http://www.semiconductor.net Mon, 09 Nov 2009 20:21:11 MST eng Copyright 2009 Reed Business Information. Subject to its Terms of Use (http://www.semiconductor.net/info/terms-and-conditions.php) http://www.semiconductor.net/article/365835-Industry_Wary_of_Greenhouse_Gas_Rules.php?rssid=20229 http://www.semiconductor.net/article/365835-Industry_Wary_of_Greenhouse_Gas_Rules.php?rssid=20229 Wed, 21 Oct 2009 12:13:45 GMT Controls on PFCs and other greenhouse gases by the Obama administration could impact how the... http://www.semiconductor.net/article/365720-ISMI_Readies_Fab_Risk_Assessment_Tool.php?rssid=20229 http://www.semiconductor.net/article/365720-ISMI_Readies_Fab_Risk_Assessment_Tool.php?rssid=20229 Tue, 20 Oct 2009 14:24:08 GMT A risk assessment tool will soon be available for fab safety from Sematech subsidiary ISMI. The... http://www.semiconductor.net/article/356527-Remanufactured_Spindles_Reduce_Repair_Costs.php?rssid=20229 http://www.semiconductor.net/article/356527-Remanufactured_Spindles_Reduce_Repair_Costs.php?rssid=20229 Fri, 02 Oct 2009 14:31:37 GMT Fala Technologies Inc. and Sparetech Inc. are offering a high-performance remanufactured spindle... http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20229 http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20229 Tue, 28 Jul 2009 15:11:43 GMT GlobalFoundries plans to introduce embedded silicon carbon (eSiC) to strain the nFET transistors... http://www.semiconductor.net/article/315522-Nano_Green_Takes_Best_of_West_Award.php?rssid=20229 http://www.semiconductor.net/article/315522-Nano_Green_Takes_Best_of_West_Award.php?rssid=20229 Thu, 16 Jul 2009 17:14:15 GMT The Best of West award is bestowed by show organizer SEMI to honor innovations that represent... http://www.semiconductor.net/article/278844-Rave_Lands_Rhazer_at_Chartered_s_Fab_7.php?rssid=20229 http://www.semiconductor.net/article/278844-Rave_Lands_Rhazer_at_Chartered_s_Fab_7.php?rssid=20229 Tue, 09 Jun 2009 15:05:14 GMT Rave LLC said its Rhazer haze removal technology has been evaluated by Chartered Semiconductor.... http://www.semiconductor.net/article/278834-Novellus_Improves_Clean_Process_for_Speed_Max_Gapfill_Tool.php?rssid=20229 http://www.semiconductor.net/article/278834-Novellus_Improves_Clean_Process_for_Speed_Max_Gapfill_Tool.php?rssid=20229 Tue, 09 Jun 2009 14:19:27 GMT Novellus said it has improved the in situ clean steps for its CVD gapfill platform, reducing... http://www.semiconductor.net/article/232542-Novellus_Adapts_Resist_Strip_for_3X_Node.php?rssid=20229 http://www.semiconductor.net/article/232542-Novellus_Adapts_Resist_Strip_for_3X_Node.php?rssid=20229 Thu, 14 May 2009 15:39:00 GMT Novellus Systems said it has developed a photoresist stripping process that meets the challenges... http://www.semiconductor.net/article/202241-Post_RIE_BEOL_Cleaning_Gains_Attention.php?rssid=20229 http://www.semiconductor.net/article/202241-Post_RIE_BEOL_Cleaning_Gains_Attention.php?rssid=20229 Wed, 08 Apr 2009 16:18:00 GMT Cleaning leading-edge copper interconnect layers has become a major challenge, particularly as... http://www.semiconductor.net/article/208941-FSI_Adds_Steam_to_Photoresist_Clean_Step.php?rssid=20229 http://www.semiconductor.net/article/208941-FSI_Adds_Steam_to_Photoresist_Clean_Step.php?rssid=20229 Thu, 26 Mar 2009 15:35:00 GMT FSI International has developed an all-wet cleaning process that preserves ultrashallow... http://www.semiconductor.net/article/204360-Rinse_Dry_Steps_Get_New_Look_at_SPCC.php?rssid=20229 http://www.semiconductor.net/article/204360-Rinse_Dry_Steps_Get_New_Look_at_SPCC.php?rssid=20229 Thu, 26 Mar 2009 07:26:00 GMT The Sematech Surface Preparation and Cleaning Conference (SPCC) opened with several... http://www.semiconductor.net/article/205210-ACM_Research_Claims_Megasonic_Solution.php?rssid=20229 http://www.semiconductor.net/article/205210-ACM_Research_Claims_Megasonic_Solution.php?rssid=20229 Tue, 17 Mar 2009 15:33:00 GMT ACM Research said its Shanghai-based R&D team has developed a megasonic cleaning tool, the Ultra... http://www.semiconductor.net/article/202975-SRC_and_IMEC_to_Cooperate_on_ESH_Studies_of_New_Materials.php?rssid=20229 http://www.semiconductor.net/article/202975-SRC_and_IMEC_to_Cooperate_on_ESH_Studies_of_New_Materials.php?rssid=20229 Tue, 17 Feb 2009 17:40:00 GMT The Semiconductor Research Corp. will work with IMEC on environment, safety and health research... http://www.semiconductor.net/article/201917-Sematech_Launches_ESH_Tech_Center.php?rssid=20229 http://www.semiconductor.net/article/201917-Sematech_Launches_ESH_Tech_Center.php?rssid=20229 Tue, 27 Jan 2009 14:53:00 GMT The International Sematech Manufacturing Initiative (ISMI) has launched its Environment, Safety... http://www.semiconductor.net/article/196729-Ulvac_Enables_Flexible_Li_Ion_Battery.php?rssid=20229 http://www.semiconductor.net/article/196729-Ulvac_Enables_Flexible_Li_Ion_Battery.php?rssid=20229 Mon, 22 Dec 2008 14:46:00 GMT Ulvac Inc. said it has developed a process flow for very thin lithium-ion cells, which may be... http://www.semiconductor.net/article/200144-Ulvac_Readies_Resist_Residue_Removal_Tool.php?rssid=20229 http://www.semiconductor.net/article/200144-Ulvac_Readies_Resist_Residue_Removal_Tool.php?rssid=20229 Fri, 05 Dec 2008 22:50:00 GMT Ulvac Inc. demonstrated its recently released residue removal tool at SEMICON Japan. The Enviro... http://www.semiconductor.net/article/204252-FSI_Enters_Single_Wafer_Clean_Market.php?rssid=20229 http://www.semiconductor.net/article/204252-FSI_Enters_Single_Wafer_Clean_Market.php?rssid=20229 Mon, 03 Nov 2008 17:22:00 GMT FSI International (Chaska, Minn.) has made its single-wafer debut with its Orion cleaning... http://www.semiconductor.net/article/205038-Environmental_Regulations_Growing_More_Complex.php?rssid=20229 http://www.semiconductor.net/article/205038-Environmental_Regulations_Growing_More_Complex.php?rssid=20229 Wed, 22 Oct 2008 11:37:00 GMT Participants at an ISMI meeting on emerging environment, safety and health (ESH) regulations... http://www.semiconductor.net/article/199642-IMEC_Views_3_D_Stacking_as_System_Design.php?rssid=20229 http://www.semiconductor.net/article/199642-IMEC_Views_3_D_Stacking_as_System_Design.php?rssid=20229 Tue, 14 Oct 2008 12:53:00 GMT IMEC managers said the research center has made significant progress creating test 3-D ICs,... http://www.semiconductor.net/article/206268-Shin_Etsu_Polymer_Develops_Lightweight_Resin_Frame_for_Thin_Wafers.php?rssid=20229 http://www.semiconductor.net/article/206268-Shin_Etsu_Polymer_Develops_Lightweight_Resin_Frame_for_Thin_Wafers.php?rssid=20229 Wed, 06 Aug 2008 15:49:00 GMT Shin-Etsu Polymer has developed a lightweight resin frame to handle and transport thinned... http://www.semiconductor.net/article/197763-Ulvac_Intros_High_Throughput_Asher.php?rssid=20229 http://www.semiconductor.net/article/197763-Ulvac_Intros_High_Throughput_Asher.php?rssid=20229 Wed, 16 Jul 2008 14:00:00 GMT At SEMICON West, Ulvac introduced the Enviro Optima resist strip and residue cleaning system,... http://www.semiconductor.net/article/207695-In_Battle_Against_Haze_Rave_Wields_Rhazer.php?rssid=20229 http://www.semiconductor.net/article/207695-In_Battle_Against_Haze_Rave_Wields_Rhazer.php?rssid=20229 Tue, 15 Jul 2008 17:37:00 GMT Rave LLC has developed a prototype haze removal system, Rhazer, which can break down haze... http://www.semiconductor.net/article/203472-iNEMI_Issues_Recommendations_for_Managing_Lead_Free_Solder_Alloys.php?rssid=20229 http://www.semiconductor.net/article/203472-iNEMI_Issues_Recommendations_for_Managing_Lead_Free_Solder_Alloys.php?rssid=20229 Thu, 10 Jul 2008 14:31:00 GMT iNEMI has outlined a set of key approaches to help the electronics industry respond to the many... http://www.semiconductor.net/article/204862-Novellus_Offers_Dry_Strip_Tools_for_High_Volume_Memory_Advanced_Logic.php?rssid=20229 http://www.semiconductor.net/article/204862-Novellus_Offers_Dry_Strip_Tools_for_High_Volume_Memory_Advanced_Logic.php?rssid=20229 Mon, 19 May 2008 16:08:00 GMT Novellus Systems announced two derivatives to its Gamma Express dry strip and clean platform:... http://www.semiconductor.net/article/203667-Haze_Still_Misunderstood_Costing_Industry_1B_a_Year.php?rssid=20229 http://www.semiconductor.net/article/203667-Haze_Still_Misunderstood_Costing_Industry_1B_a_Year.php?rssid=20229 Wed, 07 May 2008 17:10:00 GMT Arguably the single largest yield detractor in the semiconductor industry, costing the industry... http://www.semiconductor.net/article/198696-Applied_Tackles_Edge_With_Inflexion_Polishing_System.php?rssid=20229 http://www.semiconductor.net/article/198696-Applied_Tackles_Edge_With_Inflexion_Polishing_System.php?rssid=20229 Wed, 07 May 2008 14:24:00 GMT Applied Materials introduced the Inflexion edge polishing system that has an integrated wafer... http://www.semiconductor.net/article/207684-SEZ_Group_Now_Lam_s_Spin_Clean_Division.php?rssid=20229 http://www.semiconductor.net/article/207684-SEZ_Group_Now_Lam_s_Spin_Clean_Division.php?rssid=20229 Thu, 24 Apr 2008 15:33:00 GMT Lam Research Corp. executives said they have created a Spin Clean Division to attack... http://www.semiconductor.net/article/203707-ITRS_ESH_Chapter_Emphasizes_Sustainable_Development.php?rssid=20229 http://www.semiconductor.net/article/203707-ITRS_ESH_Chapter_Emphasizes_Sustainable_Development.php?rssid=20229 Wed, 16 Apr 2008 21:37:00 GMT Sustainable development is the idea that manufacturing companies can satisfy their present... http://www.semiconductor.net/article/200824-Clean_Steps_Struggle_to_Minimize_Material_Loss.php?rssid=20229 http://www.semiconductor.net/article/200824-Clean_Steps_Struggle_to_Minimize_Material_Loss.php?rssid=20229 Thu, 10 Apr 2008 17:02:00 GMT As noted throughout Sematech’s Surface Preparation and Cleaning Conference last week, cleaning... http://www.semiconductor.net/article/199919-New_Materials_Driving_Wafer_Cleaning_Challenges.php?rssid=20229 http://www.semiconductor.net/article/199919-New_Materials_Driving_Wafer_Cleaning_Challenges.php?rssid=20229 Thu, 03 Apr 2008 14:48:00 GMT Wafer cleaning faces new challenges, as high-k dielectrics and metal gates are brought in at the... http://www.semiconductor.net/article/202317-Intel_Tackles_EUV_Mask_Cleans.php?rssid=20229 http://www.semiconductor.net/article/202317-Intel_Tackles_EUV_Mask_Cleans.php?rssid=20229 Wed, 02 Apr 2008 16:24:00 GMT At Sematech’s Surface Preparation and Cleaning Conference in Austin, Texas, Intel’s Ted... http://www.semiconductor.net/article/203533-iNEMI_Launching_Studies_of_Lead_Free_Alloys.php?rssid=20229 http://www.semiconductor.net/article/203533-iNEMI_Launching_Studies_of_Lead_Free_Alloys.php?rssid=20229 Wed, 02 Apr 2008 14:32:00 GMT The International Electronics Manufacturing Initiative (iNEMI) is forming projects related to... http://www.semiconductor.net/article/203954-IBM_Brings_Hitachi_Into_Albany_Ecosystem.php?rssid=20229 http://www.semiconductor.net/article/203954-IBM_Brings_Hitachi_Into_Albany_Ecosystem.php?rssid=20229 Tue, 11 Mar 2008 10:29:00 GMT IBM and Hitachi researchers will work together on metrology challenges arising at the 22 nm node... http://www.semiconductor.net/article/202583-Kyosemi_Uses_Ball_Diodes_in_PV_Modules.php?rssid=20229 http://www.semiconductor.net/article/202583-Kyosemi_Uses_Ball_Diodes_in_PV_Modules.php?rssid=20229 Mon, 10 Mar 2008 14:59:00 GMT At a solar expo in Tokyo, Kyosemi Corp. (Kyoto, Japan) demonstrated arrays of spherical PIN... http://www.semiconductor.net/article/201233-ACM_Research_Expanding_in_Shanghai.php?rssid=20229 http://www.semiconductor.net/article/201233-ACM_Research_Expanding_in_Shanghai.php?rssid=20229 Wed, 05 Mar 2008 13:31:00 GMT ACM Research Inc. (Fremont, Calif.) said it plans to expand its Shanghai R&D, production and... http://www.semiconductor.net/article/200923-Applied_Materials_Patterning_Requires_Innovative_Metrology.php?rssid=20229 http://www.semiconductor.net/article/200923-Applied_Materials_Patterning_Requires_Innovative_Metrology.php?rssid=20229 Thu, 28 Feb 2008 13:58:00 GMT Applied Materials (Santa Clara, Calif.) concurrently held its 12th Annual Technology Forum with... http://www.semiconductor.net/article/206975-Schott_Claims_Progress_in_LuAG_Absorption_for_High_Index_Lithography.php?rssid=20229 http://www.semiconductor.net/article/206975-Schott_Claims_Progress_in_LuAG_Absorption_for_High_Index_Lithography.php?rssid=20229 Fri, 22 Feb 2008 19:50:00 GMT In a boost for high-index lithography, Schott Lithotec (Jena, Germany) said it has made... http://www.semiconductor.net/article/201058-Harmotec_Non_Contact_Pick_up_Tool_Handles_Thin_Wafers_.php?rssid=20229 http://www.semiconductor.net/article/201058-Harmotec_Non_Contact_Pick_up_Tool_Handles_Thin_Wafers_.php?rssid=20229 Wed, 06 Feb 2008 12:35:00 GMT Harmotec Corp. (Tokyo) has developed non-contact wafer pick-up tools for very thin (20 μm) 300... http://www.semiconductor.net/article/200749-Sematech_Announces_Meetings_Lineup_for_2008.php?rssid=20229 http://www.semiconductor.net/article/200749-Sematech_Announces_Meetings_Lineup_for_2008.php?rssid=20229 Thu, 24 Jan 2008 16:34:00 GMT Sematech announced its 2008 meetings on lithography and other semiconductor-related research... http://www.semiconductor.net/article/203341-Entrepix_Hires_Mello_Adds_SEZ_Capabilities.php?rssid=20229 http://www.semiconductor.net/article/203341-Entrepix_Hires_Mello_Adds_SEZ_Capabilities.php?rssid=20229 Thu, 10 Jan 2008 16:14:00 GMT Entrepix Inc. will add surface conditioning services, based on SEZ technology, as a complement... http://www.semiconductor.net/article/208396-Lam_to_Acquire_SEZ_to_Help_Grow_Clean_Business.php?rssid=20229 http://www.semiconductor.net/article/208396-Lam_to_Acquire_SEZ_to_Help_Grow_Clean_Business.php?rssid=20229 Tue, 11 Dec 2007 16:49:00 GMT Lam Research Corp. (Fremont, Calif.) has announced that it has signed a binding transaction... http://www.semiconductor.net/article/197572-AMAT_s_FullVision_Lam_s_Coronus_Debut.php?rssid=20229 http://www.semiconductor.net/article/197572-AMAT_s_FullVision_Lam_s_Coronus_Debut.php?rssid=20229 Thu, 29 Nov 2007 14:16:00 GMT Applied Materials announced an improved end-point control system called FullVision for its CMP... http://www.semiconductor.net/article/205551-IBM_Reduces_Greenhouse_Gas_Emissions.php?rssid=20229 http://www.semiconductor.net/article/205551-IBM_Reduces_Greenhouse_Gas_Emissions.php?rssid=20229 Wed, 07 Nov 2007 20:12:00 GMT SEMI’s International Trade Partners Conference (ITPC) has long been known for its big picture... http://www.semiconductor.net/article/204207-Damage_During_Cleans_Evaluated_by_AFM.php?rssid=20229 http://www.semiconductor.net/article/204207-Damage_During_Cleans_Evaluated_by_AFM.php?rssid=20229 Wed, 07 Nov 2007 15:02:00 GMT Researchers from Northeastern University, Hanyang University and IMEC have recently conducted... http://www.semiconductor.net/article/200060-EU_s_REACH_to_Impact_European_Fab_Costs.php?rssid=20229 http://www.semiconductor.net/article/200060-EU_s_REACH_to_Impact_European_Fab_Costs.php?rssid=20229 Tue, 23 Oct 2007 10:54:00 GMT The European Union's new program to register chemicals, including those used in semiconductor... http://www.semiconductor.net/article/207790-SEZ_Launches_Dual_Use_Da_Vinci_Prime.php?rssid=20229 http://www.semiconductor.net/article/207790-SEZ_Launches_Dual_Use_Da_Vinci_Prime.php?rssid=20229 Fri, 12 Oct 2007 13:31:00 GMT SEZ Group (Villach, Austria) launched an upgraded version of the Da Vinci single-wafer wet... http://www.semiconductor.net/article/203283-BASF_Joins_IMEC_s_Industrial_Affiliation_Program.php?rssid=20229 http://www.semiconductor.net/article/203283-BASF_Joins_IMEC_s_Industrial_Affiliation_Program.php?rssid=20229 Tue, 09 Oct 2007 08:47:00 GMT German chemical company BASF joined IMEC’s Industrial Affiliation Program to develop IC... http://www.semiconductor.net/article/200696-Group_of_10_to_Tackle_Killer_Particles.php?rssid=20229 http://www.semiconductor.net/article/200696-Group_of_10_to_Tackle_Killer_Particles.php?rssid=20229 Wed, 05 Sep 2007 19:00:00 GMT A group of 10 companies and research institutes is forming to tackle nanoparticles, a yield... http://www.semiconductor.net/article/207959-Lean_Manufacturing_Courses_Precede_ISMI_Symposium.php?rssid=20229 http://www.semiconductor.net/article/207959-Lean_Manufacturing_Courses_Precede_ISMI_Symposium.php?rssid=20229 Thu, 23 Aug 2007 15:07:00 GMT Lean manufacturing will be among the courses offered to semiconductor professionals during the... http://www.semiconductor.net/article/206972-Rohm_and_Haas_Receives_Sustainability_Award.php?rssid=20229 http://www.semiconductor.net/article/206972-Rohm_and_Haas_Receives_Sustainability_Award.php?rssid=20229 Thu, 09 Aug 2007 13:28:00 GMT Rohm and Haas Co. received the 2007 Hydro Sustainability Award from The Natural Step, a... http://www.semiconductor.net/article/198178-New_Environmental_Challenges_in_a_Global_Business_Environment.php?rssid=20229 http://www.semiconductor.net/article/198178-New_Environmental_Challenges_in_a_Global_Business_Environment.php?rssid=20229 Thu, 19 Jul 2007 06:00:00 GMT At the SEMI EHS Interest Group Meeting held yesterday, keynoter Mike Kirschner of Design Chain... http://www.semiconductor.net/article/206416-Latest_Memory_Activity_in_Japan.php?rssid=20229 http://www.semiconductor.net/article/206416-Latest_Memory_Activity_in_Japan.php?rssid=20229 Thu, 19 Jul 2007 06:00:00 GMT The Japanese semiconductor market depended on the growth of the memory manufacture —... http://www.semiconductor.net/article/199527-Sustain_the_World_Preserve_the_Industry.php?rssid=20229 http://www.semiconductor.net/article/199527-Sustain_the_World_Preserve_the_Industry.php?rssid=20229 Tue, 17 Jul 2007 12:00:00 GMT With public interest in global warming and ways to combat it at white-hot levels, the industry... http://www.semiconductor.net/article/207462-SEZ_Takes_Aim_at_FEOL_Cleaning_Challenges.php?rssid=20229 http://www.semiconductor.net/article/207462-SEZ_Takes_Aim_at_FEOL_Cleaning_Challenges.php?rssid=20229 Thu, 14 Dec 2006 07:00:00 GMT As the semiconductor industry moves to the 45 and 32 nm device generations, several new... http://www.semiconductor.net/article/204408-Audio_Interview_Experts_Tackle_Surface_Cleaning_Challenges.php?rssid=20229 http://www.semiconductor.net/article/204408-Audio_Interview_Experts_Tackle_Surface_Cleaning_Challenges.php?rssid=20229 Fri, 10 Nov 2006 07:00:00 GMT At the Surface Cleaning Workshop in Boston, Editor-in-Chief Pete Singer talked to Ahmed A.... http://www.semiconductor.net/article/204464-Audio_Interview_With_Glenn_Gale_SEZ.php?rssid=20229 http://www.semiconductor.net/article/204464-Audio_Interview_With_Glenn_Gale_SEZ.php?rssid=20229 Tue, 18 Jul 2006 06:00:00 GMT In a live interview at SEMICON West, Glenn Gale, vice president, FEOL cleaning, at SEZ, spoke... http://www.semiconductor.net/article/204053-Single_Wafer_Cleaning_vs_Batch_Cleaning.php?rssid=20229 http://www.semiconductor.net/article/204053-Single_Wafer_Cleaning_vs_Batch_Cleaning.php?rssid=20229 Wed, 01 Aug 2001 06:00:00 GMT Is single-wafer cleaning the wave of the future? It currently is used in production in plasma PR... http://www.semiconductor.net/article/206569-Future_Needs_of_Cleaning.php?rssid=20229 http://www.semiconductor.net/article/206569-Future_Needs_of_Cleaning.php?rssid=20229 Sun, 01 Jul 2001 06:00:00 GMT Wet chemical cleaning based on H 2 O 2 solutions is still the main general process used.... http://www.semiconductor.net/article/204280-UV_Technology_Breakthrough_for_Rinse_Water_Treatment.php?rssid=20229 http://www.semiconductor.net/article/204280-UV_Technology_Breakthrough_for_Rinse_Water_Treatment.php?rssid=20229 Fri, 01 Jun 2001 06:00:00 GMT Removing total organic carbon (TOC) contamination from wafer rinse water with ultraviolet (UV)... http://www.semiconductor.net/article/206702-Ozone_Based_Cleans_Evaluated.php?rssid=20229 http://www.semiconductor.net/article/206702-Ozone_Based_Cleans_Evaluated.php?rssid=20229 Tue, 01 May 2001 06:00:00 GMT Wafer contaminants are present in the cleanroom ambient from packaging materials, wafer boxes,... http://www.semiconductor.net/article/203569-A_Replacement_for_RCA_Cleans.php?rssid=20229 http://www.semiconductor.net/article/203569-A_Replacement_for_RCA_Cleans.php?rssid=20229 Sun, 01 Apr 2001 07:00:00 GMT Finding a chemical mixture that is easier and whose properties allow extensive use for single... http://www.semiconductor.net/article/204931-Semi_Aqueous_Cleaning_Approaches_the_Forefront.php?rssid=20229 http://www.semiconductor.net/article/204931-Semi_Aqueous_Cleaning_Approaches_the_Forefront.php?rssid=20229 Thu, 01 Mar 2001 07:00:00 GMT Chemical cleaning for post metal etch is continually challenged as devices shrink. For example,... http://www.semiconductor.net/article/203424-Company_News.php?rssid=20229 http://www.semiconductor.net/article/203424-Company_News.php?rssid=20229 Thu, 01 Feb 2001 07:00:00 GMT Air Products and Chemicals Inc. (Lehigh Valley, Pa.) and Quantum Global Technologie LLC (Dublin,... http://www.semiconductor.net/article/207274-Wet_Clean_Achieves_Solution_for_Cu_Interconnects.php?rssid=20229 http://www.semiconductor.net/article/207274-Wet_Clean_Achieves_Solution_for_Cu_Interconnects.php?rssid=20229 Thu, 01 Feb 2001 07:00:00 GMT Challenged by the onslaught of copper interconnect structures, wet cleaning processes are rising... http://www.semiconductor.net/article/203796-New_Single_Wafer_Processes_Offer_Alternative_Backside_Cleans.php?rssid=20229 http://www.semiconductor.net/article/203796-New_Single_Wafer_Processes_Offer_Alternative_Backside_Cleans.php?rssid=20229 Mon, 01 Jan 2001 07:00:00 GMT According to the International Technology Roadmap for Semiconductors , the backside particle... http://www.semiconductor.net/article/204991-Integrated_Dry_Clean_Without_Surface_Roughening.php?rssid=20229 http://www.semiconductor.net/article/204991-Integrated_Dry_Clean_Without_Surface_Roughening.php?rssid=20229 Fri, 01 Dec 2000 07:00:00 GMT The 1999 Roadmap states that gate dielectric thickness will be 1.0 to 1.5 nm, equivalent silicon... http://www.semiconductor.net/article/199633-Controlling_Galvanic_Corrosion_in_Post_Copper_CMP_Cleaning.php?rssid=20229 http://www.semiconductor.net/article/199633-Controlling_Galvanic_Corrosion_in_Post_Copper_CMP_Cleaning.php?rssid=20229 Wed, 01 Nov 2000 07:00:00 GMT Control of corrosion in copper CMP, especially after post-CMP cleaning, is critical for... http://www.semiconductor.net/article/205668-Company_News.php?rssid=20229 http://www.semiconductor.net/article/205668-Company_News.php?rssid=20229 Wed, 01 Nov 2000 07:00:00 GMT Aquafine Corp. (Valencia, Calif.) was named supplier of UV water treatment equipment for... http://www.semiconductor.net/article/207217-Quick_Drying_Enables_Single_Wafer_Cleans.php?rssid=20229 http://www.semiconductor.net/article/207217-Quick_Drying_Enables_Single_Wafer_Cleans.php?rssid=20229 Sun, 01 Oct 2000 06:00:00 GMT One of the major obstacles for single-wafer wet cleaning has been the lack of a fast, water... http://www.semiconductor.net/article/208994-Ozone_Water_Process_Removes_Back_End_Post_Etch_Resist_Residue.php?rssid=20229 http://www.semiconductor.net/article/208994-Ozone_Water_Process_Removes_Back_End_Post_Etch_Resist_Residue.php?rssid=20229 Fri, 01 Sep 2000 06:00:00 GMT Oxygen plasma ashing and post-ash solvent-cleaning are used widely in the industry for back-end... http://www.semiconductor.net/article/196552-Electrohydrodynamics_Cleans_Probe_Cards.php?rssid=20229 http://www.semiconductor.net/article/196552-Electrohydrodynamics_Cleans_Probe_Cards.php?rssid=20229 Tue, 01 Aug 2000 06:00:00 GMT A non-destructive, non-chemical, non-contact method for cleaning probe tips has been developed... http://www.semiconductor.net/article/200175-Dilute_Chemistries_Promise_and_Caution.php?rssid=20229 http://www.semiconductor.net/article/200175-Dilute_Chemistries_Promise_and_Caution.php?rssid=20229 Sat, 01 Jul 2000 06:00:00 GMT Dilute chemistries offer many advantages, not the least of which is environmental. However, work... http://www.semiconductor.net/article/198074-Cleaning_Technology_Event_Looks_at_Copper_Dielectrics.php?rssid=20229 http://www.semiconductor.net/article/198074-Cleaning_Technology_Event_Looks_at_Copper_Dielectrics.php?rssid=20229 Thu, 01 Jun 2000 06:00:00 GMT SCP Global Technologies (Boise, Idaho) presented its 7th International Symposium&Technical... http://www.semiconductor.net/article/208873-A_New_Philosophy_in_Contamination_Control.php?rssid=20229 http://www.semiconductor.net/article/208873-A_New_Philosophy_in_Contamination_Control.php?rssid=20229 Mon, 01 May 2000 06:00:00 GMT In a recent interview with SI , Larry Mainers , vice president at Pentagon Technologies... http://www.semiconductor.net/article/198038-Company_News.php?rssid=20229 http://www.semiconductor.net/article/198038-Company_News.php?rssid=20229 Sat, 01 Apr 2000 07:00:00 GMT GaSonics International Corp. (San Jose, Calif.) and Novellus Systems Inc. (San Jose, Calif.)... http://www.semiconductor.net/article/201849-Scrubbing_Takes_a_New_Role.php?rssid=20229 http://www.semiconductor.net/article/201849-Scrubbing_Takes_a_New_Role.php?rssid=20229 Sat, 01 Apr 2000 07:00:00 GMT Wet scrubbing technology is used predominantly in air pollution control -- primarily as wet or... http://www.semiconductor.net/article/206092-Controlling_Sodium_Contamination_in_Cleanrooms.php?rssid=20229 http://www.semiconductor.net/article/206092-Controlling_Sodium_Contamination_in_Cleanrooms.php?rssid=20229 Wed, 01 Mar 2000 07:00:00 GMT Sodium is the sixth most abundant element on the earth, comprising 2.6% of the planet's crust.... http://www.semiconductor.net/article/203399-Evaluating_Cu_Low_k_Cleaning_Chemicals.php?rssid=20229 http://www.semiconductor.net/article/203399-Evaluating_Cu_Low_k_Cleaning_Chemicals.php?rssid=20229 Tue, 01 Feb 2000 07:00:00 GMT With the emergence of copper and low-k material usage, cleaning criteria are changing. So, in... http://www.semiconductor.net/article/199888-No_More_PFC_Emissions_in_Plasma_Chamber_Cleaning_.php?rssid=20229 http://www.semiconductor.net/article/199888-No_More_PFC_Emissions_in_Plasma_Chamber_Cleaning_.php?rssid=20229 Sat, 01 Jan 2000 07:00:00 GMT The World Semiconductor Council has agreed to a 10% reduction in global-warming PFC emissions by...