http://www.semiconductor.net Tue, 10 Nov 2009 05:27:56 MST eng Copyright 2009 Reed Business Information. Subject to its Terms of Use (http://www.semiconductor.net/info/terms-and-conditions.php) http://www.semiconductor.net/article/383103-Nikko_Metals_Offers_Hybrid_450_mm_Wafers.php?rssid=20230 http://www.semiconductor.net/article/383103-Nikko_Metals_Offers_Hybrid_450_mm_Wafers.php?rssid=20230 Fri, 06 Nov 2009 14:08:05 GMT Nikko Metals, a subsidiary of Nippon Mining and Metals, is readying hybrid 450 mm wafers that... http://www.semiconductor.net/article/367207-Sematech_3_D_Program_Provides_Lessons.php?rssid=20230 http://www.semiconductor.net/article/367207-Sematech_3_D_Program_Provides_Lessons.php?rssid=20230 Mon, 02 Nov 2009 18:34:14 GMT Sematech's 3-D interconnect program has provided the equipment and materials industry with a... http://www.semiconductor.net/article/366817-New_Multiferroic_Materials_Promise_Exotic_Devices_Faster_Computing.php?rssid=20230 http://www.semiconductor.net/article/366817-New_Multiferroic_Materials_Promise_Exotic_Devices_Faster_Computing.php?rssid=20230 Thu, 29 Oct 2009 17:28:07 GMT A multidisciplinary collaboration has led to the creation of a new multiferroic material with... http://www.semiconductor.net/article/357702-SOI_Reduces_Dynamic_Power_Wafer_Costs_Coming_Down.php?rssid=20230 http://www.semiconductor.net/article/357702-SOI_Reduces_Dynamic_Power_Wafer_Costs_Coming_Down.php?rssid=20230 Mon, 12 Oct 2009 15:48:42 GMT Silicon-on-insulator (SOI) technology is seeking to penetrate the high-volume market for mobile... http://www.semiconductor.net/article/357080-Leti_Claims_Silicon_Nanowire_Integration_Breakthrough.php?rssid=20230 http://www.semiconductor.net/article/357080-Leti_Claims_Silicon_Nanowire_Integration_Breakthrough.php?rssid=20230 Wed, 07 Oct 2009 15:38:06 GMT Leti researchers have claimed progress in integrating silicon nanowires with CMOS, at... http://www.semiconductor.net/article/354546-IBM_Readies_32_nm_eDRAM_With_Low_Latency.php?rssid=20230 http://www.semiconductor.net/article/354546-IBM_Readies_32_nm_eDRAM_With_Low_Latency.php?rssid=20230 Fri, 18 Sep 2009 20:57:03 GMT IBM unveiled a 32 nm SOI embedded DRAM, and will provide details at the upcoming IEDM in... http://www.semiconductor.net/article/327643-Samsung_Upgrading_Austin_NAND_Fab.php?rssid=20230 http://www.semiconductor.net/article/327643-Samsung_Upgrading_Austin_NAND_Fab.php?rssid=20230 Fri, 14 Aug 2009 19:44:38 GMT Samsung said it will convert an older 200 mm DRAM fab in Austin into a copper BEOL for the... http://www.semiconductor.net/article/326455-Midwest_MicroDevices_Expands_MEMS_Capabilities.php?rssid=20230 http://www.semiconductor.net/article/326455-Midwest_MicroDevices_Expands_MEMS_Capabilities.php?rssid=20230 Tue, 04 Aug 2009 20:05:08 GMT Midwest MicroDevices said it has expanded its technical capabilities. The foundry, which... http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20230 http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20230 Tue, 28 Jul 2009 15:11:43 GMT GlobalFoundries plans to introduce embedded silicon carbon (eSiC) to strain the nFET transistors... http://www.semiconductor.net/article/316566-Pad_Conditioner_Improves_CMP_Efficiency.php?rssid=20230 http://www.semiconductor.net/article/316566-Pad_Conditioner_Improves_CMP_Efficiency.php?rssid=20230 Tue, 28 Jul 2009 13:02:30 GMT Optimization of CMP processes is typically carried out using monitor wafers with off-line... http://www.semiconductor.net/article/315754-3_D_IC_Technology_Continues_to_Advance.php?rssid=20230 http://www.semiconductor.net/article/315754-3_D_IC_Technology_Continues_to_Advance.php?rssid=20230 Mon, 20 Jul 2009 14:01:19 GMT Despite the downturn, several companies announced 3-D interconnect-related advances at last... http://www.semiconductor.net/article/315189-Soitec_to_Support_IBM_s_3_D_Chip_Effort.php?rssid=20230 http://www.semiconductor.net/article/315189-Soitec_to_Support_IBM_s_3_D_Chip_Effort.php?rssid=20230 Tue, 14 Jul 2009 15:16:44 GMT Soitec said it will work with IBM on its memory-on-digital IC development effort, providing... http://www.semiconductor.net/article/307479-ISMI_to_Report_Progress_at_SEMICON_West.php?rssid=20230 http://www.semiconductor.net/article/307479-ISMI_to_Report_Progress_at_SEMICON_West.php?rssid=20230 Mon, 06 Jul 2009 15:16:40 GMT At next week's SEMICON West show, ISMI will meet the supplier community to discuss progress with... http://www.semiconductor.net/article/307037-Sematech_Crafts_ZIL_Solution_for_16_nm.php?rssid=20230 http://www.semiconductor.net/article/307037-Sematech_Crafts_ZIL_Solution_for_16_nm.php?rssid=20230 Mon, 29 Jun 2009 15:34:37 GMT Sematech researchers said a zero interface layer (ZIL) approach has been demonstrated, and may... http://www.semiconductor.net/article/295595-Printable_Electronics_Hits_Display_Needs.php?rssid=20230 http://www.semiconductor.net/article/295595-Printable_Electronics_Hits_Display_Needs.php?rssid=20230 Wed, 24 Jun 2009 14:07:54 GMT Printable electronics could reduce the cost of making flexible displays of the kind used in the... http://www.semiconductor.net/article/295445-SUSS_MicroTec_3M_Partner_on_3_D_Bonds.php?rssid=20230 http://www.semiconductor.net/article/295445-SUSS_MicroTec_3M_Partner_on_3_D_Bonds.php?rssid=20230 Mon, 22 Jun 2009 15:54:42 GMT SUSS MicroTec AG (Garching, Germany) and 3M Corp. (Minneapolis) will work together, offering... http://www.semiconductor.net/article/295296-Nanoelectronics_Edge_Into_Production.php?rssid=20230 http://www.semiconductor.net/article/295296-Nanoelectronics_Edge_Into_Production.php?rssid=20230 Fri, 19 Jun 2009 12:50:30 GMT Graphene and spin wave transistors are among the technologies that look interesting for... http://www.semiconductor.net/article/295295-Printed_Electronics_Seeing_Wide_Progress.php?rssid=20230 http://www.semiconductor.net/article/295295-Printed_Electronics_Seeing_Wide_Progress.php?rssid=20230 Fri, 19 Jun 2009 10:56:43 GMT Executives from an array of printed electronics companies will describe progress in the field at... http://www.semiconductor.net/article/295251-Thin_SOI_Devices_Shine_at_VLSI_Symposium.php?rssid=20230 http://www.semiconductor.net/article/295251-Thin_SOI_Devices_Shine_at_VLSI_Symposium.php?rssid=20230 Thu, 18 Jun 2009 14:13:00 GMT At the 2009 Symposium on VLSI Technology in Kyoto, Japan, an IBM R&D team described fully... http://www.semiconductor.net/article/294804-NEC_s_MRAM_Uses_Vertical_Magnetic_Spin.php?rssid=20230 http://www.semiconductor.net/article/294804-NEC_s_MRAM_Uses_Vertical_Magnetic_Spin.php?rssid=20230 Wed, 17 Jun 2009 13:48:22 GMT NEC presented a spintronics MRAM cell at the Symposium on VLSI Technology in Kyoto, Japan. The... http://www.semiconductor.net/article/294639-Alliance_Members_Tout_Oxide_EOT_Advance.php?rssid=20230 http://www.semiconductor.net/article/294639-Alliance_Members_Tout_Oxide_EOT_Advance.php?rssid=20230 Tue, 16 Jun 2009 15:24:33 GMT Researchers from GlobalFoundries and IBM Research went to the 2009 Symposium on VLSI Technology... http://www.semiconductor.net/article/279085-IMEC_Tips_10_nm_Options_at_Tech_Forum.php?rssid=20230 http://www.semiconductor.net/article/279085-IMEC_Tips_10_nm_Options_at_Tech_Forum.php?rssid=20230 Thu, 11 Jun 2009 13:40:11 GMT IMEC Fellow Marc Heyns described R&D directions at the consortium's recent technology forum,... http://www.semiconductor.net/article/277206-Novellus_Advances_PVD_TaN_Barrier_Film.php?rssid=20230 http://www.semiconductor.net/article/277206-Novellus_Advances_PVD_TaN_Barrier_Film.php?rssid=20230 Thu, 28 May 2009 14:40:00 GMT Novellus said its has developed a conformal hollow cathode magnetron (HCM) PVD technology,... http://www.semiconductor.net/article/232200-Freescale_Taking_Nanocrystal_Flash_to_Production.php?rssid=20230 http://www.semiconductor.net/article/232200-Freescale_Taking_Nanocrystal_Flash_to_Production.php?rssid=20230 Mon, 11 May 2009 16:19:00 GMT After five years of technology development, Freescale said it is ready to move nanocrystal flash... http://www.semiconductor.net/article/231671-Novellus_Rolls_UV_Absorbing_Dielectrics.php?rssid=20230 http://www.semiconductor.net/article/231671-Novellus_Rolls_UV_Absorbing_Dielectrics.php?rssid=20230 Thu, 07 May 2009 13:52:00 GMT Novellus has developed a dense ultralow-k and diffusion barrier stack that absorbs ultraviolet... http://www.semiconductor.net/article/231398-Helium_Ion_Scope_Aids_Interconnect_Study.php?rssid=20230 http://www.semiconductor.net/article/231398-Helium_Ion_Scope_Aids_Interconnect_Study.php?rssid=20230 Tue, 05 May 2009 13:57:00 GMT Researchers from Carl Zeiss SMT and Selete will go to the International Interconnect Technology... http://www.semiconductor.net/article/231189-2009_IITC_to_Consider_Metals_for_22_nm.php?rssid=20230 http://www.semiconductor.net/article/231189-2009_IITC_to_Consider_Metals_for_22_nm.php?rssid=20230 Mon, 04 May 2009 15:45:00 GMT The upcoming International Interconnect Technology Conference (IITC) will consider a variety of... http://www.semiconductor.net/article/209744-2009_VLSI_Technology_Symposium_Takes_Up_Heterogeneous_IC_Challenges.php?rssid=20230 http://www.semiconductor.net/article/209744-2009_VLSI_Technology_Symposium_Takes_Up_Heterogeneous_IC_Challenges.php?rssid=20230 Wed, 22 Apr 2009 16:11:00 GMT The time for first introduction of heterogeneous ICs — based on germanium or SiGe PFET... http://www.semiconductor.net/article/200711-IBM_Alliance_Ready_With_28_nm_Eval_Kits.php?rssid=20230 http://www.semiconductor.net/article/200711-IBM_Alliance_Ready_With_28_nm_Eval_Kits.php?rssid=20230 Thu, 16 Apr 2009 16:07:00 GMT The IBM-led alliance said the evaluation kits for its 28 nm technology are now available, with... http://www.semiconductor.net/article/206336-Sp3_Diamond_Revs_SOD_Wafer_Production.php?rssid=20230 http://www.semiconductor.net/article/206336-Sp3_Diamond_Revs_SOD_Wafer_Production.php?rssid=20230 Tue, 14 Apr 2009 16:02:00 GMT Sp3 Diamond Technologies is producing 2 and 4 in. silicon-on-diamond (SOD) wafers for production... http://www.semiconductor.net/article/198545-Inlustra_Starts_Nonpolar_GaN_Production.php?rssid=20230 http://www.semiconductor.net/article/198545-Inlustra_Starts_Nonpolar_GaN_Production.php?rssid=20230 Tue, 14 Apr 2009 14:51:00 GMT Inlustra said it is beginning to deliver nonpolar GaN substrates to customers. Started in 2005... http://www.semiconductor.net/article/204420-SWCNTs_May_Offer_Cooler_Interconnects.php?rssid=20230 http://www.semiconductor.net/article/204420-SWCNTs_May_Offer_Cooler_Interconnects.php?rssid=20230 Mon, 06 Apr 2009 13:52:00 GMT University at Buffalo engineers recently proved with quantum mechanics that single-walled carbon... http://www.semiconductor.net/article/204956-3_D_Equals_Two_Generations_of_Scaling.php?rssid=20230 http://www.semiconductor.net/article/204956-3_D_Equals_Two_Generations_of_Scaling.php?rssid=20230 Thu, 02 Apr 2009 21:26:00 GMT North Carolina State Professor Paul Franzon said the need for 3-D ICs is becoming more acute as... http://www.semiconductor.net/article/205562-_Tuned_Graphene_Points_to_Faster_Chips.php?rssid=20230 http://www.semiconductor.net/article/205562-_Tuned_Graphene_Points_to_Faster_Chips.php?rssid=20230 Thu, 02 Apr 2009 14:11:00 GMT Researchers at Rensselaer Polytechnic Institute have determined that the chemistry of the... http://www.semiconductor.net/article/201907-Semilab_Acquires_AMS_QC_Solutions.php?rssid=20230 http://www.semiconductor.net/article/201907-Semilab_Acquires_AMS_QC_Solutions.php?rssid=20230 Tue, 31 Mar 2009 15:45:00 GMT Semilab (Budapest, Hungary) has formed a Massachusetts division made up of newly acquired... http://www.semiconductor.net/article/205098-Applied_Disco_to_Develop_Wafer_Thinning_Processes.php?rssid=20230 http://www.semiconductor.net/article/205098-Applied_Disco_to_Develop_Wafer_Thinning_Processes.php?rssid=20230 Mon, 30 Mar 2009 13:43:00 GMT Applied Materials Inc. and Disco Corp. will develop wafer-thinning processes for 3-D... http://www.semiconductor.net/article/208453-Shin_Etsu_MicroSi_Celebrates_20_Years_20_CAGR.php?rssid=20230 http://www.semiconductor.net/article/208453-Shin_Etsu_MicroSi_Celebrates_20_Years_20_CAGR.php?rssid=20230 Tue, 24 Mar 2009 18:59:00 GMT Having established itself as a provider of silicon, the next step for Shin-Etsu MicroSi is in... http://www.semiconductor.net/article/209241-Leti_and_Brewer_Science_Collaborate_on_3_D_MEMS.php?rssid=20230 http://www.semiconductor.net/article/209241-Leti_and_Brewer_Science_Collaborate_on_3_D_MEMS.php?rssid=20230 Mon, 23 Feb 2009 17:30:00 GMT Léti and Brewer Science said they will strengthen their research collaboration on materials... http://www.semiconductor.net/article/200651-IMEC_Joins_SOI_Industry_Consortium.php?rssid=20230 http://www.semiconductor.net/article/200651-IMEC_Joins_SOI_Industry_Consortium.php?rssid=20230 Mon, 23 Feb 2009 14:29:00 GMT IMEC has joined the SOI Industry Consortium, adding its SOI-related research interests to the... http://www.semiconductor.net/article/207601-Metrosol_and_Sematech_Partner_on_VUV_SR.php?rssid=20230 http://www.semiconductor.net/article/207601-Metrosol_and_Sematech_Partner_on_VUV_SR.php?rssid=20230 Wed, 18 Feb 2009 15:40:00 GMT Metrosol Inc. will participate in Sematech’s front-end program at the CNSE Albany NanoTech... http://www.semiconductor.net/article/199126-ISMI_Reports_Progress_at_450_mm_Program.php?rssid=20230 http://www.semiconductor.net/article/199126-ISMI_Reports_Progress_at_450_mm_Program.php?rssid=20230 Wed, 04 Feb 2009 16:25:00 GMT The 450 mm wafer Interoperability Test Bed (ITB) at Sematech’s ISMI subsidiary has moved to a... http://www.semiconductor.net/article/206449-IITC_Set_for_Sapporo_in_June_Europe_in_2011.php?rssid=20230 http://www.semiconductor.net/article/206449-IITC_Set_for_Sapporo_in_June_Europe_in_2011.php?rssid=20230 Thu, 08 Jan 2009 15:07:00 GMT The International Interconnect Technology Conference (IITC) will move from its traditional venue... http://www.semiconductor.net/article/198032-Lanthanum_Doping_May_Boost_Silicon_FETs.php?rssid=20230 http://www.semiconductor.net/article/198032-Lanthanum_Doping_May_Boost_Silicon_FETs.php?rssid=20230 Tue, 30 Dec 2008 17:11:00 GMT Experts at the recent IEDM said performance gains from strained silicon are saturating, causing... http://www.semiconductor.net/article/202498-Flash_Vendors_Facing_Scaling_Challenges.php?rssid=20230 http://www.semiconductor.net/article/202498-Flash_Vendors_Facing_Scaling_Challenges.php?rssid=20230 Tue, 23 Dec 2008 16:27:00 GMT Toshiba engineers said at the recent IEDM that they have improved on the SONOS flash structure,... http://www.semiconductor.net/article/207354-How_Intel_Made_CMP_Work_for_High_k.php?rssid=20230 http://www.semiconductor.net/article/207354-How_Intel_Made_CMP_Work_for_High_k.php?rssid=20230 Thu, 18 Dec 2008 12:10:00 GMT Joe Steigerwald, director of CMP technology at Intel, described the CMP process improvements... http://www.semiconductor.net/article/197484-Intel_Sees_PMOS_Gain_With_110_Silicon.php?rssid=20230 http://www.semiconductor.net/article/197484-Intel_Sees_PMOS_Gain_With_110_Silicon.php?rssid=20230 Tue, 16 Dec 2008 14:55:00 GMT At the 2008 International Electron Devices Meeting (IEDM), speakers from Intel and Fujitsu... http://www.semiconductor.net/article/198210-Intel_to_Describe_32_nm_Logic_Process_New_45_nm_SoC_Platform_at_2008_IEDM.php?rssid=20230 http://www.semiconductor.net/article/198210-Intel_to_Describe_32_nm_Logic_Process_New_45_nm_SoC_Platform_at_2008_IEDM.php?rssid=20230 Wed, 10 Dec 2008 16:53:00 GMT Intel will provide some details of its 32 nm logic process in a late paper at next week’s... http://www.semiconductor.net/article/203845-ATMI_and_Ovonyx_Bring_MOCVD_to_PCMs.php?rssid=20230 http://www.semiconductor.net/article/203845-ATMI_and_Ovonyx_Bring_MOCVD_to_PCMs.php?rssid=20230 Tue, 09 Dec 2008 16:42:00 GMT ATMI and Ovonyx said they have demonstrated the ability to use MOCVD to fill high-aspect-ratio... http://www.semiconductor.net/article/202242-IBM_Offers_45_nm_SOI_Foundry_Solution.php?rssid=20230 http://www.semiconductor.net/article/202242-IBM_Offers_45_nm_SOI_Foundry_Solution.php?rssid=20230 Mon, 10 Nov 2008 14:48:00 GMT IBM is offering a 45 nm SOI foundry solution to customers seeking to reduce active power... http://www.semiconductor.net/article/204379-Magnetism_and_Nanocrystals_Promise_Denser_Storage_New_Devices.php?rssid=20230 http://www.semiconductor.net/article/204379-Magnetism_and_Nanocrystals_Promise_Denser_Storage_New_Devices.php?rssid=20230 Thu, 30 Oct 2008 14:01:00 GMT When complex materials are reduced to the nanoscopic scale, never before observed electronic... http://www.semiconductor.net/article/203402-Logic_Technologies_Face_Off_at_IEDM.php?rssid=20230 http://www.semiconductor.net/article/203402-Logic_Technologies_Face_Off_at_IEDM.php?rssid=20230 Tue, 28 Oct 2008 16:07:00 GMT At the International Electron Devices Meeting (IEDM) planned for Dec. 15-17 in San Francisco,... http://www.semiconductor.net/article/197761-ISMI_Outlines_450_mm_Wafer_NGF_Roadmaps.php?rssid=20230 http://www.semiconductor.net/article/197761-ISMI_Outlines_450_mm_Wafer_NGF_Roadmaps.php?rssid=20230 Mon, 27 Oct 2008 15:26:00 GMT ISMI managers described progress at the 450 mm wafer Interoperability Test Bed, and described... http://www.semiconductor.net/article/197827-IMEC_Has_Air_Gaps_in_Post_22_nm_Roadmap_for_Interconnects.php?rssid=20230 http://www.semiconductor.net/article/197827-IMEC_Has_Air_Gaps_in_Post_22_nm_Roadmap_for_Interconnects.php?rssid=20230 Tue, 21 Oct 2008 15:50:00 GMT Though copper will clearly remain the interconnect material of choice, there may be some... http://www.semiconductor.net/article/198763-Unisem_Takes_Copper_Wire_Bonding_Process_to_Volume_Production.php?rssid=20230 http://www.semiconductor.net/article/198763-Unisem_Takes_Copper_Wire_Bonding_Process_to_Volume_Production.php?rssid=20230 Wed, 15 Oct 2008 15:23:00 GMT Unisem plans to set up 30% of its wire bonders for copper by 2009. The industry’s interest in... http://www.semiconductor.net/article/196929-NEXX_Licenses_Alchimer_s_Coating_Technology.php?rssid=20230 http://www.semiconductor.net/article/196929-NEXX_Licenses_Alchimer_s_Coating_Technology.php?rssid=20230 Wed, 08 Oct 2008 17:07:00 GMT Alchimer SA (Paris) said it has licensed its eG ViaCoat product for creating conformal copper... http://www.semiconductor.net/article/209089-Common_Platform_Participants_Rate_High_k_as_Good_Mobile_Fit.php?rssid=20230 http://www.semiconductor.net/article/209089-Common_Platform_Participants_Rate_High_k_as_Good_Mobile_Fit.php?rssid=20230 Thu, 02 Oct 2008 14:50:00 GMT The Common Platform Technology Forum centered on partnering to defray ever-increasing R&D costs.... http://www.semiconductor.net/article/197625-Common_Platform_Partners_Slot_HKMG_Implementation.php?rssid=20230 http://www.semiconductor.net/article/197625-Common_Platform_Partners_Slot_HKMG_Implementation.php?rssid=20230 Tue, 30 Sep 2008 13:54:00 GMT The Common Platform Technology Forum taking place today in Silicon Valley will focus on the... http://www.semiconductor.net/article/207728-DuPont_Adds_to_Its_WLP_Offerings.php?rssid=20230 http://www.semiconductor.net/article/207728-DuPont_Adds_to_Its_WLP_Offerings.php?rssid=20230 Tue, 30 Sep 2008 01:45:00 GMT To meet growing demand for new materials for 3-D packaging and through-silicon vias, DuPont... http://www.semiconductor.net/article/203006-Citing_High_k_Costs_TSMC_Plans_Dual_Track_28_nm_Solutions_in_2010.php?rssid=20230 http://www.semiconductor.net/article/203006-Citing_High_k_Costs_TSMC_Plans_Dual_Track_28_nm_Solutions_in_2010.php?rssid=20230 Mon, 29 Sep 2008 11:22:00 GMT TSMC said it will offer both silicon oxynitride (SiON) and high-k/metal gate solutions at the 28... http://www.semiconductor.net/article/203251-NEC_Electronics_Joins_Fishkill_Alliance.php?rssid=20230 http://www.semiconductor.net/article/203251-NEC_Electronics_Joins_Fishkill_Alliance.php?rssid=20230 Thu, 11 Sep 2008 16:08:00 GMT NEC Electronics has joined the IBM-led Fishkill Alliance, with a goal of implementing NEC’s... http://www.semiconductor.net/article/196677-SAFC_Hitech_Advances_on_Phase_Change_Memory_Front.php?rssid=20230 http://www.semiconductor.net/article/196677-SAFC_Hitech_Advances_on_Phase_Change_Memory_Front.php?rssid=20230 Thu, 04 Sep 2008 16:19:00 GMT SAFC Hitech announced that its researchers have made significant progress in developing... http://www.semiconductor.net/article/198853-Dow_Corning_Introduces_Thermal_Interface_Material.php?rssid=20230 http://www.semiconductor.net/article/198853-Dow_Corning_Introduces_Thermal_Interface_Material.php?rssid=20230 Wed, 20 Aug 2008 16:14:00 GMT Dow Corning Corp. said a thermally conductive compound, developed for use in Intel's latest... http://www.semiconductor.net/article/200717-_Superatoms_Open_Window_to_Nanoparticle_Chemistry.php?rssid=20230 http://www.semiconductor.net/article/200717-_Superatoms_Open_Window_to_Nanoparticle_Chemistry.php?rssid=20230 Thu, 07 Aug 2008 14:01:00 GMT The principles behind the stability and electronic properties of metallic gold nanoclusters have... http://www.semiconductor.net/article/206268-Shin_Etsu_Polymer_Develops_Lightweight_Resin_Frame_for_Thin_Wafers.php?rssid=20230 http://www.semiconductor.net/article/206268-Shin_Etsu_Polymer_Develops_Lightweight_Resin_Frame_for_Thin_Wafers.php?rssid=20230 Wed, 06 Aug 2008 15:49:00 GMT Shin-Etsu Polymer has developed a lightweight resin frame to handle and transport thinned... http://www.semiconductor.net/article/207535-Molecular_Switching_Moves_Closer_to_Reality.php?rssid=20230 http://www.semiconductor.net/article/207535-Molecular_Switching_Moves_Closer_to_Reality.php?rssid=20230 Tue, 05 Aug 2008 13:54:00 GMT A solution to the long-sought fabled molecular switch appears to have been found by researchers... http://www.semiconductor.net/article/203111-Alchimer_Claims_Fully_Wet_Via_Solution.php?rssid=20230 http://www.semiconductor.net/article/203111-Alchimer_Claims_Fully_Wet_Via_Solution.php?rssid=20230 Fri, 01 Aug 2008 13:49:00 GMT Alchimer SA said experiments have shown that its “electrografting” technology can handle... http://www.semiconductor.net/article/205241-AmpTech_Opens_for_GaAs_InP_Foundry_Services.php?rssid=20230 http://www.semiconductor.net/article/205241-AmpTech_Opens_for_GaAs_InP_Foundry_Services.php?rssid=20230 Thu, 31 Jul 2008 15:13:00 GMT AmpTech Inc. said it is ready to do business as a foundry for RF and optoelectronic ICs. The... http://www.semiconductor.net/article/204275-Chrome_Going_the_Way_of_the_Dodo_Bird_.php?rssid=20230 http://www.semiconductor.net/article/204275-Chrome_Going_the_Way_of_the_Dodo_Bird_.php?rssid=20230 Tue, 29 Jul 2008 16:09:00 GMT Chrome will be replaced by molybdenum silicide (MoSi) on masks starting at the 32 nm logic... http://www.semiconductor.net/article/209078-Funding_for_ISMI_450_mm_Effort_Doubling.php?rssid=20230 http://www.semiconductor.net/article/209078-Funding_for_ISMI_450_mm_Effort_Doubling.php?rssid=20230 Tue, 22 Jul 2008 15:28:00 GMT The large chip companies supporting the 450 mm wafer transition have put supplemental funding... http://www.semiconductor.net/article/197052-Molding_Techniques_Support_Thin_Gold_Wires_Low_k_Materials.php?rssid=20230 http://www.semiconductor.net/article/197052-Molding_Techniques_Support_Thin_Gold_Wires_Low_k_Materials.php?rssid=20230 Mon, 21 Jul 2008 14:53:00 GMT Competing Japan-based molding machine manufacturers have developed techniques that support the... http://www.semiconductor.net/article/201100-Improving_the_Way_We_Change_Materials.php?rssid=20230 http://www.semiconductor.net/article/201100-Improving_the_Way_We_Change_Materials.php?rssid=20230 Thu, 17 Jul 2008 14:00:00 GMT Patterning and new materials are probably the greatest grand challenges in semiconductor... http://www.semiconductor.net/article/205531-Industry_Veteran_Receives_Honor.php?rssid=20230 http://www.semiconductor.net/article/205531-Industry_Veteran_Receives_Honor.php?rssid=20230 Wed, 16 Jul 2008 16:00:00 GMT The 2008 Karel Urbanek Memorial Award was presented to Paul Langer of Komatsu Silicon America... http://www.semiconductor.net/article/200216-Soitec_Ready_With_Ultrathin_SOI_Wafers.php?rssid=20230 http://www.semiconductor.net/article/200216-Soitec_Ready_With_Ultrathin_SOI_Wafers.php?rssid=20230 Wed, 16 Jul 2008 14:00:00 GMT In a materials advance that could enable multi-gate logic devices and floating body single... http://www.semiconductor.net/article/199140-When_Will_450_mm_Make_Economic_Sense_.php?rssid=20230 http://www.semiconductor.net/article/199140-When_Will_450_mm_Make_Economic_Sense_.php?rssid=20230 Wed, 16 Jul 2008 01:22:00 GMT There is an industry-wide curiosity about the reality behind a wafer size transition to 450 mm.... http://www.semiconductor.net/article/208427-Intermolecular_Speeds_R_D_for_Elpida_s_Next_Gen_Memory.php?rssid=20230 http://www.semiconductor.net/article/208427-Intermolecular_Speeds_R_D_for_Elpida_s_Next_Gen_Memory.php?rssid=20230 Tue, 15 Jul 2008 06:37:00 GMT Intermolecular Inc. (San Jose) today announced a new collaborative development program (CDP) and... http://www.semiconductor.net/article/205018-ISMI_to_Report_450_mm_Progress_at_West.php?rssid=20230 http://www.semiconductor.net/article/205018-ISMI_to_Report_450_mm_Progress_at_West.php?rssid=20230 Thu, 10 Jul 2008 15:49:00 GMT ISMI will present data gathered from 450 mm test wafers to several SEMI task forces at next... http://www.semiconductor.net/article/203472-iNEMI_Issues_Recommendations_for_Managing_Lead_Free_Solder_Alloys.php?rssid=20230 http://www.semiconductor.net/article/203472-iNEMI_Issues_Recommendations_for_Managing_Lead_Free_Solder_Alloys.php?rssid=20230 Thu, 10 Jul 2008 14:31:00 GMT iNEMI has outlined a set of key approaches to help the electronics industry respond to the many... http://www.semiconductor.net/article/206689-BASF_Evonik_to_Develop_Ceria_Based_Slurries.php?rssid=20230 http://www.semiconductor.net/article/206689-BASF_Evonik_to_Develop_Ceria_Based_Slurries.php?rssid=20230 Thu, 03 Jul 2008 14:44:00 GMT BASF and specialty chemicals provider Evonik Industries AG will collaborate on the development... http://www.semiconductor.net/article/197648-IBM_Takes_Gloves_Off_for_32_nm_Low_Power_Competition_With_TSMC.php?rssid=20230 http://www.semiconductor.net/article/197648-IBM_Takes_Gloves_Off_for_32_nm_Low_Power_Competition_With_TSMC.php?rssid=20230 Thu, 26 Jun 2008 16:48:00 GMT IBM engineers described the Fishkill alliance’s low-power 32 nm process technology, which... http://www.semiconductor.net/article/198842-Samsung_Hynix_to_Cooperate_on_450_mm_Wafer_Standards.php?rssid=20230 http://www.semiconductor.net/article/198842-Samsung_Hynix_to_Cooperate_on_450_mm_Wafer_Standards.php?rssid=20230 Wed, 25 Jun 2008 19:29:00 GMT Samsung Electronics and Hynix Semiconductor will cooperate on the development of 450 mm wafer... http://www.semiconductor.net/article/205420-Sematech_Reports_Progress_at_VLSI_Meeting.php?rssid=20230 http://www.semiconductor.net/article/205420-Sematech_Reports_Progress_at_VLSI_Meeting.php?rssid=20230 Mon, 23 Jun 2008 15:52:00 GMT At the 2008 Symposium on VLSI Technology, Sematech researchers described progress with gallium... http://www.semiconductor.net/article/203297-Selete_Achieves_5_GHz_Pulses_on_Silicon_Photonics_IC.php?rssid=20230 http://www.semiconductor.net/article/203297-Selete_Achieves_5_GHz_Pulses_on_Silicon_Photonics_IC.php?rssid=20230 Thu, 05 Jun 2008 15:07:00 GMT The Selete consortium in Japan has developed an optical interconnect based on a silicon... http://www.semiconductor.net/article/205080-IITC_Papers_Range_From_Plasma_Modeling_to_Copper_Encapsulation_Techniques.php?rssid=20230 http://www.semiconductor.net/article/205080-IITC_Papers_Range_From_Plasma_Modeling_to_Copper_Encapsulation_Techniques.php?rssid=20230 Wed, 04 Jun 2008 13:51:00 GMT Papers presented at this week's International Interconnect Technology Conference (IITC) include... http://www.semiconductor.net/article/199136-IMEC_Aixtron_Partner_on_GaN_Deposition.php?rssid=20230 http://www.semiconductor.net/article/199136-IMEC_Aixtron_Partner_on_GaN_Deposition.php?rssid=20230 Tue, 03 Jun 2008 16:48:00 GMT IMEC and Aixtron AG have developed a gallium nitride (GaN) deposition process on 200 mm silicon... http://www.semiconductor.net/article/204595-Alchimer_Ready_to_Tackle_TSV_Seed_Layer.php?rssid=20230 http://www.semiconductor.net/article/204595-Alchimer_Ready_to_Tackle_TSV_Seed_Layer.php?rssid=20230 Wed, 28 May 2008 14:40:00 GMT Alchimer SA (Massy, France) said it is ready to do business in the 3-D interconnect sector,... http://www.semiconductor.net/article/208621-Denso_Develops_Silicon_Carbide_Process.php?rssid=20230 http://www.semiconductor.net/article/208621-Denso_Develops_Silicon_Carbide_Process.php?rssid=20230 Tue, 27 May 2008 13:10:00 GMT Denso Corp., an electronics supplier to Toyota Motor and others, has developed a unique silicon... http://www.semiconductor.net/article/208540-Artificial_Superlattices_Promise_Better_Memories.php?rssid=20230 http://www.semiconductor.net/article/208540-Artificial_Superlattices_Promise_Better_Memories.php?rssid=20230 Thu, 15 May 2008 14:03:00 GMT A new artificial material marks the beginning of a revolution in the creation of materials to... http://www.semiconductor.net/article/205305-Freescale_Taking_Redistributed_Chip_Packaging_to_Pilot_Production_Stage.php?rssid=20230 http://www.semiconductor.net/article/205305-Freescale_Taking_Redistributed_Chip_Packaging_to_Pilot_Production_Stage.php?rssid=20230 Mon, 12 May 2008 15:32:00 GMT Freescale Semiconductor Inc. has moved its RCP packaging technology to pilot production,... http://www.semiconductor.net/article/197046-Light_Matter_Interaction_to_Improve_Semiconductor_Interfaces.php?rssid=20230 http://www.semiconductor.net/article/197046-Light_Matter_Interaction_to_Improve_Semiconductor_Interfaces.php?rssid=20230 Thu, 08 May 2008 13:44:00 GMT Research carried out at North Carolina State University on the interaction of light with matter... http://www.semiconductor.net/article/200229-Physical_Analysis_Provides_Images_of_45_nm.php?rssid=20230 http://www.semiconductor.net/article/200229-Physical_Analysis_Provides_Images_of_45_nm.php?rssid=20230 Tue, 06 May 2008 13:38:00 GMT Engineers at Chipworks Inc. (Ottawa, Canada) have uncovered many physical details of the 65 and... http://www.semiconductor.net/article/204117-Real_Men_Women_Do_Have_Fabs.php?rssid=20230 http://www.semiconductor.net/article/204117-Real_Men_Women_Do_Have_Fabs.php?rssid=20230 Wed, 30 Apr 2008 13:54:00 GMT Tom Sonderman, vice president of manufacturing technology at Advanced Micro Devices (AMD,... http://www.semiconductor.net/article/201988-TSMC_Ramping_Aggressive_CPU_Process_Push.php?rssid=20230 http://www.semiconductor.net/article/201988-TSMC_Ramping_Aggressive_CPU_Process_Push.php?rssid=20230 Tue, 29 Apr 2008 15:10:00 GMT TSMC is “hiring aggressively” to develop a technology platform for CPU production, said CEO... http://www.semiconductor.net/article/199601-Oki_Integrates_AlGaAs_LEDs_on_Silicon_Mounting_Chips.php?rssid=20230 http://www.semiconductor.net/article/199601-Oki_Integrates_AlGaAs_LEDs_on_Silicon_Mounting_Chips.php?rssid=20230 Thu, 24 Apr 2008 13:02:00 GMT Oki Digital Imaging Corp. is in mass production with LED print heads that use a film bonding... http://www.semiconductor.net/article/205177-Air_Gaps_Unlikely_Becoming_More_Likely_.php?rssid=20230 http://www.semiconductor.net/article/205177-Air_Gaps_Unlikely_Becoming_More_Likely_.php?rssid=20230 Wed, 23 Apr 2008 13:44:00 GMT The upcoming International Interconnect Technology Conference (IITC) will feature papers on the... http://www.semiconductor.net/article/199216-FEI_Imago_to_Collaborate_Hint_at_Possible_Merger.php?rssid=20230 http://www.semiconductor.net/article/199216-FEI_Imago_to_Collaborate_Hint_at_Possible_Merger.php?rssid=20230 Tue, 15 Apr 2008 16:19:00 GMT FEI Co. (Hillsboro, Ore.) and Imago Scientific Instruments (Madison, Wis.) announced a... http://www.semiconductor.net/article/200824-Clean_Steps_Struggle_to_Minimize_Material_Loss.php?rssid=20230 http://www.semiconductor.net/article/200824-Clean_Steps_Struggle_to_Minimize_Material_Loss.php?rssid=20230 Thu, 10 Apr 2008 17:02:00 GMT As noted throughout Sematech’s Surface Preparation and Cleaning Conference last week, cleaning... http://www.semiconductor.net/article/203723-Oxford_Instruments_Acquires_TDI_in_LED_Thrust.php?rssid=20230 http://www.semiconductor.net/article/203723-Oxford_Instruments_Acquires_TDI_in_LED_Thrust.php?rssid=20230 Thu, 10 Apr 2008 14:55:00 GMT Oxford Instruments Plc has acquired Technologies and Devices International Inc. (TDI), adding... http://www.semiconductor.net/article/206491-Race_Track_Runs_Circles_Around_Flash.php?rssid=20230 http://www.semiconductor.net/article/206491-Race_Track_Runs_Circles_Around_Flash.php?rssid=20230 Thu, 10 Apr 2008 14:49:00 GMT IBM has developed a technology that combines flash’s high performance and reliability with the... http://www.semiconductor.net/article/205348-MEMC_Fixing_Buildup_Issues_at_Texas_Polysilicon_Facility.php?rssid=20230 http://www.semiconductor.net/article/205348-MEMC_Fixing_Buildup_Issues_at_Texas_Polysilicon_Facility.php?rssid=20230 Thu, 03 Apr 2008 16:33:00 GMT MEMC Electronic Materials Inc. said it has fixed problems at a new silane gas production... http://www.semiconductor.net/article/197064-SEMI_Event_Blends_Nostalgia_With_a_Look_to_the_Future.php?rssid=20230 http://www.semiconductor.net/article/197064-SEMI_Event_Blends_Nostalgia_With_a_Look_to_the_Future.php?rssid=20230 Wed, 02 Apr 2008 14:04:00 GMT SEMI event remembers industry beginnings, ponders the... http://www.semiconductor.net/article/205097-Semiconductor_International_Announces_New_Editor_in_Chief.php?rssid=20230 http://www.semiconductor.net/article/205097-Semiconductor_International_Announces_New_Editor_in_Chief.php?rssid=20230 Wed, 26 Mar 2008 19:39:00 GMT Laura Peters has been promoted to the position of editor-in-chief of Semiconductor International... http://www.semiconductor.net/article/198317-RPI_Simulations_Show_Nanotubes_Outperform_Copper_Interconnects.php?rssid=20230 http://www.semiconductor.net/article/198317-RPI_Simulations_Show_Nanotubes_Outperform_Copper_Interconnects.php?rssid=20230 Mon, 17 Mar 2008 16:03:00 GMT Researchers at Rensselaer Polytechnic Institute have predicted that interconnects made of... http://www.semiconductor.net/article/197097-IBM_Creates_On_Chip_Nanophotonic_Switch.php?rssid=20230 http://www.semiconductor.net/article/197097-IBM_Creates_On_Chip_Nanophotonic_Switch.php?rssid=20230 Mon, 17 Mar 2008 15:50:00 GMT IBM scientists have built an on-chip photonic switch that could be used to route optical signals... http://www.semiconductor.net/article/203982-Magma_Design_Joins_SOI_Consortium.php?rssid=20230 http://www.semiconductor.net/article/203982-Magma_Design_Joins_SOI_Consortium.php?rssid=20230 Mon, 10 Mar 2008 23:54:00 GMT The SOI Industry Consortium welcomed Magma Design Automation as its newest member, raising the... http://www.semiconductor.net/article/205330-IBM_Cuts_Noise_Ratio_in_Bilayer_Graphene.php?rssid=20230 http://www.semiconductor.net/article/205330-IBM_Cuts_Noise_Ratio_in_Bilayer_Graphene.php?rssid=20230 Fri, 07 Mar 2008 15:02:00 GMT IBM scientists discovered that bilayers of graphene suppress noise much more effectively than... http://www.semiconductor.net/article/203629-AMD_Demos_45_nm_Processors_at_CeBit.php?rssid=20230 http://www.semiconductor.net/article/203629-AMD_Demos_45_nm_Processors_at_CeBit.php?rssid=20230 Tue, 04 Mar 2008 14:20:00 GMT AMD said it has demonstrated quad-core processors manufactured at 45 nm design rules at the... http://www.semiconductor.net/article/197308-Freescale_Forging_Ahead_to_45_nm_in_2008.php?rssid=20230 http://www.semiconductor.net/article/197308-Freescale_Forging_Ahead_to_45_nm_in_2008.php?rssid=20230 Tue, 04 Mar 2008 13:23:00 GMT Freescale Semiconductor Inc. will begin sampling networking chips using 45 nm design rules by... http://www.semiconductor.net/article/207074-RHEM_IBM_to_Collaborate_on_CMP_Technology.php?rssid=20230 http://www.semiconductor.net/article/207074-RHEM_IBM_to_Collaborate_on_CMP_Technology.php?rssid=20230 Wed, 27 Feb 2008 15:04:00 GMT Rohm and Haas Electronic Materials (RHEM), CMP Technologies (Phoenix), a supplier of polishing... http://www.semiconductor.net/article/197326-SI_China_Names_Six_Influential_Persons_in_China_s_2007_IC_Manufacturing_Industry.php?rssid=20230 http://www.semiconductor.net/article/197326-SI_China_Names_Six_Influential_Persons_in_China_s_2007_IC_Manufacturing_Industry.php?rssid=20230 Tue, 26 Feb 2008 14:56:00 GMT Semiconductor International magazine’s China edition has selected six people who played key... http://www.semiconductor.net/article/200453-Rohm_and_Haas_IBM_Tackle_Implant_Level_Lithography_Materials.php?rssid=20230 http://www.semiconductor.net/article/200453-Rohm_and_Haas_IBM_Tackle_Implant_Level_Lithography_Materials.php?rssid=20230 Mon, 25 Feb 2008 12:45:00 GMT Rohm and Haas Electronic Materials has entered into a joint development agreement with IBM to... http://www.semiconductor.net/article/206975-Schott_Claims_Progress_in_LuAG_Absorption_for_High_Index_Lithography.php?rssid=20230 http://www.semiconductor.net/article/206975-Schott_Claims_Progress_in_LuAG_Absorption_for_High_Index_Lithography.php?rssid=20230 Fri, 22 Feb 2008 19:50:00 GMT In a boost for high-index lithography, Schott Lithotec (Jena, Germany) said it has made... http://www.semiconductor.net/article/200105-Heterogeneous_Channels_A_Goal_of_EC_s_Duallogic_Project.php?rssid=20230 http://www.semiconductor.net/article/200105-Heterogeneous_Channels_A_Goal_of_EC_s_Duallogic_Project.php?rssid=20230 Mon, 11 Feb 2008 14:43:00 GMT A European research project aimed at combining germanium channels for the PMOS and III-V... http://www.semiconductor.net/article/207320-NIST_Scientists_Claim_Progress_in_CNT_Enhanced_Conducting_Polymers.php?rssid=20230 http://www.semiconductor.net/article/207320-NIST_Scientists_Claim_Progress_in_CNT_Enhanced_Conducting_Polymers.php?rssid=20230 Wed, 06 Feb 2008 15:18:00 GMT National Institute of Standards and Technology (NIST) researchers said they have achieved... http://www.semiconductor.net/article/199943-Sematech_High_k_Metal_Gate_Must_Overcome_Scalability_Hurdles.php?rssid=20230 http://www.semiconductor.net/article/199943-Sematech_High_k_Metal_Gate_Must_Overcome_Scalability_Hurdles.php?rssid=20230 Mon, 04 Feb 2008 15:47:00 GMT The Sematech front-end (transistor) program is searching for second-generation high-k/metal gate... http://www.semiconductor.net/article/207352-Researchers_Develop_Forward_Looking_Polymer_With_Immediate_Applications.php?rssid=20230 http://www.semiconductor.net/article/207352-Researchers_Develop_Forward_Looking_Polymer_With_Immediate_Applications.php?rssid=20230 Mon, 04 Feb 2008 14:57:00 GMT A team led by researchers from Rensselaer Polytechnic Institute has developed a polymer that... http://www.semiconductor.net/article/201463-Progress_Claimed_on_CMOS_Crash_Avoidance_Chip.php?rssid=20230 http://www.semiconductor.net/article/201463-Progress_Claimed_on_CMOS_Crash_Avoidance_Chip.php?rssid=20230 Tue, 29 Jan 2008 14:57:00 GMT Using trailing-edge CMOS rather than costly III-V technologies, a team from the Semiconductor... http://www.semiconductor.net/article/201659-Roadmap_Dictated_by_Flash_More_Than_Moore.php?rssid=20230 http://www.semiconductor.net/article/201659-Roadmap_Dictated_by_Flash_More_Than_Moore.php?rssid=20230 Fri, 25 Jan 2008 15:41:00 GMT The 2007 edition of the International Technology Roadmap for Semiconductors (ITRS) projects the... http://www.semiconductor.net/article/201192-CMOS_on_110_Silicon_May_Have_Cost_Appeal.php?rssid=20230 http://www.semiconductor.net/article/201192-CMOS_on_110_Silicon_May_Have_Cost_Appeal.php?rssid=20230 Wed, 23 Jan 2008 15:01:00 GMT Fabbing CMOS on (110)-oriented silicon may provide a low-cost performance boost, although much... http://www.semiconductor.net/article/198538-Unexpected_nFET_Gains_for_110_Silicon.php?rssid=20230 http://www.semiconductor.net/article/198538-Unexpected_nFET_Gains_for_110_Silicon.php?rssid=20230 Mon, 14 Jan 2008 16:27:00 GMT In what could be a significant breakthrough, Sematech researchers have found major performance... http://www.semiconductor.net/article/204749-Heterogeneous_CMOS_Gaining_Momentum.php?rssid=20230 http://www.semiconductor.net/article/204749-Heterogeneous_CMOS_Gaining_Momentum.php?rssid=20230 Thu, 10 Jan 2008 15:09:00 GMT Research groups and equipment companies are stepping up research into heterogeneous CMOS. One... http://www.semiconductor.net/article/201918-Toshiba_CEO_Comments_on_SOI.php?rssid=20230 http://www.semiconductor.net/article/201918-Toshiba_CEO_Comments_on_SOI.php?rssid=20230 Wed, 09 Jan 2008 15:32:00 GMT Toshiba Corp. plans to target the Cell processor to its bulk CMOS process, using the modified... http://www.semiconductor.net/article/198111-1_THz_InP_Transistor_Claims_Speed_Record.php?rssid=20230 http://www.semiconductor.net/article/198111-1_THz_InP_Transistor_Claims_Speed_Record.php?rssid=20230 Thu, 20 Dec 2007 14:16:00 GMT Northrop Grumman Corp. (Redondo Beach, Calif.) is claiming a new world record for transistor... http://www.semiconductor.net/article/205311-NXP_Taking_Phase_Change_to_Embedded.php?rssid=20230 http://www.semiconductor.net/article/205311-NXP_Taking_Phase_Change_to_Embedded.php?rssid=20230 Mon, 17 Dec 2007 13:33:00 GMT NXP Semiconductors (Eindhoven, Netherlands) is developing embedded phase-change memories... http://www.semiconductor.net/article/207942-Intel_Takes_45_nm_HKMG_Process_to_IEDM.php?rssid=20230 http://www.semiconductor.net/article/207942-Intel_Takes_45_nm_HKMG_Process_to_IEDM.php?rssid=20230 Fri, 14 Dec 2007 18:30:00 GMT Intel Corp.'s "high-k first, metal gate last" 45 nm process technology, the first to use... http://www.semiconductor.net/article/198103-ISI_Describes_Gen2_Z_RAM_Memory.php?rssid=20230 http://www.semiconductor.net/article/198103-ISI_Describes_Gen2_Z_RAM_Memory.php?rssid=20230 Thu, 13 Dec 2007 12:08:00 GMT Innovative Silicon Inc. (Lausanne, Switzerland) chief scientist Serguei Okhonin described the... http://www.semiconductor.net/article/197349-IMEC_Reports_Progress_on_High_k_Metal_Gates.php?rssid=20230 http://www.semiconductor.net/article/197349-IMEC_Reports_Progress_on_High_k_Metal_Gates.php?rssid=20230 Tue, 11 Dec 2007 16:11:00 GMT At IEEE’s International Electron Devices Meeting (IEDM), IMEC (Leuven, Belgium) reported... http://www.semiconductor.net/article/208220-Equipment_CTOs_See_Memory_Opportunities.php?rssid=20230 http://www.semiconductor.net/article/208220-Equipment_CTOs_See_Memory_Opportunities.php?rssid=20230 Tue, 11 Dec 2007 11:45:00 GMT Equipment technologists came to the International Electron Devices Meeting (IEDM), being held... http://www.semiconductor.net/article/197529-Sematech_High_k_Research_Goes_On_Stage_at_IEDM.php?rssid=20230 http://www.semiconductor.net/article/197529-Sematech_High_k_Research_Goes_On_Stage_at_IEDM.php?rssid=20230 Thu, 06 Dec 2007 12:01:00 GMT Sematech researchers will present papers on high-k and metal gate research work, flash annealing... http://www.semiconductor.net/article/202807-Opportunities_Abound_for_Organic_Packaging_Materials_Development.php?rssid=20230 http://www.semiconductor.net/article/202807-Opportunities_Abound_for_Organic_Packaging_Materials_Development.php?rssid=20230 Wed, 05 Dec 2007 18:36:00 GMT Development of semiconductor organic packaging materials remains focused on improving... http://www.semiconductor.net/article/206879-IEDM_Late_Papers_Push_pFETs_in_110_Silicon_Germanium_SOI.php?rssid=20230 http://www.semiconductor.net/article/206879-IEDM_Late_Papers_Push_pFETs_in_110_Silicon_Germanium_SOI.php?rssid=20230 Sat, 24 Nov 2007 00:03:00 GMT A trio of late papers accepted for presentation at the upcoming International Electron Devices... http://www.semiconductor.net/article/206308-Kovio_Inkjet_Prints_Fast_Silicon_Transistor.php?rssid=20230 http://www.semiconductor.net/article/206308-Kovio_Inkjet_Prints_Fast_Silicon_Transistor.php?rssid=20230 Wed, 14 Nov 2007 13:00:00 GMT In a claimed breakthrough for printed electronics, Kovio Inc.(Sunnyvale, Calif.) announced that... http://www.semiconductor.net/article/207818-Nikko_Materials_Ready_With_450_mm_Test_Wafer.php?rssid=20230 http://www.semiconductor.net/article/207818-Nikko_Materials_Ready_With_450_mm_Test_Wafer.php?rssid=20230 Mon, 12 Nov 2007 16:02:00 GMT Nikko Materials will make 450 mm test wafers aimed at customers developing wafer-handling... http://www.semiconductor.net/article/207936-Nitronex_Qualifies_Durham_Fab_for_GaN_Process.php?rssid=20230 http://www.semiconductor.net/article/207936-Nitronex_Qualifies_Durham_Fab_for_GaN_Process.php?rssid=20230 Wed, 07 Nov 2007 16:55:00 GMT Nitronex Inc. (Durham, N.C.) said it has qualified its new facility for manufacturing gallium... http://www.semiconductor.net/article/201871-Chemical_Provider_SAFC_Hitech_Signs_With_Korean_Province.php?rssid=20230 http://www.semiconductor.net/article/201871-Chemical_Provider_SAFC_Hitech_Signs_With_Korean_Province.php?rssid=20230 Tue, 06 Nov 2007 14:02:00 GMT SAFC Hitech announced that it signed a memorandum of understanding (MoU) with Gyeonggi Province,... http://www.semiconductor.net/article/205045-Covalent_Takes_Unique_Course_After_Separation_From_Toshiba.php?rssid=20230 http://www.semiconductor.net/article/205045-Covalent_Takes_Unique_Course_After_Separation_From_Toshiba.php?rssid=20230 Wed, 31 Oct 2007 14:38:00 GMT Susumu Kohyama, CEO of Covalent Materials Corp., explains why he took the company — formerly... http://www.semiconductor.net/article/196694-_Big_Four_Talking_450_With_Tool_Vendors.php?rssid=20230 http://www.semiconductor.net/article/196694-_Big_Four_Talking_450_With_Tool_Vendors.php?rssid=20230 Tue, 30 Oct 2007 14:06:00 GMT A slightly thicker standard for the 450 mm wafers is being discussed, said Mike Goldstein, an... http://www.semiconductor.net/article/200377-Chipworks_Begins_Teardown_of_Intel_45_nm_Penryn_MPUs.php?rssid=20230 http://www.semiconductor.net/article/200377-Chipworks_Begins_Teardown_of_Intel_45_nm_Penryn_MPUs.php?rssid=20230 Fri, 26 Oct 2007 18:23:00 GMT Chipworks, a teardown engineering firm based in Ottowa, said it has gotten its hands on Intel's... http://www.semiconductor.net/article/196479-ISMI_Readies_450_mm_Test_Bed_Wafer_Bank.php?rssid=20230 http://www.semiconductor.net/article/196479-ISMI_Readies_450_mm_Test_Bed_Wafer_Bank.php?rssid=20230 Thu, 25 Oct 2007 15:01:00 GMT ISMI managers said a test bed to develop 450 mm wafer-handling and interface standards will be... http://www.semiconductor.net/article/197112-Study_Shows_Sapphire_Substrates_Dominate_GaN_Market.php?rssid=20230 http://www.semiconductor.net/article/197112-Study_Shows_Sapphire_Substrates_Dominate_GaN_Market.php?rssid=20230 Wed, 24 Oct 2007 13:00:00 GMT With an annual volume of more than 5 millions units of 2 in. equivalent substrates, GaN-based... http://www.semiconductor.net/article/200060-EU_s_REACH_to_Impact_European_Fab_Costs.php?rssid=20230 http://www.semiconductor.net/article/200060-EU_s_REACH_to_Impact_European_Fab_Costs.php?rssid=20230 Tue, 23 Oct 2007 10:54:00 GMT The European Union's new program to register chemicals, including those used in semiconductor... http://www.semiconductor.net/article/200168-PECVD_Could_Take_Low_k_to_2_1.php?rssid=20230 http://www.semiconductor.net/article/200168-PECVD_Could_Take_Low_k_to_2_1.php?rssid=20230 Fri, 19 Oct 2007 19:08:00 GMT At the recent IMEC Annual Research Review Meeting this week, Rudi Cartuyvels, department... http://www.semiconductor.net/article/198535-Nobel_Winners_Aided_Semi_HDD_Research.php?rssid=20230 http://www.semiconductor.net/article/198535-Nobel_Winners_Aided_Semi_HDD_Research.php?rssid=20230 Thu, 11 Oct 2007 11:18:00 GMT The work done by semiconductor industry researchers has intertwined with advances made by the... http://www.semiconductor.net/article/205671-SOI_Consortium_Aimed_at_Mobile_Systems.php?rssid=20230 http://www.semiconductor.net/article/205671-SOI_Consortium_Aimed_at_Mobile_Systems.php?rssid=20230 Tue, 09 Oct 2007 13:48:00 GMT Chairman of the newly formed SOI Industry Consortium, André-Jacques Auberton-Hervé, said SOI... http://www.semiconductor.net/article/207617-SOI_Consortium_Formed_With_19_Members.php?rssid=20230 http://www.semiconductor.net/article/207617-SOI_Consortium_Formed_With_19_Members.php?rssid=20230 Mon, 08 Oct 2007 15:26:00 GMT The SOI Industry Consortium was announced, with 19 founding members and a goal of promoting... http://www.semiconductor.net/article/197573-Breakthrough_Claimed_for_Ge_Insulators.php?rssid=20230 http://www.semiconductor.net/article/197573-Breakthrough_Claimed_for_Ge_Insulators.php?rssid=20230 Thu, 04 Oct 2007 10:29:00 GMT North Carolina State University professor Gerald Lucovsky said his team has developed a... http://www.semiconductor.net/article/200484-A_Step_Up_for_High_k_CMOS.php?rssid=20230 http://www.semiconductor.net/article/200484-A_Step_Up_for_High_k_CMOS.php?rssid=20230 Mon, 01 Oct 2007 06:00:00 GMT Sematech, a consortium of leading semiconductor manufacturers, began operations in 1988 in... http://www.semiconductor.net/article/199398-High_k_Paradigm_Shift_Moves_Forward.php?rssid=20230 http://www.semiconductor.net/article/199398-High_k_Paradigm_Shift_Moves_Forward.php?rssid=20230 Thu, 27 Sep 2007 11:23:00 GMT Researchers at a Sematech symposium on gate stack technology gathered in Dallas to consider... http://www.semiconductor.net/article/208193-AMAT_Wafer_Reclaim_Center_Reaches_Certification.php?rssid=20230 http://www.semiconductor.net/article/208193-AMAT_Wafer_Reclaim_Center_Reaches_Certification.php?rssid=20230 Tue, 18 Sep 2007 15:53:00 GMT The Applied Materials Wafer Reclaim Center in Tainan has proprietary skills at removing the... http://www.semiconductor.net/article/206436-EU_Approves_Funding_for_NanoSmart_Program.php?rssid=20230 http://www.semiconductor.net/article/206436-EU_Approves_Funding_for_NanoSmart_Program.php?rssid=20230 Thu, 13 Sep 2007 20:27:00 GMT Soitec said it has received European Union approval for an R&D program, called NanoSmart, to... http://www.semiconductor.net/article/199956-ATMI_Buys_Intermolecular_Tools.php?rssid=20230 http://www.semiconductor.net/article/199956-ATMI_Buys_Intermolecular_Tools.php?rssid=20230 Tue, 11 Sep 2007 21:48:00 GMT ATMI has purchased the combinatorial “Tempus” tools from Intermolecular. ATMI will use the... http://www.semiconductor.net/article/200160-Rohm_Haas_Orders_SUSS_Tool_for_Materials_Development.php?rssid=20230 http://www.semiconductor.net/article/200160-Rohm_Haas_Orders_SUSS_Tool_for_Materials_Development.php?rssid=20230 Tue, 11 Sep 2007 17:01:00 GMT SUSS MicroTec received an initial order from Rohm and Haas Electronic Materials for its Gamma... http://www.semiconductor.net/article/204454-IBM_Reaches_for_Single_Atom_Data_Storage.php?rssid=20230 http://www.semiconductor.net/article/204454-IBM_Reaches_for_Single_Atom_Data_Storage.php?rssid=20230 Mon, 10 Sep 2007 21:03:00 GMT The IBM Almaden Research Center has advanced its understanding of the capability of an atom to... http://www.semiconductor.net/article/203866-MEMC_Shutdown_Tightens_Poly_Si_Supply.php?rssid=20230 http://www.semiconductor.net/article/203866-MEMC_Shutdown_Tightens_Poly_Si_Supply.php?rssid=20230 Tue, 04 Sep 2007 20:27:00 GMT An electrical subcontractor working on an expansion of the polysilicon production facility of... http://www.semiconductor.net/article/197907-Short_Courses_Kick_Off_IEDM.php?rssid=20230 http://www.semiconductor.net/article/197907-Short_Courses_Kick_Off_IEDM.php?rssid=20230 Tue, 04 Sep 2007 13:07:00 GMT The 2007 International Electron Devices Meeting will be preceded by two short courses on CMOS... http://www.semiconductor.net/article/204702-Dow_Corning_Receives_Low_k_Dielectric_Process_Patent.php?rssid=20230 http://www.semiconductor.net/article/204702-Dow_Corning_Receives_Low_k_Dielectric_Process_Patent.php?rssid=20230 Tue, 28 Aug 2007 09:25:00 GMT Dow Corning said it has been awarded a U.S. patent for a method for making low-k silicon carbide... http://www.semiconductor.net/article/198353-IQE_Anadigics_Ink_Deal.php?rssid=20230 http://www.semiconductor.net/article/198353-IQE_Anadigics_Ink_Deal.php?rssid=20230 Wed, 22 Aug 2007 17:44:00 GMT IQE said it has signed a multi-year contract with Anadigics to supply GaAs epitaxial wafers to... http://www.semiconductor.net/article/206719-Sematech_Touts_High_k_Papers_at_VLSI_Symposium.php?rssid=20230 http://www.semiconductor.net/article/206719-Sematech_Touts_High_k_Papers_at_VLSI_Symposium.php?rssid=20230 Mon, 20 Aug 2007 15:18:00 GMT Sematech researchers presented a series of technical papers on high-k dielectrics and metal... http://www.semiconductor.net/article/201962-IBM_and_TDK_Partner_on_Spin_Torque_MRAM.php?rssid=20230 http://www.semiconductor.net/article/201962-IBM_and_TDK_Partner_on_Spin_Torque_MRAM.php?rssid=20230 Mon, 20 Aug 2007 05:00:00 GMT IBM Corp. (Armonk, N.Y.) and TDK Corp. (Tokyo) announced a four-year joint program to develop... http://www.semiconductor.net/article/197609-Hynix_Licenses_ISI_s_Second_Generation_Z_RAM_Memory_Technology.php?rssid=20230 http://www.semiconductor.net/article/197609-Hynix_Licenses_ISI_s_Second_Generation_Z_RAM_Memory_Technology.php?rssid=20230 Mon, 13 Aug 2007 14:02:00 GMT In a major endorsement of the second-generation Z-RAM technology developed by Innovative... http://www.semiconductor.net/article/199938-Bulk_or_SOI_AMD_Considering_Its_Options.php?rssid=20230 http://www.semiconductor.net/article/199938-Bulk_or_SOI_AMD_Considering_Its_Options.php?rssid=20230 Tue, 31 Jul 2007 18:30:00 GMT Advanced Micro Devices (Sunnyvale, Calif.) is still mulling whether to use silicon on insulator... http://www.semiconductor.net/article/197491-SRC_Receives_National_Medal_of_Technology_at_White_House.php?rssid=20230 http://www.semiconductor.net/article/197491-SRC_Receives_National_Medal_of_Technology_at_White_House.php?rssid=20230 Fri, 27 Jul 2007 11:37:00 GMT The Semiconductor Research Corp. was awarded the National Medal of Technology in a White House... http://www.semiconductor.net/article/206887-Sematech_s_ISMI_Announces_450_mm_Wafer_Program.php?rssid=20230 http://www.semiconductor.net/article/206887-Sematech_s_ISMI_Announces_450_mm_Wafer_Program.php?rssid=20230 Thu, 19 Jul 2007 14:38:00 GMT The International Sematech Manufacturing Initiative (ISMI) announced a “comprehensive... http://www.semiconductor.net/article/197382-Transitioning_to_300mmPrime_and_450_mm.php?rssid=20230 http://www.semiconductor.net/article/197382-Transitioning_to_300mmPrime_and_450_mm.php?rssid=20230 Thu, 19 Jul 2007 06:00:00 GMT Over the past 30 years, the industry has changed wafer sizes five times, with the most recent... http://www.semiconductor.net/article/200305-Productivity_Cycle_Time_450_mm.php?rssid=20230 http://www.semiconductor.net/article/200305-Productivity_Cycle_Time_450_mm.php?rssid=20230 Thu, 19 Jul 2007 06:00:00 GMT Continuing to improve on the existing and future 300 mm base has tremendous payoff for the... http://www.semiconductor.net/article/201893-Are_High_k_Metal_Gates_Ready_.php?rssid=20230 http://www.semiconductor.net/article/201893-Are_High_k_Metal_Gates_Ready_.php?rssid=20230 Wed, 18 Jul 2007 06:00:00 GMT While true high-volume production of high-k/metal gates may still be three years away, Applied... http://www.semiconductor.net/article/196766-AMAT_Takes_Wraps_Off_High_k_Chamber.php?rssid=20230 http://www.semiconductor.net/article/196766-AMAT_Takes_Wraps_Off_High_k_Chamber.php?rssid=20230 Tue, 17 Jul 2007 10:45:00 GMT With logic and NAND flash vendors readying production of high-k/metal gate-enhanced chips,... http://www.semiconductor.net/article/208334-Intermolecular_Goes_Public_With_Tempus_Combinatorial_Research_Tools.php?rssid=20230 http://www.semiconductor.net/article/208334-Intermolecular_Goes_Public_With_Tempus_Combinatorial_Research_Tools.php?rssid=20230 Tue, 17 Jul 2007 03:00:00 GMT After several years as a stealth startup, Intermolecular Inc. (San Jose) launched its... http://www.semiconductor.net/article/203540-AMD_and_IBM_Demonstrate_Higher_Performance_65_nm_Process_Technologies.php?rssid=20230 http://www.semiconductor.net/article/203540-AMD_and_IBM_Demonstrate_Higher_Performance_65_nm_Process_Technologies.php?rssid=20230 Tue, 06 Dec 2005 07:00:00 GMT In papers presented this week at IEDM, IBM and AMD detailed their progress in bringing new,... http://www.semiconductor.net/article/199056-Flourine_Improves_Polysilicon_Resistor_Stability.php?rssid=20230 http://www.semiconductor.net/article/199056-Flourine_Improves_Polysilicon_Resistor_Stability.php?rssid=20230 Wed, 01 Aug 2001 06:00:00 GMT ... http://www.semiconductor.net/article/199947-Putting_EUV_Optics_to_the_Test.php?rssid=20230 http://www.semiconductor.net/article/199947-Putting_EUV_Optics_to_the_Test.php?rssid=20230 Sun, 01 Jul 2001 06:00:00 GMT One of the most promising candidates for next-generation lithography is the use of EUV radiation... http://www.semiconductor.net/article/199106-Organic_Channel_FET_Device_Used_as_pH_Sensor.php?rssid=20230 http://www.semiconductor.net/article/199106-Organic_Channel_FET_Device_Used_as_pH_Sensor.php?rssid=20230 Fri, 01 Jun 2001 06:00:00 GMT Carmen Bartic and researchers at IMEC (Leuven, Belgium) have developed organic field effect... http://www.semiconductor.net/article/200393-Alternative_Gate_Dielectric_Material_Shows_Promise.php?rssid=20230 http://www.semiconductor.net/article/200393-Alternative_Gate_Dielectric_Material_Shows_Promise.php?rssid=20230 Tue, 01 May 2001 06:00:00 GMT Researchers have successfully deposited crystalline yttria-stabilized zirconia oxide (YSZ) on a... http://www.semiconductor.net/article/203009-Silicon_Competes_With_SiGe_in_Mobile_Phone_Market.php?rssid=20230 http://www.semiconductor.net/article/203009-Silicon_Competes_With_SiGe_in_Mobile_Phone_Market.php?rssid=20230 Sun, 01 Apr 2001 07:00:00 GMT Philips Semiconductors has announced a QUBiC4 (quality BiCMOS 4) silicon BiCMOS process for... http://www.semiconductor.net/article/200726-DERA_Develops_SiGe_Virtual_Substrates_for_New_Silicon_Based_Devices.php?rssid=20230 http://www.semiconductor.net/article/200726-DERA_Develops_SiGe_Virtual_Substrates_for_New_Silicon_Based_Devices.php?rssid=20230 Thu, 01 Mar 2001 07:00:00 GMT Virtual substrates, with surface layers of strain-relaxed SiGe, have been produced by using... http://www.semiconductor.net/article/208371-Laser_Crystallization_Produces_High_Quality_TFTs.php?rssid=20230 http://www.semiconductor.net/article/208371-Laser_Crystallization_Produces_High_Quality_TFTs.php?rssid=20230 Thu, 01 Feb 2001 07:00:00 GMT Large-area electronic devices, including active-matrix liquid crystal displays (AMLCDs) and... http://www.semiconductor.net/article/209240-Polysilicon_Micromachining_Technique_Integrates_MEMS_Processes.php?rssid=20230 http://www.semiconductor.net/article/209240-Polysilicon_Micromachining_Technique_Integrates_MEMS_Processes.php?rssid=20230 Mon, 01 Jan 2001 07:00:00 GMT The Defence Evaluation and Research Agency (DERA, Malvern, UK) has developed a polysilicon... http://www.semiconductor.net/article/201857-Samsung_Fabricates_70_nm_Devices_with_Traditional_Materials.php?rssid=20230 http://www.semiconductor.net/article/201857-Samsung_Fabricates_70_nm_Devices_with_Traditional_Materials.php?rssid=20230 Fri, 01 Dec 2000 07:00:00 GMT Seungheon Song, an invited speaker from Samsung Electronics (Kyunggi-Do, Korea), will present... http://www.semiconductor.net/article/205780-IMEC_Investigates_High_k_Gate_Dielectrics_For_Deep_Submicron_Devices.php?rssid=20230 http://www.semiconductor.net/article/205780-IMEC_Investigates_High_k_Gate_Dielectrics_For_Deep_Submicron_Devices.php?rssid=20230 Fri, 01 Dec 2000 07:00:00 GMT The sustained success of the silicon semiconductor industry owes a great deal to the properties... http://www.semiconductor.net/article/196804-Display_Uses_Polymeric_Semiconductor_for_Pixel_Driving.php?rssid=20230 http://www.semiconductor.net/article/196804-Display_Uses_Polymeric_Semiconductor_for_Pixel_Driving.php?rssid=20230 Wed, 01 Nov 2000 07:00:00 GMT Philips Research Laboratories (Eindhoven, Netherlands) has made a64x64 pixel display in which... http://www.semiconductor.net/article/196844-Thin_Shape_Memory_Films_for_Micro_Actuators.php?rssid=20230 http://www.semiconductor.net/article/196844-Thin_Shape_Memory_Films_for_Micro_Actuators.php?rssid=20230 Sun, 01 Oct 2000 06:00:00 GMT The continuing miniaturization of microelectronic devices has generated a need for smaller and... http://www.semiconductor.net/article/203003-DNA_Motors_Could_Make_Test_Tube_ICs_Possible.php?rssid=20230 http://www.semiconductor.net/article/203003-DNA_Motors_Could_Make_Test_Tube_ICs_Possible.php?rssid=20230 Fri, 01 Sep 2000 06:00:00 GMT Scientists from the University of Oxford and Bell Labs, the research and development arm of... http://www.semiconductor.net/article/206952-MILC_Used_to_Convert_Silicon_in_TFTs.php?rssid=20230 http://www.semiconductor.net/article/206952-MILC_Used_to_Convert_Silicon_in_TFTs.php?rssid=20230 Tue, 01 Aug 2000 06:00:00 GMT Part of the challenge in producing high-quality thin-film transistors (TFTs) for flat-panel... http://www.semiconductor.net/article/198824-RTO_and_SiN_An_Optimum_Low_Cost_Si_Passivation.php?rssid=20230 http://www.semiconductor.net/article/198824-RTO_and_SiN_An_Optimum_Low_Cost_Si_Passivation.php?rssid=20230 Sat, 01 Jul 2000 06:00:00 GMT The performance of many silicon devices, including solar cells, BJTs, CCDs and power devices,... http://www.semiconductor.net/article/205874-InGaAs_A_Door_to_the_Internet_and_More.php?rssid=20230 http://www.semiconductor.net/article/205874-InGaAs_A_Door_to_the_Internet_and_More.php?rssid=20230 Wed, 01 Mar 2000 07:00:00 GMT Over the past two years, the number of compound semiconductors in communication applications has... http://www.semiconductor.net/article/208452-Can_We_Meet_the_Materials_Challenge_.php?rssid=20230 http://www.semiconductor.net/article/208452-Can_We_Meet_the_Materials_Challenge_.php?rssid=20230 Wed, 01 Mar 2000 07:00:00 GMT It's become increasingly clear that in order for the semiconductor industry to continue the same...