production.php?rssid=20231 http://www.semiconductor.net/article/198763-Unisem_Takes_Copper_Wire_Bonding_Process_to_Volume_Production.php?rssid=20231 Wed, 15 Oct 2008 15:23:00 GMT Unisem plans to set up 30% of its wire bonders for copper by 2009. The industry’s interest in... http://www.semiconductor.net/article/201419-Interposers_Play_a_Key_Role_in_3_D_ICs.php?rssid=20231 http://www.semiconductor.net/article/201419-Interposers_Play_a_Key_Role_in_3_D_ICs.php?rssid=20231 Wed, 15 Oct 2008 15:07:00 GMT Participants at the Jisso Forum 2008, held recently near Tokyo, emphasized the important role... http://www.semiconductor.net/article/208825-TechSearch_Steady_Growth_Ahead_for_Flip_Chips_WLP.php?rssid=20231 http://www.semiconductor.net/article/208825-TechSearch_Steady_Growth_Ahead_for_Flip_Chips_WLP.php?rssid=20231 Tue, 14 Oct 2008 13:16:00 GMT Flip-chips and wafer-level packaging (WLP) are emerging as industry “bright spots,” with a... http://www.semiconductor.net/article/199642-IMEC_Views_3_D_Stacking_as_System_Design.php?rssid=20231 http://www.semiconductor.net/article/199642-IMEC_Views_3_D_Stacking_as_System_Design.php?rssid=20231 Tue, 14 Oct 2008 12:53:00 GMT IMEC managers said the research center has made significant progress creating test 3-D ICs,... http://www.semiconductor.net/article/196929-NEXX_Licenses_Alchimer_s_Coating_Technology.php?rssid=20231 http://www.semiconductor.net/article/196929-NEXX_Licenses_Alchimer_s_Coating_Technology.php?rssid=20231 Wed, 08 Oct 2008 17:07:00 GMT Alchimer SA (Paris) said it has licensed its eG ViaCoat product for creating conformal copper... http://www.semiconductor.net/article/197594-SUSS_MicroTec_Removes_Schneidewind_as_CEO.php?rssid=20231 http://www.semiconductor.net/article/197594-SUSS_MicroTec_Removes_Schneidewind_as_CEO.php?rssid=20231 Fri, 03 Oct 2008 14:38:00 GMT The supervisory board of German equipment vendor SUSS MicroTec removed Stefan Schneidewind as... http://www.semiconductor.net/article/206524-3_D_Startup_Is_Ahead_of_Its_Time.php?rssid=20231 http://www.semiconductor.net/article/206524-3_D_Startup_Is_Ahead_of_Its_Time.php?rssid=20231 Wed, 01 Oct 2008 13:12:00 GMT As the 3-D integration infrastructure evolves, it is becoming clear that low-cost, reliable... http://www.semiconductor.net/article/200130-Georgia_Tech_Partners_Launch_3_D_Consortium.php?rssid=20231 http://www.semiconductor.net/article/200130-Georgia_Tech_Partners_Launch_3_D_Consortium.php?rssid=20231 Tue, 30 Sep 2008 12:02:00 GMT Georgia Tech’s Microsystems Packaging Research Center (PRC) plans to launch the global... http://www.semiconductor.net/article/207728-DuPont_Adds_to_Its_WLP_Offerings.php?rssid=20231 http://www.semiconductor.net/article/207728-DuPont_Adds_to_Its_WLP_Offerings.php?rssid=20231 Tue, 30 Sep 2008 01:45:00 GMT To meet growing demand for new materials for 3-D packaging and through-silicon vias, DuPont... http://www.semiconductor.net/article/206965-Ambitious_Plan_for_N_Y_Packaging_Center.php?rssid=20231 http://www.semiconductor.net/article/206965-Ambitious_Plan_for_N_Y_Packaging_Center.php?rssid=20231 Tue, 23 Sep 2008 16:59:00 GMT A packaging R&D center supported by IBM and New York officials is likely to begin operations... http://www.semiconductor.net/article/203251-NEC_Electronics_Joins_Fishkill_Alliance.php?rssid=20231 http://www.semiconductor.net/article/203251-NEC_Electronics_Joins_Fishkill_Alliance.php?rssid=20231 Thu, 11 Sep 2008 16:08:00 GMT NEC Electronics has joined the IBM-led Fishkill Alliance, with a goal of implementing NEC’s... http://www.semiconductor.net/article/207740-Seiko_Epson_Says_Resin_Bumping_Reliable.php?rssid=20231 http://www.semiconductor.net/article/207740-Seiko_Epson_Says_Resin_Bumping_Reliable.php?rssid=20231 Wed, 10 Sep 2008 15:46:00 GMT Seiko Epson Corp. said its resin-based gold bumping technology has passed reliability tests,... http://www.semiconductor.net/article/199682-Tegal_Acquires_Alcatel_Micro_Machining_Systems_in_DRIE_Move_Aimed_at_TSVs.php?rssid=20231 http://www.semiconductor.net/article/199682-Tegal_Acquires_Alcatel_Micro_Machining_Systems_in_DRIE_Move_Aimed_at_TSVs.php?rssid=20231 Wed, 03 Sep 2008 16:15:00 GMT Tegal Corp. said it will acquire product lines from Alcatel Micro Machining Systems, giving it a... http://www.semiconductor.net/article/206926-STATS_ChipPAC_to_Manufacture_Infineon_s_First_Gen_eWLB_Products.php?rssid=20231 http://www.semiconductor.net/article/206926-STATS_ChipPAC_to_Manufacture_Infineon_s_First_Gen_eWLB_Products.php?rssid=20231 Thu, 28 Aug 2008 14:12:00 GMT STATS ChipPAC has signed on to provide manufacturing services for products using Infineon’s... http://www.semiconductor.net/article/198853-Dow_Corning_Introduces_Thermal_Interface_Material.php?rssid=20231 http://www.semiconductor.net/article/198853-Dow_Corning_Introduces_Thermal_Interface_Material.php?rssid=20231 Wed, 20 Aug 2008 16:14:00 GMT Dow Corning Corp. said a thermally conductive compound, developed for use in Intel's latest... http://www.semiconductor.net/article/206268-Shin_Etsu_Polymer_Develops_Lightweight_Resin_Frame_for_Thin_Wafers.php?rssid=20231 http://www.semiconductor.net/article/206268-Shin_Etsu_Polymer_Develops_Lightweight_Resin_Frame_for_Thin_Wafers.php?rssid=20231 Wed, 06 Aug 2008 15:49:00 GMT Shin-Etsu Polymer has developed a lightweight resin frame to handle and transport thinned... http://www.semiconductor.net/article/207800-Test_Socket_Industry_Faces_Issues_Scaling_Below_0_4_mm_Pitch.php?rssid=20231 http://www.semiconductor.net/article/207800-Test_Socket_Industry_Faces_Issues_Scaling_Below_0_4_mm_Pitch.php?rssid=20231 Mon, 04 Aug 2008 14:05:00 GMT Shrinking package pitch sizes and higher pin counts are among the many factors forcing the test... http://www.semiconductor.net/article/203111-Alchimer_Claims_Fully_Wet_Via_Solution.php?rssid=20231 http://www.semiconductor.net/article/203111-Alchimer_Claims_Fully_Wet_Via_Solution.php?rssid=20231 Fri, 01 Aug 2008 13:49:00 GMT Alchimer SA said experiments have shown that its “electrografting” technology can handle... http://www.semiconductor.net/article/205801-Release_Film_Boosts_IC_Molding_Productivity.php?rssid=20231 http://www.semiconductor.net/article/205801-Release_Film_Boosts_IC_Molding_Productivity.php?rssid=20231 Wed, 23 Jul 2008 13:48:00 GMT Asahi Glass has developed a release film for molding thin ball grid arrays (BGAs) or chip-scale... http://www.semiconductor.net/article/197052-Molding_Techniques_Support_Thin_Gold_Wires_Low_k_Materials.php?rssid=20231 http://www.semiconductor.net/article/197052-Molding_Techniques_Support_Thin_Gold_Wires_Low_k_Materials.php?rssid=20231 Mon, 21 Jul 2008 14:53:00 GMT Competing Japan-based molding machine manufacturers have developed techniques that support the... http://www.semiconductor.net/article/198745-The_Mobile_Life_Carry_Small_Live_Large.php?rssid=20231 http://www.semiconductor.net/article/198745-The_Mobile_Life_Carry_Small_Live_Large.php?rssid=20231 Thu, 17 Jul 2008 16:00:00 GMT In his keynote address, “The Mobile Renaissance: The Era of Smarter SoCs,” Gadi Singer, vice... http://www.semiconductor.net/article/207127-Roadmap_Signals_Showstoppers.php?rssid=20231 http://www.semiconductor.net/article/207127-Roadmap_Signals_Showstoppers.php?rssid=20231 Thu, 17 Jul 2008 14:00:00 GMT The overall theme of the 2008 update to the International Technology Roadmap for Semiconductors... http://www.semiconductor.net/article/204113-High_Density_Packaging_Possibilities.php?rssid=20231 http://www.semiconductor.net/article/204113-High_Density_Packaging_Possibilities.php?rssid=20231 Wed, 16 Jul 2008 01:40:00 GMT A recent analysis of a high-end cell phone found 65 active single and multi-chip packages (MCPs)... http://www.semiconductor.net/article/197577-Wire_Bond_Tester_Targets_Zero_Field_Failures.php?rssid=20231 http://www.semiconductor.net/article/197577-Wire_Bond_Tester_Targets_Zero_Field_Failures.php?rssid=20231 Tue, 15 Jul 2008 16:00:00 GMT It may soon be possible to non-destructively test wire bond quality in real time during... http://www.semiconductor.net/article/199448-New_Packaging_Technologies_Dominate_Best_of_West_Awards.php?rssid=20231 http://www.semiconductor.net/article/199448-New_Packaging_Technologies_Dominate_Best_of_West_Awards.php?rssid=20231 Fri, 11 Jul 2008 06:00:00 GMT Underscoring the degree of innovation occurring in semiconductor packaging, four of the eight... http://www.semiconductor.net/article/201811-Why_3_D_TSV_is_Hotter_Than_Hot.php?rssid=20231 http://www.semiconductor.net/article/201811-Why_3_D_TSV_is_Hotter_Than_Hot.php?rssid=20231 Fri, 11 Jul 2008 06:00:00 GMT The adoption of 3-D TSV technology promises higher clock rates, lower power dissipation, and... http://www.semiconductor.net/article/203472-iNEMI_Issues_Recommendations_for_Managing_Lead_Free_Solder_Alloys.php?rssid=20231 http://www.semiconductor.net/article/203472-iNEMI_Issues_Recommendations_for_Managing_Lead_Free_Solder_Alloys.php?rssid=20231 Thu, 10 Jul 2008 14:31:00 GMT iNEMI has outlined a set of key approaches to help the electronics industry respond to the many... http://www.semiconductor.net/article/208611-Nvidia_Reports_Thermal_Issues_Caused_Packaging_Failures.php?rssid=20231 http://www.semiconductor.net/article/208611-Nvidia_Reports_Thermal_Issues_Caused_Packaging_Failures.php?rssid=20231 Thu, 03 Jul 2008 13:29:00 GMT Nvidia Corp. said some of its notebook-use graphics chips have failed because of packaging... http://www.semiconductor.net/article/198578-Flip_Chip_Changes_on_the_Horizon.php?rssid=20231 http://www.semiconductor.net/article/198578-Flip_Chip_Changes_on_the_Horizon.php?rssid=20231 Wed, 02 Jul 2008 15:00:00 GMT Flip-chips haven’t changed much since being invented by IBM in the early ’60s, but some... http://www.semiconductor.net/article/201516-TSV_Apps_Need_TSV_Tools.php?rssid=20231 http://www.semiconductor.net/article/201516-TSV_Apps_Need_TSV_Tools.php?rssid=20231 Tue, 01 Jul 2008 15:00:00 GMT While key applications in CMOS image sensors and stacked memories continue to drive 3-D... http://www.semiconductor.net/article/197957-DuPont_Electronic_Raises_Prices_by_20_.php?rssid=20231 http://www.semiconductor.net/article/197957-DuPont_Electronic_Raises_Prices_by_20_.php?rssid=20231 Tue, 24 Jun 2008 16:41:00 GMT DuPont Electronic Technologies said rising energy and transportation costs have forced it to... http://www.semiconductor.net/article/198965-Aviza_Develops_Etch_PVD_CVD_Tool_for_3_D_IC_R_D.php?rssid=20231 http://www.semiconductor.net/article/198965-Aviza_Develops_Etch_PVD_CVD_Tool_for_3_D_IC_R_D.php?rssid=20231 Tue, 17 Jun 2008 14:22:00 GMT Aviza is offering a small-footprint cluster tool targeted for 3-D ICs using through-silicon vias... http://www.semiconductor.net/article/205384-Advantest_Boosts_Tested_Multichip_Packages_per_Hour.php?rssid=20231 http://www.semiconductor.net/article/205384-Advantest_Boosts_Tested_Multichip_Packages_per_Hour.php?rssid=20231 Mon, 16 Jun 2008 16:07:00 GMT Advantest Corp. (Tokyo) has developed two new memory testers designed for multichip package... http://www.semiconductor.net/article/196600-ATE_Industry_Maneuvers_Around_Perfect_Storm_of_Issues_at_90_nm_and_Below.php?rssid=20231 http://www.semiconductor.net/article/196600-ATE_Industry_Maneuvers_Around_Perfect_Storm_of_Issues_at_90_nm_and_Below.php?rssid=20231 Thu, 12 Jun 2008 14:32:00 GMT The combination of discrete challenges, design sensitivity and integration issues are creating... http://www.semiconductor.net/article/204595-Alchimer_Ready_to_Tackle_TSV_Seed_Layer.php?rssid=20231 http://www.semiconductor.net/article/204595-Alchimer_Ready_to_Tackle_TSV_Seed_Layer.php?rssid=20231 Wed, 28 May 2008 14:40:00 GMT Alchimer SA (Massy, France) said it is ready to do business in the 3-D interconnect sector,... http://www.semiconductor.net/article/209163-Mitsubishi_Renesas_Develop_Solder_Tool_for_Fine_Pitch_BGAs.php?rssid=20231 http://www.semiconductor.net/article/209163-Mitsubishi_Renesas_Develop_Solder_Tool_for_Fine_Pitch_BGAs.php?rssid=20231 Wed, 14 May 2008 14:56:00 GMT Engineers from Mitsubishi Electric and Renesas Technology have developed a solder ball machine... http://www.semiconductor.net/article/205305-Freescale_Taking_Redistributed_Chip_Packaging_to_Pilot_Production_Stage.php?rssid=20231 http://www.semiconductor.net/article/205305-Freescale_Taking_Redistributed_Chip_Packaging_to_Pilot_Production_Stage.php?rssid=20231 Mon, 12 May 2008 15:32:00 GMT Freescale Semiconductor Inc. has moved its RCP packaging technology to pilot production,... http://www.semiconductor.net/article/199601-Oki_Integrates_AlGaAs_LEDs_on_Silicon_Mounting_Chips.php?rssid=20231 http://www.semiconductor.net/article/199601-Oki_Integrates_AlGaAs_LEDs_on_Silicon_Mounting_Chips.php?rssid=20231 Thu, 24 Apr 2008 13:02:00 GMT Oki Digital Imaging Corp. is in mass production with LED print heads that use a film bonding... http://www.semiconductor.net/article/205579-STMicro_Kicks_Off_Greater_China_HQ_R_D_Center.php?rssid=20231 http://www.semiconductor.net/article/205579-STMicro_Kicks_Off_Greater_China_HQ_R_D_Center.php?rssid=20231 Thu, 17 Apr 2008 14:00:00 GMT STMicroelectronics kicked off a $25M R&D center at its Greater China headquarters in Shanghai.... http://www.semiconductor.net/article/200597-Gartner_Downgrades_2008_Capex_Spending_Forecast.php?rssid=20231 http://www.semiconductor.net/article/200597-Gartner_Downgrades_2008_Capex_Spending_Forecast.php?rssid=20231 Wed, 16 Apr 2008 14:46:00 GMT Gartner Inc. predicted a 19.8% contraction for 2008 semiconductor capital investments, with the... http://www.semiconductor.net/article/198802-Cutting_Edge_Microelectronics_Manufacturing_Center_Gets_Rolling.php?rssid=20231 http://www.semiconductor.net/article/198802-Cutting_Edge_Microelectronics_Manufacturing_Center_Gets_Rolling.php?rssid=20231 Mon, 14 Apr 2008 20:02:00 GMT Binghamton University officially opened its Center for Advanced Microelectronics Manufacturing... http://www.semiconductor.net/article/201077-SMEE_Shipping_Aligner_for_Back_End_Apps.php?rssid=20231 http://www.semiconductor.net/article/201077-SMEE_Shipping_Aligner_for_Back_End_Apps.php?rssid=20231 Mon, 07 Apr 2008 12:31:00 GMT Shanghai Micro Electronics Equipment Co. Ltd. (SMEE) said its alignment lithography system for... http://www.semiconductor.net/article/203533-iNEMI_Launching_Studies_of_Lead_Free_Alloys.php?rssid=20231 http://www.semiconductor.net/article/203533-iNEMI_Launching_Studies_of_Lead_Free_Alloys.php?rssid=20231 Wed, 02 Apr 2008 14:32:00 GMT The International Electronics Manufacturing Initiative (iNEMI) is forming projects related to... http://www.semiconductor.net/article/201911-3_D_ICs_Are_Cost_Driven_Evolutionary.php?rssid=20231 http://www.semiconductor.net/article/201911-3_D_ICs_Are_Cost_Driven_Evolutionary.php?rssid=20231 Mon, 31 Mar 2008 15:39:00 GMT The evolutionary nature of 3-D IC integration is represented in the way it is being implemented... http://www.semiconductor.net/article/201177-Tessera_Incorporates_TSVs_Into_Optoelectronics_Packaging.php?rssid=20231 http://www.semiconductor.net/article/201177-Tessera_Incorporates_TSVs_Into_Optoelectronics_Packaging.php?rssid=20231 Wed, 19 Mar 2008 06:00:00 GMT Tessera Technologies recently acquired a few smart optics and imaging companies and turned out... http://www.semiconductor.net/article/199320-Test_Packaging_Growth_Hit_7_4_in_2007.php?rssid=20231 http://www.semiconductor.net/article/199320-Test_Packaging_Growth_Hit_7_4_in_2007.php?rssid=20231 Wed, 12 Mar 2008 15:37:00 GMT Gartner Inc. said the worldwide market for semiconductor assembly and test services (SATS) grew... http://www.semiconductor.net/article/197326-SI_China_Names_Six_Influential_Persons_in_China_s_2007_IC_Manufacturing_Industry.php?rssid=20231 http://www.semiconductor.net/article/197326-SI_China_Names_Six_Influential_Persons_in_China_s_2007_IC_Manufacturing_Industry.php?rssid=20231 Tue, 26 Feb 2008 14:56:00 GMT Semiconductor International magazine’s China edition has selected six people who played key... http://www.semiconductor.net/article/204453-Rudolph_Technologies_Joins_Sematech_Metrology_Program.php?rssid=20231 http://www.semiconductor.net/article/204453-Rudolph_Technologies_Joins_Sematech_Metrology_Program.php?rssid=20231 Wed, 20 Feb 2008 13:59:00 GMT Rudolph Technologies Inc. joined the Sematech metrology program, which is based in Albany, N.Y.... http://www.semiconductor.net/article/202645-New_Leadframe_Based_Package_Integrates_QFN_TQFP_Technologies.php?rssid=20231 http://www.semiconductor.net/article/202645-New_Leadframe_Based_Package_Integrates_QFN_TQFP_Technologies.php?rssid=20231 Wed, 06 Feb 2008 14:04:00 GMT Amkor (Chandler, Ariz.) recently debuted “FusionQuad,” a leadframe-based plastic packaging... http://www.semiconductor.net/article/201058-Harmotec_Non_Contact_Pick_up_Tool_Handles_Thin_Wafers_.php?rssid=20231 http://www.semiconductor.net/article/201058-Harmotec_Non_Contact_Pick_up_Tool_Handles_Thin_Wafers_.php?rssid=20231 Wed, 06 Feb 2008 12:35:00 GMT Harmotec Corp. (Tokyo) has developed non-contact wafer pick-up tools for very thin (20 μm) 300... http://www.semiconductor.net/article/199185-ON_Semiconductor_Expands_With_Packaging_Joint_Venture_.php?rssid=20231 http://www.semiconductor.net/article/199185-ON_Semiconductor_Expands_With_Packaging_Joint_Venture_.php?rssid=20231 Tue, 05 Feb 2008 13:22:00 GMT ON Semiconductor Corp. (Phoenix) will move packaging operations for its small outline surface... http://www.semiconductor.net/article/207352-Researchers_Develop_Forward_Looking_Polymer_With_Immediate_Applications.php?rssid=20231 http://www.semiconductor.net/article/207352-Researchers_Develop_Forward_Looking_Polymer_With_Immediate_Applications.php?rssid=20231 Mon, 04 Feb 2008 14:57:00 GMT A team led by researchers from Rensselaer Polytechnic Institute has developed a polymer that... http://www.semiconductor.net/article/201659-Roadmap_Dictated_by_Flash_More_Than_Moore.php?rssid=20231 http://www.semiconductor.net/article/201659-Roadmap_Dictated_by_Flash_More_Than_Moore.php?rssid=20231 Fri, 25 Jan 2008 15:41:00 GMT The 2007 edition of the International Technology Roadmap for Semiconductors (ITRS) projects the... http://www.semiconductor.net/article/203831-Rudolph_Adds_3_D_Bump_Inspection_From_RVSI.php?rssid=20231 http://www.semiconductor.net/article/203831-Rudolph_Adds_3_D_Bump_Inspection_From_RVSI.php?rssid=20231 Tue, 22 Jan 2008 22:23:00 GMT Rudolph Technologies announced that it is buying assets from RVSI Inspection (Hauppauge, N.Y.),... http://www.semiconductor.net/article/198241-Nextreme_Announces_New_Thermoelectric_Platform.php?rssid=20231 http://www.semiconductor.net/article/198241-Nextreme_Announces_New_Thermoelectric_Platform.php?rssid=20231 Wed, 09 Jan 2008 14:00:00 GMT Nextreme Thermal Solutions (Durham, N.C.) announced a version of its thin-film thermal bump... http://www.semiconductor.net/article/199331-JPSA_Awarded_Wafer_Scribing_Patent_in_Korea.php?rssid=20231 http://www.semiconductor.net/article/199331-JPSA_Awarded_Wafer_Scribing_Patent_in_Korea.php?rssid=20231 Mon, 07 Jan 2008 13:46:00 GMT J.P. Sercel Associates said it has received a patent for its laser scribing technology, which... http://www.semiconductor.net/article/207930-Interconnect_Conference_Expands_Scope.php?rssid=20231 http://www.semiconductor.net/article/207930-Interconnect_Conference_Expands_Scope.php?rssid=20231 Wed, 02 Jan 2008 13:49:00 GMT After celebrating its 10th anniversary, the International Interconnect Technology Conference... http://www.semiconductor.net/article/202807-Opportunities_Abound_for_Organic_Packaging_Materials_Development.php?rssid=20231 http://www.semiconductor.net/article/202807-Opportunities_Abound_for_Organic_Packaging_Materials_Development.php?rssid=20231 Wed, 05 Dec 2007 18:36:00 GMT Development of semiconductor organic packaging materials remains focused on improving... http://www.semiconductor.net/article/207079-New_WLP_Technologies_Abound.php?rssid=20231 http://www.semiconductor.net/article/207079-New_WLP_Technologies_Abound.php?rssid=20231 Fri, 30 Nov 2007 15:39:00 GMT Semiconductor chips face constant pressure for increased performances while still decreasing... http://www.semiconductor.net/article/203542-Device_Embedding_and_Stacking_Point_to_Packaging_s_Future.php?rssid=20231 http://www.semiconductor.net/article/203542-Device_Embedding_and_Stacking_Point_to_Packaging_s_Future.php?rssid=20231 Fri, 16 Nov 2007 13:53:00 GMT In the packaging sector of the semiconductor industry, the most significant current trend is... http://www.semiconductor.net/article/201410-S_E_T_Intros_Bonder_for_3_D_Nanoimprint.php?rssid=20231 http://www.semiconductor.net/article/201410-S_E_T_Intros_Bonder_for_3_D_Nanoimprint.php?rssid=20231 Wed, 14 Nov 2007 14:37:00 GMT The latest product to result from the partnership between S.E.T. and CEA-Leti is FC300, a new... http://www.semiconductor.net/article/205093-IMAPS_Report_Heat_Stacking_and_Interconnect_Still_at_Forefront_for_Packaging_Development_Efforts.php?rssid=20231 http://www.semiconductor.net/article/205093-IMAPS_Report_Heat_Stacking_and_Interconnect_Still_at_Forefront_for_Packaging_Development_Efforts.php?rssid=20231 Wed, 14 Nov 2007 13:42:00 GMT Thermal considerations, stacking and connecting electronics to the outside world continue to be... http://www.semiconductor.net/article/208795-Infineon_ASE_Build_Better_BGA.php?rssid=20231 http://www.semiconductor.net/article/208795-Infineon_ASE_Build_Better_BGA.php?rssid=20231 Mon, 12 Nov 2007 17:11:00 GMT Driven by the high-performance and high-I/O needs of mobile applications, Infineon Technologies... http://www.semiconductor.net/article/207092-TEL_Joins_Sematech_s_3_D_Interconnect_Program.php?rssid=20231 http://www.semiconductor.net/article/207092-TEL_Joins_Sematech_s_3_D_Interconnect_Program.php?rssid=20231 Thu, 08 Nov 2007 13:34:00 GMT Tokyo Electron Ltd. officially joined Sematech’s 3-D Interconnect Program. TEL's aimed is... http://www.semiconductor.net/article/197480-STMicro_Expanding_T_A_Operations_in_Longgang_China.php?rssid=20231 http://www.semiconductor.net/article/197480-STMicro_Expanding_T_A_Operations_in_Longgang_China.php?rssid=20231 Tue, 06 Nov 2007 12:43:00 GMT STMicroelectronics is expanding its test and assembly operations in China, commencing... http://www.semiconductor.net/article/204254-STATS_ChipPAC_Second_Phase_Dedicated_to_Advanced_Packaging.php?rssid=20231 http://www.semiconductor.net/article/204254-STATS_ChipPAC_Second_Phase_Dedicated_to_Advanced_Packaging.php?rssid=20231 Mon, 05 Nov 2007 15:44:00 GMT STATS ChipPAC Test Services (Shanghai) Co. Ltd. aims to becomes a “super plant,” offering... http://www.semiconductor.net/article/197628-ePak_Turns_to_SPAC_for_Growth_Capital.php?rssid=20231 http://www.semiconductor.net/article/197628-ePak_Turns_to_SPAC_for_Growth_Capital.php?rssid=20231 Mon, 05 Nov 2007 13:19:00 GMT Steve Dezso, CEO of ePak, said his company employed a SPAC rather than an initial public... http://www.semiconductor.net/article/203798-Electrografting_Proposed_for_Cu_Seed_Layers.php?rssid=20231 http://www.semiconductor.net/article/203798-Electrografting_Proposed_for_Cu_Seed_Layers.php?rssid=20231 Thu, 01 Nov 2007 13:59:00 GMT A new technique called electrografting has been developed by a small French company called... http://www.semiconductor.net/article/203926-3_D_Goes_Beyond_Simplifying_Interconnect.php?rssid=20231 http://www.semiconductor.net/article/203926-3_D_Goes_Beyond_Simplifying_Interconnect.php?rssid=20231 Thu, 18 Oct 2007 16:23:00 GMT A silicon carrier was among the 3-D interconnect topics discussed at IMEC’s annual research... http://www.semiconductor.net/article/198822-IMEC_Advances_Wireless_Brain_and_Heart_Monitors.php?rssid=20231 http://www.semiconductor.net/article/198822-IMEC_Advances_Wireless_Brain_and_Heart_Monitors.php?rssid=20231 Wed, 17 Oct 2007 13:14:00 GMT IMEC said it has developed a brain monitoring system that relies on heat from the forehead to... http://www.semiconductor.net/article/208679-SanDisk_Opens_Shanghai_Packaging_and_Test_Site.php?rssid=20231 http://www.semiconductor.net/article/208679-SanDisk_Opens_Shanghai_Packaging_and_Test_Site.php?rssid=20231 Wed, 17 Oct 2007 10:26:00 GMT SanDisk’s new Shanghai packaging and testing facility is now producing system-in-a-package... http://www.semiconductor.net/article/206604-Sematech_3_D_IC_Workshop_Considers_Thermal_Design_Issues.php?rssid=20231 http://www.semiconductor.net/article/206604-Sematech_3_D_IC_Workshop_Considers_Thermal_Design_Issues.php?rssid=20231 Mon, 24 Sep 2007 19:48:00 GMT A Sematech workshop on 3-D ICs using through-silicon vias (TSVs), planned for next month in... http://www.semiconductor.net/article/197228-3_D_Interconnects_Coming_in_Thin_Phones.php?rssid=20231 http://www.semiconductor.net/article/197228-3_D_Interconnects_Coming_in_Thin_Phones.php?rssid=20231 Tue, 18 Sep 2007 09:31:00 GMT The era of 3-D through-silicon via (TSV) interconnects is only a few years away, spurred by... http://www.semiconductor.net/article/197600-SIA_Yuan_Bump_Equipment_Breaks_Through.php?rssid=20231 http://www.semiconductor.net/article/197600-SIA_Yuan_Bump_Equipment_Breaks_Through.php?rssid=20231 Fri, 14 Sep 2007 13:57:00 GMT In a breakthrough for China’s equipment industry, Shen Yang SIA-Yuan Advanced Semiconductor... http://www.semiconductor.net/article/202029-Conductive_Paste_Proposed_to_Fill_Vias_in_3_D_Interconnects.php?rssid=20231 http://www.semiconductor.net/article/202029-Conductive_Paste_Proposed_to_Fill_Vias_in_3_D_Interconnects.php?rssid=20231 Thu, 06 Sep 2007 16:33:00 GMT A proposed technique to fill 3-D interconnect vias by means of copper paste printing was... http://www.semiconductor.net/article/205096-Gilleo_Joins_Mirror_s_Advisory_Board.php?rssid=20231 http://www.semiconductor.net/article/205096-Gilleo_Joins_Mirror_s_Advisory_Board.php?rssid=20231 Thu, 23 Aug 2007 12:45:00 GMT Ken Gilleo has joined the technical advisory board of Mirror Semiconductor, which develops... http://www.semiconductor.net/article/204047-Lam_Ships_Syndion_Etcher_for_TSV_Interconnects.php?rssid=20231 http://www.semiconductor.net/article/204047-Lam_Ships_Syndion_Etcher_for_TSV_Interconnects.php?rssid=20231 Mon, 20 Aug 2007 21:11:00 GMT Targeting the market for 3-D through-silicon via (TSV) etch, Lam Research said it has shipped... http://www.semiconductor.net/article/206777-Major_IC_Investments_in_China_Coming_Online.php?rssid=20231 http://www.semiconductor.net/article/206777-Major_IC_Investments_in_China_Coming_Online.php?rssid=20231 Fri, 17 Aug 2007 14:20:00 GMT With strong government support, China-based companies continue to expand semiconductor... http://www.semiconductor.net/article/203633-Schmidt_Leads_Buyout_of_SUSS_Bonder_Division_.php?rssid=20231 http://www.semiconductor.net/article/203633-Schmidt_Leads_Buyout_of_SUSS_Bonder_Division_.php?rssid=20231 Tue, 31 Jul 2007 16:12:00 GMT The former president of SUSS MicroTec France (Saint-Jeoire, France), Gaël Schmidt, has led a... http://www.semiconductor.net/article/202123-Henkel_Opens_Yantai_Solder_Sphere_Facility.php?rssid=20231 http://www.semiconductor.net/article/202123-Henkel_Opens_Yantai_Solder_Sphere_Facility.php?rssid=20231 Mon, 30 Jul 2007 18:12:00 GMT Henkel Corp. dedicated its Yantai, China, solder sphere production facility recently, with more... http://www.semiconductor.net/article/205113-Packaging_Market_Continues_to_Coast.php?rssid=20231 http://www.semiconductor.net/article/205113-Packaging_Market_Continues_to_Coast.php?rssid=20231 Thu, 19 Jul 2007 06:00:00 GMT ... http://www.semiconductor.net/article/207453-Everything_From_the_System_to_the_Chip.php?rssid=20231 http://www.semiconductor.net/article/207453-Everything_From_the_System_to_the_Chip.php?rssid=20231 Thu, 19 Jul 2007 06:00:00 GMT The theme of Wednesday’s TechXPOT, sponsored by IMAPS, was “Everything From the Chip to the... http://www.semiconductor.net/article/200822-CEA_Leti_and_Alcatel_Micro_Machining_to_Develop_3_D_Interconnect_Processes.php?rssid=20231 http://www.semiconductor.net/article/200822-CEA_Leti_and_Alcatel_Micro_Machining_to_Develop_3_D_Interconnect_Processes.php?rssid=20231 Tue, 17 Jul 2007 12:38:00 GMT CEA-Leti-Minatec (Grenoble, France) and Alcatel Micro Machining Systems (Annecy, France)... http://www.semiconductor.net/article/201688-Dataquest_Forecast_Sees_Lull_in_Equipment_Spending.php?rssid=20231 http://www.semiconductor.net/article/201688-Dataquest_Forecast_Sees_Lull_in_Equipment_Spending.php?rssid=20231 Wed, 11 Jul 2007 15:42:00 GMT After a strong 2006, the semiconductor equipment industry is in a lull this year and next,... http://www.semiconductor.net/article/204788-3_D_Die_Interconnect_Forecast.php?rssid=20231 http://www.semiconductor.net/article/204788-3_D_Die_Interconnect_Forecast.php?rssid=20231 Thu, 02 Nov 2006 01:31:00 GMT At the 3D Architectures for Semiconductor Integration and Packaging Conference, being held this... http://www.semiconductor.net/article/204074-Study_Shows_Flip_Chip_and_Wafer_Level_Package_Use_Expanding.php?rssid=20231 http://www.semiconductor.net/article/204074-Study_Shows_Flip_Chip_and_Wafer_Level_Package_Use_Expanding.php?rssid=20231 Mon, 16 Oct 2006 06:00:00 GMT The adoption of flip-chip and wafer-level packaging (WLP) is expanding to a wide range of... http://www.semiconductor.net/article/198571-MEMS_Packaging_The_Saga_Continues.php?rssid=20231 http://www.semiconductor.net/article/198571-MEMS_Packaging_The_Saga_Continues.php?rssid=20231 Tue, 02 May 2006 06:00:00 GMT From 2005 to 2010, the MEMS market is expected to have a compound annual growth rate of almost... http://www.semiconductor.net/article/204768-Packaging_Materials_Face_Supply_Pressures.php?rssid=20231 http://www.semiconductor.net/article/204768-Packaging_Materials_Face_Supply_Pressures.php?rssid=20231 Wed, 15 Feb 2006 07:00:00 GMT ISS Europe: Getting a sense of the drivers behind the semiconductor packaging industry, one need... http://www.semiconductor.net/article/199029-Relief_From_the_Heat_Is_It_Possible_.php?rssid=20231 http://www.semiconductor.net/article/199029-Relief_From_the_Heat_Is_It_Possible_.php?rssid=20231 Mon, 13 Feb 2006 07:00:00 GMT Thermal management issues continue to be a hot topic in the semiconductor industry. This year,... http://www.semiconductor.net/article/201730-Tessera_to_Purchase_Shellcase_Technology.php?rssid=20231 http://www.semiconductor.net/article/201730-Tessera_to_Purchase_Shellcase_Technology.php?rssid=20231 Tue, 01 Nov 2005 07:00:00 GMT Tessera Technologies has agreed to purchase Shellcase's IP portfolio, with plans to transfer its... http://www.semiconductor.net/article/203497-Toshiba_Targets_Lead_Free_Conversion_by_End_2005.php?rssid=20231 http://www.semiconductor.net/article/203497-Toshiba_Targets_Lead_Free_Conversion_by_End_2005.php?rssid=20231 Wed, 07 Sep 2005 06:00:00 GMT As part of its transition to lead-free manufacturing, Toshiba announced the availability of its... http://www.semiconductor.net/article/199201-The_Evolution_of_Packaging_Companies.php?rssid=20231 http://www.semiconductor.net/article/199201-The_Evolution_of_Packaging_Companies.php?rssid=20231 Wed, 17 Aug 2005 06:00:00 GMT To help companies find the best approach to a complex packaging evolution, MEPTEC will bring... http://www.semiconductor.net/article/202008-SEM_TEM_of_the_Month.php?rssid=20231 http://www.semiconductor.net/article/202008-SEM_TEM_of_the_Month.php?rssid=20231 Tue, 01 Mar 2005 07:00:00 GMT Don't look now, but Solder Man is winking at you. Dana Fox captured this image at MCNC-RDI... http://www.semiconductor.net/article/207346-Process_Manufactures_High_Volume_Low_Cost_HDI_Substrates.php?rssid=20231 http://www.semiconductor.net/article/207346-Process_Manufactures_High_Volume_Low_Cost_HDI_Substrates.php?rssid=20231 Wed, 01 Aug 2001 06:00:00 GMT Pop quiz: What product is produced at nearly 1 billion ft 2 /year, with precision-located 1µm... http://www.semiconductor.net/article/203261-Fueling_the_Next_Generation_Packaging_Revolution.php?rssid=20231 http://www.semiconductor.net/article/203261-Fueling_the_Next_Generation_Packaging_Revolution.php?rssid=20231 Sun, 01 Jul 2001 06:00:00 GMT "Denser, faster, cheaper" have been the driving forces behind packaging technology for the past... http://www.semiconductor.net/article/209066-High_Temperature_Superconductors_Then_and_Now.php?rssid=20231 http://www.semiconductor.net/article/209066-High_Temperature_Superconductors_Then_and_Now.php?rssid=20231 Fri, 01 Jun 2001 06:00:00 GMT "More important than the light bulb and the transistor" is how Business Week in 1987 described... http://www.semiconductor.net/article/196711-Packaging_Challenges_for_Micro_Optoelectromechanical_Systems.php?rssid=20231 http://www.semiconductor.net/article/196711-Packaging_Challenges_for_Micro_Optoelectromechanical_Systems.php?rssid=20231 Tue, 01 May 2001 06:00:00 GMT When Nobel Prize-winning physicist Richard Feynman spoke at the American Physical Society in... http://www.semiconductor.net/article/208429-The_New_Packaging_Driver_Network_Application_Chips.php?rssid=20231 http://www.semiconductor.net/article/208429-The_New_Packaging_Driver_Network_Application_Chips.php?rssid=20231 Sun, 01 Apr 2001 07:00:00 GMT Packaging technology has always had a performance driver. In the 1980s it was mainframe... http://www.semiconductor.net/article/200031-Meshed_Interconnect_Approach_Reduces_Crosstalk.php?rssid=20231 http://www.semiconductor.net/article/200031-Meshed_Interconnect_Approach_Reduces_Crosstalk.php?rssid=20231 Thu, 01 Mar 2001 07:00:00 GMT As speeds continue to increase for leading-edge processors and other ICs, the challenge of... http://www.semiconductor.net/article/203674-Low_Cost_MEMS_Packaging_Includes_Protective_Cavities.php?rssid=20231 http://www.semiconductor.net/article/203674-Low_Cost_MEMS_Packaging_Includes_Protective_Cavities.php?rssid=20231 Thu, 01 Feb 2001 07:00:00 GMT Among the challenges associated with packaging MEMS devices is providing the appropriate... http://www.semiconductor.net/article/201260-Three_Dimensional_Silicon_Approaches_Are_Increasing.php?rssid=20231 http://www.semiconductor.net/article/201260-Three_Dimensional_Silicon_Approaches_Are_Increasing.php?rssid=20231 Mon, 01 Jan 2001 07:00:00 GMT Demand for large amounts of memory and high functionality in small spaces has caused an increase... http://www.semiconductor.net/article/203255-Thin_Chip_Integration_Provides_Manufacturing_Flexibility.php?rssid=20231 http://www.semiconductor.net/article/203255-Thin_Chip_Integration_Provides_Manufacturing_Flexibility.php?rssid=20231 Fri, 01 Dec 2000 07:00:00 GMT Two of the growing requirements for electronic products such as personal digital assistants and... http://www.semiconductor.net/article/205966-Wafer_Level_Packages_to_Include_Solder_Ball_Support.php?rssid=20231 http://www.semiconductor.net/article/205966-Wafer_Level_Packages_to_Include_Solder_Ball_Support.php?rssid=20231 Wed, 01 Nov 2000 07:00:00 GMT At the advanced technology workshop on chip-scale packaging held by IMAPS in September, a... http://www.semiconductor.net/article/204457-New_SECAP_Consortium_Steps_Into_WLP_Void.php?rssid=20231 http://www.semiconductor.net/article/204457-New_SECAP_Consortium_Steps_Into_WLP_Void.php?rssid=20231 Sun, 01 Oct 2000 06:00:00 GMT Last month, a new consortium was formed to optimize equipment for wafer-level bumping and... http://www.semiconductor.net/article/200187-Power_EMI_and_Thermal_Management_in_One_Unit.php?rssid=20231 http://www.semiconductor.net/article/200187-Power_EMI_and_Thermal_Management_in_One_Unit.php?rssid=20231 Fri, 01 Sep 2000 06:00:00 GMT Incep Technologies (San Diego) recently announced it has signed a prototype development... http://www.semiconductor.net/article/203452-Laser_Pulses_Inspect_Solder_Joints.php?rssid=20231 http://www.semiconductor.net/article/203452-Laser_Pulses_Inspect_Solder_Joints.php?rssid=20231 Tue, 01 Aug 2000 06:00:00 GMT Rising I/O counts and density have increased the use of flip-chip attachment and ball grid... http://www.semiconductor.net/article/201905-Compliant_Leads_Double_as_Probes.php?rssid=20231 http://www.semiconductor.net/article/201905-Compliant_Leads_Double_as_Probes.php?rssid=20231 Sat, 01 Jul 2000 06:00:00 GMT When the industry started moving more seriously into chip-scale packaging, one notable... http://www.semiconductor.net/article/203275-More_Chip_Scale_Packages_.php?rssid=20231 http://www.semiconductor.net/article/203275-More_Chip_Scale_Packages_.php?rssid=20231 Thu, 01 Jun 2000 06:00:00 GMT The number of chip-scale packages (CSPs) has grown dramatically in the last few years. Two years... http://www.semiconductor.net/article/202192-Importance_of_Filler_Engineering_is_Growing.php?rssid=20231 http://www.semiconductor.net/article/202192-Importance_of_Filler_Engineering_is_Growing.php?rssid=20231 Mon, 01 May 2000 06:00:00 GMT Many of the silicone and epoxy materials used in packaging are filled to be electrically or... http://www.semiconductor.net/article/208707-Flip_Chip_Developments_Continue.php?rssid=20231 http://www.semiconductor.net/article/208707-Flip_Chip_Developments_Continue.php?rssid=20231 Sat, 01 Apr 2000 07:00:00 GMT Developments in flip-chip attach continue to grow. New materials developments enable... http://www.semiconductor.net/article/209068-Nepcon_West_Roundup.php?rssid=20231 http://www.semiconductor.net/article/209068-Nepcon_West_Roundup.php?rssid=20231 Sat, 01 Apr 2000 07:00:00 GMT Although the number of exhibitors and visitors at this year's Nepcon West show decreased from... http://www.semiconductor.net/article/202786-Imminent_Changes_for_SOC.php?rssid=20231 http://www.semiconductor.net/article/202786-Imminent_Changes_for_SOC.php?rssid=20231 Wed, 01 Mar 2000 07:00:00 GMT Despite the high potential for performance gains, system-on-a-chip (SOC) implementation remains... http://www.semiconductor.net/article/206330-Pan_Pacific_Microelectronics_Symposium_Highlights.php?rssid=20231 http://www.semiconductor.net/article/206330-Pan_Pacific_Microelectronics_Symposium_Highlights.php?rssid=20231 Wed, 01 Mar 2000 07:00:00 GMT The 1999 Roadmap acknowledges that it is more important to consider the chip, package and... http://www.semiconductor.net/article/196667-MCM_has_Chips_in_Redistribution.php?rssid=20231 http://www.semiconductor.net/article/196667-MCM_has_Chips_in_Redistribution.php?rssid=20231 Tue, 01 Feb 2000 07:00:00 GMT Researchers from Fraunhofer IZM (Berlin), IMEC (Leuven, Belgium) and the Universities of Bonn... http://www.semiconductor.net/article/202687-Roadmap_Emphasizes_Co_Design_Challenge.php?rssid=20231 http://www.semiconductor.net/article/202687-Roadmap_Emphasizes_Co_Design_Challenge.php?rssid=20231 Sat, 01 Jan 2000 07:00:00 GMT The Assembly and Packaging section of the 1999 International Technology Roadmap for...