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		<title>Semiconductor International – Breaking News</title>
		<link>http://www.semiconductor.net</link>
		<pubDate>Tue, 10 Nov 2009 12:39:34 MST</pubDate>
		<description />
		<language>eng</language>
		<copyright>Copyright 2009 Reed Business Information. Subject to its Terms of Use (http://www.semiconductor.net/info/terms-and-conditions.php)</copyright>
		


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			<title>Richard Chang Fired as SMIC CEO; David N.K. Wang Takes Helm</title>
			<link>http://www.semiconductor.net/article/388218-Richard_Chang_Fired_as_SMIC_CEO_David_N_K_Wang_Takes_Helm.php?rssid=20224</link>
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			<pubDate>Tue, 10 Nov 2009 01:43:54 GMT</pubDate>
			<description>Richard Chang, the founder of Shanghai-based foundry SMIC, was forced out as CEO following a...</description>
		</item>
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			<title>TSMC vs. SMIC Ends With $200M Settlement</title>
			<link>http://www.semiconductor.net/article/388202-TSMC_vs_SMIC_Ends_With_200M_Settlement.php?rssid=20224</link>
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			<pubDate>Mon, 09 Nov 2009 23:32:26 GMT</pubDate>
			<description>The trade secrets trial between foundries TSMC and SMIC ended Monday, with SMIC agreeing to pay...</description>
		</item>
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			<title>SIA Industry Forecast Optimistic, But With Reservations</title>
			<link>http://www.semiconductor.net/article/383353-SIA_Industry_Forecast_Optimistic_But_With_Reservations.php?rssid=20224</link>
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			<pubDate>Sat, 07 Nov 2009 01:13:35 GMT</pubDate>
			<description>The SIA's newest forecast predicts 2009 sales to reach $220B, down by 11.5% from 2008, but sees...</description>
		</item>
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			<title>Nikko Metals Offers Hybrid 450 mm Wafers</title>
			<link>http://www.semiconductor.net/article/383103-Nikko_Metals_Offers_Hybrid_450_mm_Wafers.php?rssid=20224</link>
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			<pubDate>Fri, 06 Nov 2009 14:08:05 GMT</pubDate>
			<description>Nikko Metals, a subsidiary of Nippon Mining and Metals, is readying hybrid 450 mm wafers that...</description>
		</item>
										<item>
			<title>Quantum Dot Mapping Points to Unthought of Applications</title>
			<link>http://www.semiconductor.net/article/382914-Quantum_Dot_Mapping_Points_to_Unthought_of_Applications.php?rssid=20224</link>
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			<pubDate>Thu, 05 Nov 2009 14:24:01 GMT</pubDate>
			<description>University of Michigan physicists have mapped quantum dots, crystals with wide-ranging...</description>
		</item>
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			<title>Jury Finds in TSMC's Favor in TSMC vs. SMIC Trade Secrets Trial</title>
			<link>http://www.semiconductor.net/article/367528-Jury_Finds_in_TSMC_s_Favor_in_TSMC_vs_SMIC_Trade_Secrets_Trial.php?rssid=20224</link>
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			<pubDate>Tue, 03 Nov 2009 20:53:28 GMT</pubDate>
			<description>TSMC has won a nearly complete victory in the trade secrets trial ongoing in Oakland, Calif....</description>
		</item>
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			<title>Sematech 3-D Program Provides Lessons</title>
			<link>http://www.semiconductor.net/article/367207-Sematech_3_D_Program_Provides_Lessons.php?rssid=20224</link>
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			<pubDate>Mon, 02 Nov 2009 18:34:14 GMT</pubDate>
			<description>Sematech's 3-D interconnect program has provided the equipment and materials industry with a...</description>
		</item>
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			<title>TI Switches Exhaust to Save Energy Costs</title>
			<link>http://www.semiconductor.net/article/366905-TI_Switches_Exhaust_to_Save_Energy_Costs.php?rssid=20224</link>
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			<pubDate>Fri, 30 Oct 2009 13:44:51 GMT</pubDate>
			<description>Texas Instruments Inc. is saving on the energy required to exhaust air from its dedicated...</description>
		</item>
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			<title>New Multiferroic Materials Promise Exotic Devices, Faster Computing</title>
			<link>http://www.semiconductor.net/article/366817-New_Multiferroic_Materials_Promise_Exotic_Devices_Faster_Computing.php?rssid=20224</link>
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			<pubDate>Thu, 29 Oct 2009 17:28:07 GMT</pubDate>
			<description>A multidisciplinary collaboration has led to the creation of a new multiferroic material with...</description>
		</item>
										<item>
			<title>Microsemi to Close Arizona Manufacturing Facilitiy</title>
			<link>http://www.semiconductor.net/article/366680-Microsemi_to_Close_Arizona_Manufacturing_Facilitiy.php?rssid=20224</link>
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			<pubDate>Wed, 28 Oct 2009 16:44:59 GMT</pubDate>
			<description>Microsemi Corp. announced consolidation plans that will result in the closure of its Scottsdale,...</description>
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			<title>ISMI 450 mm Program Moving to Next Stage</title>
			<link>http://www.semiconductor.net/article/366142-ISMI_450_mm_Program_Moving_to_Next_Stage.php?rssid=20224</link>
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			<pubDate>Fri, 23 Oct 2009 13:29:41 GMT</pubDate>
			<description>The ISMI 450 mm wafer program is moving to a new stage, going beyond wafer handling to blanket...</description>
		</item>
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			<title>Semico Research Sees Strong 2010 for Chip Industry</title>
			<link>http://www.semiconductor.net/article/366004-Semico_Research_Sees_Strong_2010_for_Chip_Industry.php?rssid=20224</link>
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			<pubDate>Thu, 22 Oct 2009 14:53:00 GMT</pubDate>
			<description>Semico Research is predicting 20% IC revenue growth next year, followed by two years of stable...</description>
		</item>
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			<title>U.S. Tax Code Penalizes Manufacturing</title>
			<link>http://www.semiconductor.net/article/365974-U_S_Tax_Code_Penalizes_Manufacturing.php?rssid=20224</link>
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			<pubDate>Thu, 22 Oct 2009 12:19:49 GMT</pubDate>
			<description>Angelos Angelou, head of an economic consulting firm, told participants at the ISMI Symposium...</description>
		</item>
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			<title>Industry Wary of Greenhouse Gas Rules</title>
			<link>http://www.semiconductor.net/article/365835-Industry_Wary_of_Greenhouse_Gas_Rules.php?rssid=20224</link>
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			<pubDate>Wed, 21 Oct 2009 12:13:45 GMT</pubDate>
			<description>Controls on PFCs and other greenhouse gases by the Obama administration could impact how the...</description>
		</item>
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			<title>ISMI Readies Fab Risk Assessment Tool</title>
			<link>http://www.semiconductor.net/article/365720-ISMI_Readies_Fab_Risk_Assessment_Tool.php?rssid=20224</link>
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			<pubDate>Tue, 20 Oct 2009 14:24:08 GMT</pubDate>
			<description>A risk assessment tool will soon be available for fab safety from Sematech subsidiary ISMI. The...</description>
		</item>
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			<title>CNT Research Points to Higher PV Efficiency, Advanced Electronics</title>
			<link>http://www.semiconductor.net/article/365488-CNT_Research_Points_to_Higher_PV_Efficiency_Advanced_Electronics.php?rssid=20224</link>
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			<pubDate>Mon, 19 Oct 2009 13:32:49 GMT</pubDate>
			<description>Research results promise direct control over carbon nanotube (CNT) structures during growth....</description>
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			<title>Most Viewed Stories for Week of Oct. 12, 2009</title>
			<link>http://www.semiconductor.net/article/358342-Most_Viewed_Stories_for_Week_of_Oct_12_2009.php?rssid=20224</link>
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			<pubDate>Fri, 16 Oct 2009 12:03:34 GMT</pubDate>
			<description>The industry seems to have forward momentum again, judging by this week's Top 5. Foundries are...</description>
		</item>
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			<title>IEDM Confronts Logic Scaling Challenges</title>
			<link>http://www.semiconductor.net/article/358223-IEDM_Confronts_Logic_Scaling_Challenges.php?rssid=20224</link>
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			<pubDate>Thu, 15 Oct 2009 15:25:48 GMT</pubDate>
			<description>The International Electron Devices Meeting (IEDM), set for Dec. 6-9 in Baltimore, includes...</description>
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			<title>High-Power Transistors Emerge at CEATEC</title>
			<link>http://www.semiconductor.net/article/358034-High_Power_Transistors_Emerge_at_CEATEC.php?rssid=20224</link>
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			<pubDate>Wed, 14 Oct 2009 14:56:35 GMT</pubDate>
			<description>Sanken, Fujitsu Laboratories, and other Japanese companies introduced high-power transistors,...</description>
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			<title>Foundry Revenues Rise Amid Intensifying Competition</title>
			<link>http://www.semiconductor.net/article/357871-Foundry_Revenues_Rise_Amid_Intensifying_Competition.php?rssid=20224</link>
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			<pubDate>Tue, 13 Oct 2009 15:08:50 GMT</pubDate>
			<description>IC Insights and iSuppli separately forecast increasing foundry revenues, but much tougher...</description>
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			<title>SOI Reduces Dynamic Power, Wafer Costs Coming Down</title>
			<link>http://www.semiconductor.net/article/357702-SOI_Reduces_Dynamic_Power_Wafer_Costs_Coming_Down.php?rssid=20224</link>
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			<pubDate>Mon, 12 Oct 2009 15:48:42 GMT</pubDate>
			<description>Silicon-on-insulator (SOI) technology is seeking to penetrate the high-volume market for mobile...</description>
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			<title>Most Viewed Stories for Week of Oct. 5, 2009</title>
			<link>http://www.semiconductor.net/article/357460-Most_Viewed_Stories_for_Week_of_Oct_5_2009.php?rssid=20224</link>
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			<pubDate>Fri, 09 Oct 2009 14:24:06 GMT</pubDate>
			<description>Materials changes are always interesting, and a contributed technical article from IDT on the...</description>
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			<title>TSMC vs. SMIC Trade Secrets Trial Heats Up</title>
			<link>http://www.semiconductor.net/article/357279-TSMC_vs_SMIC_Trade_Secrets_Trial_Heats_Up.php?rssid=20224</link>
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			<pubDate>Thu, 08 Oct 2009 16:17:57 GMT</pubDate>
			<description>The TSMC vs. SMIC trade secrets trial going on now in an Oakland, Calif., courtroom featured...</description>
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			<title>Leti Claims Silicon Nanowire Integration Breakthrough</title>
			<link>http://www.semiconductor.net/article/357080-Leti_Claims_Silicon_Nanowire_Integration_Breakthrough.php?rssid=20224</link>
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			<pubDate>Wed, 07 Oct 2009 15:38:06 GMT</pubDate>
			<description>Leti researchers have claimed progress in integrating silicon nanowires with CMOS, at...</description>
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			<title>Co-Design Tools Moving Closer to Goal</title>
			<link>http://www.semiconductor.net/article/356945-Co_Design_Tools_Moving_Closer_to_Goal.php?rssid=20224</link>
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			<pubDate>Tue, 06 Oct 2009 18:08:10 GMT</pubDate>
			<description>As chip/package co-design becomes increasingly complex, design tools must keep pace to ensure...</description>
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			<title>Qualcomm's Nowak: 3-D Faces Cost Issues</title>
			<link>http://www.semiconductor.net/article/356905-Qualcomm_s_Nowak_3_D_Faces_Cost_Issues.php?rssid=20224</link>
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			<pubDate>Tue, 06 Oct 2009 14:10:48 GMT</pubDate>
			<description>Qualcomm Director of Advanced Technology Matt Nowak outlined the cost and technology challenges...</description>
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			<title>Remanufactured Spindles Reduce Repair Costs</title>
			<link>http://www.semiconductor.net/article/356527-Remanufactured_Spindles_Reduce_Repair_Costs.php?rssid=20224</link>
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			<pubDate>Fri, 02 Oct 2009 14:31:37 GMT</pubDate>
			<description>Fala Technologies Inc. and Sparetech Inc. are offering a high-performance remanufactured spindle...</description>
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			<title>Most Viewed Stories for Week of Sept. 28</title>
			<link>http://www.semiconductor.net/article/356515-Most_Viewed_Stories_for_Week_of_Sept_28.php?rssid=20224</link>
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			<pubDate>Fri, 02 Oct 2009 13:53:31 GMT</pubDate>
			<description>Readers paid close attention to Texas Instruments' decision to move used equipment to its shell...</description>
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			<title>Testing Image Sensors: Lab to Fab</title>
			<link>http://www.semiconductor.net/article/356038-Testing_Image_Sensors_Lab_to_Fab.php?rssid=20224</link>
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			<pubDate>Wed, 30 Sep 2009 16:49:50 GMT</pubDate>
			<description>The trend to smaller, cheaper and more flexible test equipment is hitting the image sensor...</description>
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			<title>TI's Ritchie Sees Expanded Fab Strategy</title>
			<link>http://www.semiconductor.net/article/356016-TI_s_Ritchie_Sees_Expanded_Fab_Strategy.php?rssid=20224</link>
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			<pubDate>Thu, 01 Oct 2009 10:17:00 GMT</pubDate>
			<description>Texas Instruments will use its Richardson fab to expand production of high-volume battery...</description>
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			<title>TI Commits to RFAB for Analog Production</title>
			<link>http://www.semiconductor.net/article/355736-TI_Commits_to_RFAB_for_Analog_Production.php?rssid=20224</link>
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			<pubDate>Tue, 29 Sep 2009 16:10:01 GMT</pubDate>
			<description>Texas Instruments said it will open RFAB, the industry's first 300 mm analog wafer fab, by the...</description>
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			<title>Chiang Returns to Head R&amp;D at TSMC</title>
			<link>http://www.semiconductor.net/article/355711-Chiang_Returns_to_Head_R_D_at_TSMC.php?rssid=20224</link>
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			<pubDate>Tue, 29 Sep 2009 14:09:16 GMT</pubDate>
			<description>Shang-Yi Chiang was named senior vice president of R&amp;D at TSMC, a job he held until several...</description>
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			<title>TSMC vs. SMIC Focuses on 130 nm Process</title>
			<link>http://www.semiconductor.net/article/355700-TSMC_vs_SMIC_Focuses_on_130_nm_Process.php?rssid=20224</link>
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			<pubDate>Tue, 29 Sep 2009 13:23:23 GMT</pubDate>
			<description>Attorneys in the ongoing TSMC vs. SMIC trial questioned witnesses about documents relating to...</description>
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			<title>Most Viewed Stories for the Week of Sept. 21, 2009</title>
			<link>http://www.semiconductor.net/article/355406-Most_Viewed_Stories_for_the_Week_of_Sept_21_2009.php?rssid=20224</link>
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			<pubDate>Fri, 25 Sep 2009 16:12:57 GMT</pubDate>
			<description>The battle between foundries TSMC and SMIC led our latest Top 5 again, with new trial coverage...</description>
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			<title>SiC Devices Are a Long Time Coming</title>
			<link>http://www.semiconductor.net/article/355220-SiC_Devices_Are_a_Long_Time_Coming.php?rssid=20224</link>
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			<pubDate>Thu, 24 Sep 2009 15:48:04 GMT</pubDate>
			<description>According to a report released today from Yole Développement, the power electronics industry is...</description>
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			<title>TSMC vs. SMIC Trade Secrets Theft Trial Grinds On</title>
			<link>http://www.semiconductor.net/article/354866-TSMC_vs_SMIC_Trade_Secrets_Theft_Trial_Grinds_On.php?rssid=20224</link>
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			<pubDate>Tue, 22 Sep 2009 12:41:43 GMT</pubDate>
			<description>Proceedings continued Monday in the civil trial pitting TSMC against SMIC over allegations that...</description>
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			<title>Bagel-Trah Is New Chair of Henkel</title>
			<link>http://www.semiconductor.net/article/354834-Bagel_Trah_Is_New_Chair_of_Henkel.php?rssid=20224</link>
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			<pubDate>Mon, 21 Sep 2009 20:41:08 GMT</pubDate>
			<description>Simone Bagel-Trah has been elected chairwoman of Henkel, a manufacturer of wafer-level and...</description>
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			<title>IBM Readies 32 nm eDRAM With Low Latency</title>
			<link>http://www.semiconductor.net/article/354546-IBM_Readies_32_nm_eDRAM_With_Low_Latency.php?rssid=20224</link>
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			<pubDate>Fri, 18 Sep 2009 20:57:03 GMT</pubDate>
			<description>IBM unveiled a 32 nm SOI embedded DRAM, and will provide details at the upcoming IEDM in...</description>
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			<title>Most Viewed Stories for Week of Sept. 14, 2009</title>
			<link>http://www.semiconductor.net/article/354480-Most_Viewed_Stories_for_Week_of_Sept_14_2009.php?rssid=20224</link>
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			<pubDate>Fri, 18 Sep 2009 12:10:47 GMT</pubDate>
			<description>Intel's pre-Intel Developer Forum update on its 32 nm Windmere MPU ramp (and doubts that EUV...</description>
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			<title>Massive Mask Data Calls for New Methods</title>
			<link>http://www.semiconductor.net/article/354403-Massive_Mask_Data_Calls_for_New_Methods.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/354403-Massive_Mask_Data_Calls_for_New_Methods.php?rssid=20224</guid>
			<pubDate>Thu, 17 Sep 2009 14:06:35 GMT</pubDate>
			<description>Dealing with the ballooning volumes of mask data was on the agenda at the SPIE Photomask...</description>
		</item>
										<item>
			<title>Zeiss Delivers EUV Optics to ASML</title>
			<link>http://www.semiconductor.net/article/354185-Zeiss_Delivers_EUV_Optics_to_ASML.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/354185-Zeiss_Delivers_EUV_Optics_to_ASML.php?rssid=20224</guid>
			<pubDate>Wed, 16 Sep 2009 16:11:02 GMT</pubDate>
			<description>Carl Zeiss has delivered a complete EUV optical subsystem for the production-ready EUV scanners...</description>
		</item>
										<item>
			<title>Polcari Touts EUV at SPIE Photomask</title>
			<link>http://www.semiconductor.net/article/354158-Polcari_Touts_EUV_at_SPIE_Photomask.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/354158-Polcari_Touts_EUV_at_SPIE_Photomask.php?rssid=20224</guid>
			<pubDate>Wed, 16 Sep 2009 14:27:13 GMT</pubDate>
			<description>Michael Polcari, president and CEO of Sematech, detailed the major challenges facing EUV...</description>
		</item>
										<item>
			<title>Mora Grilled in TSMC vs. SMIC Deposition</title>
			<link>http://www.semiconductor.net/article/353884-Mora_Grilled_in_TSMC_vs_SMIC_Deposition.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/353884-Mora_Grilled_in_TSMC_vs_SMIC_Deposition.php?rssid=20224</guid>
			<pubDate>Tue, 15 Sep 2009 15:33:47 GMT</pubDate>
			<description>Marco Mora, now the COO at SMIC, was deposed in video testimony taken in Shanghai, China, about...</description>
		</item>
										<item>
			<title>KLA-Tencor Introduces Teron 600 Mask Inspection System</title>
			<link>http://www.semiconductor.net/article/353856-KLA_Tencor_Introduces_Teron_600_Mask_Inspection_System.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/353856-KLA_Tencor_Introduces_Teron_600_Mask_Inspection_System.php?rssid=20224</guid>
			<pubDate>Tue, 15 Sep 2009 13:05:09 GMT</pubDate>
			<description>Coinciding with the SPIE Photomask conference, KLA-Tencor introduced a mask defect inspection...</description>
		</item>
										<item>
			<title>Intel Ramping 32 nm Manufacturing in Oregon</title>
			<link>http://www.semiconductor.net/article/353759-Intel_Ramping_32_nm_Manufacturing_in_Oregon.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/353759-Intel_Ramping_32_nm_Manufacturing_in_Oregon.php?rssid=20224</guid>
			<pubDate>Mon, 14 Sep 2009 13:06:20 GMT</pubDate>
			<description>Intel is shipping "large numbers" of 32 nm samples of its Westmere processor to PC vendors for...</description>
		</item>
										<item>
			<title>Gartner Sees Equipment Rebound in 2010</title>
			<link>http://www.semiconductor.net/article/353756-Gartner_Sees_Equipment_Rebound_in_2010.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/353756-Gartner_Sees_Equipment_Rebound_in_2010.php?rssid=20224</guid>
			<pubDate>Mon, 14 Sep 2009 12:53:40 GMT</pubDate>
			<description>Gartner Inc. has predicted a 34.3% increase in worldwide semiconductor capital equipment...</description>
		</item>
										<item>
			<title>Judge in TSMC vs. SMIC Rules That SMIC Destroyed Documents</title>
			<link>http://www.semiconductor.net/article/346249-Judge_in_TSMC_vs_SMIC_Rules_That_SMIC_Destroyed_Documents.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/346249-Judge_in_TSMC_vs_SMIC_Rules_That_SMIC_Destroyed_Documents.php?rssid=20224</guid>
			<pubDate>Fri, 11 Sep 2009 21:40:08 GMT</pubDate>
			<description>Judge Steven Brick, presiding over the TSMC vs. SMIC intellectual property lawsuit now ongoing...</description>
		</item>
										<item>
			<title>TSMC Hears Charges of IP Leaks, FUD Campaign in Trial With SMIC</title>
			<link>http://www.semiconductor.net/article/346139-TSMC_Hears_Charges_of_IP_Leaks_FUD_Campaign_in_Trial_With_SMIC.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/346139-TSMC_Hears_Charges_of_IP_Leaks_FUD_Campaign_in_Trial_With_SMIC.php?rssid=20224</guid>
			<pubDate>Fri, 11 Sep 2009 14:47:40 GMT</pubDate>
			<description>In the first full day of testimony in the TSMC vs. SMIC intellectual property trial, TSMC was...</description>
		</item>
										<item>
			<title>TSMC vs. SMIC Trial Commences in Oakland</title>
			<link>http://www.semiconductor.net/article/340209-TSMC_vs_SMIC_Trial_Commences_in_Oakland.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/340209-TSMC_vs_SMIC_Trial_Commences_in_Oakland.php?rssid=20224</guid>
			<pubDate>Thu, 10 Sep 2009 15:40:45 GMT</pubDate>
			<description>The intellectual property trial between TSMC and SMIC began Wednesday with opening remarks by...</description>
		</item>
										<item>
			<title>Analysts See Brightening Fab Picture</title>
			<link>http://www.semiconductor.net/article/339974-Analysts_See_Brightening_Fab_Picture.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339974-Analysts_See_Brightening_Fab_Picture.php?rssid=20224</guid>
			<pubDate>Wed, 09 Sep 2009 14:37:56 GMT</pubDate>
			<description>Fab utilization is returning to levels seen before last year's financial collapse, IC Insights...</description>
		</item>
										<item>
			<title>Trial This Week to Consider TSMC Claims Against SMIC</title>
			<link>http://www.semiconductor.net/article/339714-Trial_This_Week_to_Consider_TSMC_Claims_Against_SMIC.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339714-Trial_This_Week_to_Consider_TSMC_Claims_Against_SMIC.php?rssid=20224</guid>
			<pubDate>Tue, 08 Sep 2009 13:54:40 GMT</pubDate>
			<description>A claim by TSMC that rival foundry SMIC used its trade secrets is set to go to trial Wednesday...</description>
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										<item>
			<title>ATIC to Acquire Chartered Semiconductor, Combine It With GlobalFoundries</title>
			<link>http://www.semiconductor.net/article/339669-ATIC_to_Acquire_Chartered_Semiconductor_Combine_It_With_GlobalFoundries.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339669-ATIC_to_Acquire_Chartered_Semiconductor_Combine_It_With_GlobalFoundries.php?rssid=20224</guid>
			<pubDate>Mon, 07 Sep 2009 03:11:46 GMT</pubDate>
			<description>The Advanced Technology Investment Co. LLC (ATIC, Abu Dhabi) said it will pay ~$3.9B to acquire...</description>
		</item>
										<item>
			<title>Elpida Develops 3-D Stacked 8 Gb DRAM</title>
			<link>http://www.semiconductor.net/article/339622-Elpida_Develops_3_D_Stacked_8_Gb_DRAM.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339622-Elpida_Develops_3_D_Stacked_8_Gb_DRAM.php?rssid=20224</guid>
			<pubDate>Fri, 04 Sep 2009 20:01:55 GMT</pubDate>
			<description>Elpida Memory said it employed copper through-silicon vias in an 8 Gb DRAM that includes eight 1...</description>
		</item>
										<item>
			<title>Most Viewed Stories for Week of Aug. 31, 2009</title>
			<link>http://www.semiconductor.net/article/339588-Most_Viewed_Stories_for_Week_of_Aug_31_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339588-Most_Viewed_Stories_for_Week_of_Aug_31_2009.php?rssid=20224</guid>
			<pubDate>Fri, 04 Sep 2009 12:23:56 GMT</pubDate>
			<description>Readers quickly paid notice to a story about a Hitachi process that combines MEMS pressure...</description>
		</item>
										<item>
			<title>Hitachi Creates MEMS Sensor Process</title>
			<link>http://www.semiconductor.net/article/339396-Hitachi_Creates_MEMS_Sensor_Process.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339396-Hitachi_Creates_MEMS_Sensor_Process.php?rssid=20224</guid>
			<pubDate>Thu, 03 Sep 2009 13:12:08 GMT</pubDate>
			<description>Hitachi researchers have developed a method to form cavities in the interconnect layers of CMOS...</description>
		</item>
										<item>
			<title>Molecular Imprints Takes Template Replication to HDD Production</title>
			<link>http://www.semiconductor.net/article/339296-Molecular_Imprints_Takes_Template_Replication_to_HDD_Production.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339296-Molecular_Imprints_Takes_Template_Replication_to_HDD_Production.php?rssid=20224</guid>
			<pubDate>Wed, 02 Sep 2009 19:46:29 GMT</pubDate>
			<description>Molecular Imprints Inc. today introduced the Perfecta TR1100 template replication system to the...</description>
		</item>
										<item>
			<title>Polcari to Call for EUV Infrastructure</title>
			<link>http://www.semiconductor.net/article/339112-Polcari_to_Call_for_EUV_Infrastructure.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339112-Polcari_to_Call_for_EUV_Infrastructure.php?rssid=20224</guid>
			<pubDate>Tue, 01 Sep 2009 15:47:44 GMT</pubDate>
			<description>At the SPIE/BACUS Photomask Symposium, Sematech CEO Mike Polcari will give a keynote speech on...</description>
		</item>
										<item>
			<title>TeraGrid Receives $30M NSF Grant</title>
			<link>http://www.semiconductor.net/article/339088-TeraGrid_Receives_30M_NSF_Grant.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339088-TeraGrid_Receives_30M_NSF_Grant.php?rssid=20224</guid>
			<pubDate>Tue, 01 Sep 2009 14:31:25 GMT</pubDate>
			<description>The TeraGrid is receiving an additional $30M National Science Foundation grant that will support...</description>
		</item>
										<item>
			<title>Bader Named CEO of iNEMI Consortium</title>
			<link>http://www.semiconductor.net/article/339074-Bader_Named_CEO_of_iNEMI_Consortium.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/339074-Bader_Named_CEO_of_iNEMI_Consortium.php?rssid=20224</guid>
			<pubDate>Tue, 01 Sep 2009 13:19:32 GMT</pubDate>
			<description>Bill Bader, a longtime Intel manufacturing executive, was named CEO of the International...</description>
		</item>
										<item>
			<title>Solar's Changing Climate: Photovoltaics and the Legislative Effect</title>
			<link>http://www.semiconductor.net/article/338913-Solar_s_Changing_Climate_Photovoltaics_and_the_Legislative_Effect.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/338913-Solar_s_Changing_Climate_Photovoltaics_and_the_Legislative_Effect.php?rssid=20224</guid>
			<pubDate>Mon, 31 Aug 2009 16:43:08 GMT</pubDate>
			<description>In this webcast, aired originally on Thursday, Aug. 27, our global panel of experts — Winfried...</description>
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										<item>
			<title>Macronix Plans to Build 300 mm Fabs in Central Taiwan</title>
			<link>http://www.semiconductor.net/article/338889-Macronix_Plans_to_Build_300_mm_Fabs_in_Central_Taiwan.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/338889-Macronix_Plans_to_Build_300_mm_Fabs_in_Central_Taiwan.php?rssid=20224</guid>
			<pubDate>Mon, 31 Aug 2009 14:45:19 GMT</pubDate>
			<description>NOR flash maker Macronix International plans to build two 300 mm fabs at central Taiwan's...</description>
		</item>
										<item>
			<title>Most Viewed Stories for Week of Aug. 24, 2009</title>
			<link>http://www.semiconductor.net/article/338740-Most_Viewed_Stories_for_Week_of_Aug_24_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/338740-Most_Viewed_Stories_for_Week_of_Aug_24_2009.php?rssid=20224</guid>
			<pubDate>Fri, 28 Aug 2009 15:42:36 GMT</pubDate>
			<description>News about who might buy used equipment from failed Qimonda fabs has been a hot topic of...</description>
		</item>
										<item>
			<title>Meeting of the Powerful</title>
			<link>http://www.semiconductor.net/article/329182-Meeting_of_the_Powerful.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/329182-Meeting_of_the_Powerful.php?rssid=20224</guid>
			<pubDate>Thu, 27 Aug 2009 19:48:47 GMT</pubDate>
			<description>Applied Materials Chairman and CEO Mike Splinter met yesterday with Nancy Pelosi, Congresswoman...</description>
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										<item>
			<title>IC Insights: Conditions Favor Flash Density</title>
			<link>http://www.semiconductor.net/article/329174-IC_Insights_Conditions_Favor_Flash_Density.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/329174-IC_Insights_Conditions_Favor_Flash_Density.php?rssid=20224</guid>
			<pubDate>Thu, 27 Aug 2009 19:00:25 GMT</pubDate>
			<description>The flash memory market is setting up for a dramatic shift in the supply-demand balance -- one...</description>
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										<item>
			<title>MEMS Cost Model Released</title>
			<link>http://www.semiconductor.net/article/329150-MEMS_Cost_Model_Released.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/329150-MEMS_Cost_Model_Released.php?rssid=20224</guid>
			<pubDate>Thu, 27 Aug 2009 16:57:36 GMT</pubDate>
			<description>The latest release of IC Knowledge's MEMS costing model supports up to two MEMS die and up to...</description>
		</item>
										<item>
			<title>Used 300 mm Tools Are Hot</title>
			<link>http://www.semiconductor.net/article/328981-Used_300_mm_Tools_Are_Hot.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/328981-Used_300_mm_Tools_Are_Hot.php?rssid=20224</guid>
			<pubDate>Wed, 26 Aug 2009 17:10:11 GMT</pubDate>
			<description>The potential sale of Qimonda's 300 mm assets in Virginia to Texas Instruments (TI) confirms the...</description>
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										<item>
			<title>Obducat Receives Russian Nanoimprint Order</title>
			<link>http://www.semiconductor.net/article/328884-Obducat_Receives_Russian_Nanoimprint_Order.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/328884-Obducat_Receives_Russian_Nanoimprint_Order.php?rssid=20224</guid>
			<pubDate>Tue, 25 Aug 2009 18:10:40 GMT</pubDate>
			<description>Obducat has won its first order from Russia -- from the Russian Academy of Sciences for a NIL...</description>
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										<item>
			<title>Second-Round Funding to Help Commercialize CNT IC Interconnects</title>
			<link>http://www.semiconductor.net/article/328353-Second_Round_Funding_to_Help_Commercialize_CNT_IC_Interconnects.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/328353-Second_Round_Funding_to_Help_Commercialize_CNT_IC_Interconnects.php?rssid=20224</guid>
			<pubDate>Mon, 24 Aug 2009 16:10:53 GMT</pubDate>
			<description>Surrey NanoSystems has secured second-round funding of £2.5 million ($4.2M) that will help the...</description>
		</item>
										<item>
			<title>TI Places $172.5M Bid for Qimonda Tools</title>
			<link>http://www.semiconductor.net/article/328282-TI_Places_172_5M_Bid_for_Qimonda_Tools.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/328282-TI_Places_172_5M_Bid_for_Qimonda_Tools.php?rssid=20224</guid>
			<pubDate>Fri, 21 Aug 2009 21:52:44 GMT</pubDate>
			<description>Texas Instruments has placed a bid of $172.5M on used 300 mm equipment from the now-shuttered...</description>
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										<item>
			<title>Most Viewed Stories for Week of Aug. 17, 2009</title>
			<link>http://www.semiconductor.net/article/328164-Most_Viewed_Stories_for_Week_of_Aug_17_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/328164-Most_Viewed_Stories_for_Week_of_Aug_17_2009.php?rssid=20224</guid>
			<pubDate>Fri, 21 Aug 2009 12:43:07 GMT</pubDate>
			<description>Samsung's Aug. 14 decision to upgrade its Austin fab with a copper BEOL got readers' attention....</description>
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										<item>
			<title>World Economy, Semis Seeing Return to Normalcy</title>
			<link>http://www.semiconductor.net/article/328133-World_Economy_Semis_Seeing_Return_to_Normalcy.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/328133-World_Economy_Semis_Seeing_Return_to_Normalcy.php?rssid=20224</guid>
			<pubDate>Thu, 20 Aug 2009 18:52:07 GMT</pubDate>
			<description>At the SEMI Silicon Valley Lunch Forum yesterday, speakers said the world economy is expected to...</description>
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										<item>
			<title>Illumitex Launches Into HB-LED Market</title>
			<link>http://www.semiconductor.net/article/328092-Illumitex_Launches_Into_HB_LED_Market.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/328092-Illumitex_Launches_Into_HB_LED_Market.php?rssid=20224</guid>
			<pubDate>Thu, 20 Aug 2009 15:32:26 GMT</pubDate>
			<description>A new startup, Illumitex, is targeting the high-brightness LED market. Vice President of...</description>
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										<item>
			<title>MEMS Packaging Headed to Wafer Level</title>
			<link>http://www.semiconductor.net/article/327981-MEMS_Packaging_Headed_to_Wafer_Level.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/327981-MEMS_Packaging_Headed_to_Wafer_Level.php?rssid=20224</guid>
			<pubDate>Wed, 19 Aug 2009 15:01:16 GMT</pubDate>
			<description>MEMS packaging may take an evolutionary leap forward into wafer-level packaging, driven by large...</description>
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										<item>
			<title>Yale Team Creates Ferroelectric DRAM</title>
			<link>http://www.semiconductor.net/article/327792-Yale_Team_Creates_Ferroelectric_DRAM.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/327792-Yale_Team_Creates_Ferroelectric_DRAM.php?rssid=20224</guid>
			<pubDate>Mon, 17 Aug 2009 20:15:53 GMT</pubDate>
			<description>A Yale University team led by Professor T.P. Ma has proposed a DRAM that marries a ferroelectric...</description>
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										<item>
			<title>Samsung Upgrading Austin NAND Fab</title>
			<link>http://www.semiconductor.net/article/327643-Samsung_Upgrading_Austin_NAND_Fab.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/327643-Samsung_Upgrading_Austin_NAND_Fab.php?rssid=20224</guid>
			<pubDate>Fri, 14 Aug 2009 19:44:38 GMT</pubDate>
			<description>Samsung said it will convert an older 200 mm DRAM fab in Austin into a copper BEOL for the...</description>
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										<item>
			<title>Duke Gains Control of Janus Particles</title>
			<link>http://www.semiconductor.net/article/327512-Duke_Gains_Control_of_Janus_Particles.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/327512-Duke_Gains_Control_of_Janus_Particles.php?rssid=20224</guid>
			<pubDate>Thu, 13 Aug 2009 13:21:34 GMT</pubDate>
			<description>Janus particles, which thus far could not be realized for lack of precise control, appear to...</description>
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										<item>
			<title>Applied Sees Jump in Equipment Orders</title>
			<link>http://www.semiconductor.net/article/327226-Applied_Sees_Jump_in_Equipment_Orders.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/327226-Applied_Sees_Jump_in_Equipment_Orders.php?rssid=20224</guid>
			<pubDate>Tue, 11 Aug 2009 20:23:38 GMT</pubDate>
			<description>Applied Materials said orders for wafer fab equipment spiked in the final month of its third...</description>
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			<title>March Plasma Systems Receives Provia Orders From PCB Manufacturers</title>
			<link>http://www.semiconductor.net/article/327167-March_Plasma_Systems_Receives_Provia_Orders_From_PCB_Manufacturers.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/327167-March_Plasma_Systems_Receives_Provia_Orders_From_PCB_Manufacturers.php?rssid=20224</guid>
			<pubDate>Tue, 11 Aug 2009 15:13:16 GMT</pubDate>
			<description>March Plasma Systems said it has received additional orders for its Provia plasma system for...</description>
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										<item>
			<title>TSMC and UMC Report Stronger July Sales</title>
			<link>http://www.semiconductor.net/article/326983-TSMC_and_UMC_Report_Stronger_July_Sales.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326983-TSMC_and_UMC_Report_Stronger_July_Sales.php?rssid=20224</guid>
			<pubDate>Mon, 10 Aug 2009 13:24:35 GMT</pubDate>
			<description>TSMC reported a 17.5% sales increase in July, its strongest showing in a year. UMC said its July...</description>
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										<item>
			<title>IC Insights: Only Three Companies in Billion Dollar Capex Club</title>
			<link>http://www.semiconductor.net/article/326787-IC_Insights_Only_Three_Companies_in_Billion_Dollar_Capex_Club.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326787-IC_Insights_Only_Three_Companies_in_Billion_Dollar_Capex_Club.php?rssid=20224</guid>
			<pubDate>Fri, 07 Aug 2009 13:42:34 GMT</pubDate>
			<description>IC Insights reported that only three companies will spend $1B or more this year on semiconductor...</description>
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			<title>Most Viewed Stories for Week of Aug. 3, 2009</title>
			<link>http://www.semiconductor.net/article/326782-Most_Viewed_Stories_for_Week_of_Aug_3_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326782-Most_Viewed_Stories_for_Week_of_Aug_3_2009.php?rssid=20224</guid>
			<pubDate>Fri, 07 Aug 2009 12:35:00 GMT</pubDate>
			<description>Technology and business-related stories are getting back in balance as the downturn loosens its...</description>
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			<title>ADI and NI Develop Low-Cost MEMS Test</title>
			<link>http://www.semiconductor.net/article/326517-ADI_and_NI_Develop_Low_Cost_MEMS_Test.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326517-ADI_and_NI_Develop_Low_Cost_MEMS_Test.php?rssid=20224</guid>
			<pubDate>Wed, 05 Aug 2009 14:43:47 GMT</pubDate>
			<description>Analog Devices Inc. and National Instruments Inc. have developed a MEMS test system based on PXI...</description>
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			<title>Midwest MicroDevices Expands MEMS Capabilities</title>
			<link>http://www.semiconductor.net/article/326455-Midwest_MicroDevices_Expands_MEMS_Capabilities.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326455-Midwest_MicroDevices_Expands_MEMS_Capabilities.php?rssid=20224</guid>
			<pubDate>Tue, 04 Aug 2009 20:05:08 GMT</pubDate>
			<description>Midwest MicroDevices said it has expanded its technical capabilities. The foundry, which...</description>
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			<title>Improve Gas Delivery to Be Green and Save Green</title>
			<link>http://www.semiconductor.net/article/326413-Improve_Gas_Delivery_to_Be_Green_and_Save_Green.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326413-Improve_Gas_Delivery_to_Be_Green_and_Save_Green.php?rssid=20224</guid>
			<pubDate>Tue, 04 Aug 2009 14:09:20 GMT</pubDate>
			<description>Gas blending technology enables semiconductor and PV fabs to use the existing bulk gas...</description>
		</item>
										<item>
			<title>OCD Software Models in 3-D</title>
			<link>http://www.semiconductor.net/article/326410-OCD_Software_Models_in_3_D.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326410-OCD_Software_Models_in_3_D.php?rssid=20224</guid>
			<pubDate>Tue, 04 Aug 2009 13:57:02 GMT</pubDate>
			<description>KLA-Tencor and the Timbre Technologies subsidiary of Tokyo Electron Ltd. (TEL) recently...</description>
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										<item>
			<title>Poly Gate Patterning for 22 nm Logic</title>
			<link>http://www.semiconductor.net/article/326397-Poly_Gate_Patterning_for_22_nm_Logic.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326397-Poly_Gate_Patterning_for_22_nm_Logic.php?rssid=20224</guid>
			<pubDate>Tue, 04 Aug 2009 12:48:48 GMT</pubDate>
			<description>Gridded design rules, a layout architecture in which each device layer has circuits snapped to a...</description>
		</item>
										<item>
			<title>Asyst Automation Assets Move to Buyers</title>
			<link>http://www.semiconductor.net/article/326091-Asyst_Automation_Assets_Move_to_Buyers.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/326091-Asyst_Automation_Assets_Move_to_Buyers.php?rssid=20224</guid>
			<pubDate>Fri, 31 Jul 2009 13:48:08 GMT</pubDate>
			<description>Asyst, which filed for Chapter 11 protection last April, has agreed to three deals to sell the...</description>
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			<title>Recovery Arrives After Severe Downturn</title>
			<link>http://www.semiconductor.net/article/325990-Recovery_Arrives_After_Severe_Downturn.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/325990-Recovery_Arrives_After_Severe_Downturn.php?rssid=20224</guid>
			<pubDate>Thu, 30 Jul 2009 12:53:16 GMT</pubDate>
			<description>The semiconductor equipment industry is bouncing back after a severe drop in orders. New fab...</description>
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			<title>GlobalFoundries Nabs STMicro as Customer</title>
			<link>http://www.semiconductor.net/article/316680-GlobalFoundries_Nabs_STMicro_as_Customer.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/316680-GlobalFoundries_Nabs_STMicro_as_Customer.php?rssid=20224</guid>
			<pubDate>Wed, 29 Jul 2009 11:07:38 GMT</pubDate>
			<description>GlobalFoundries said it has signed up STMicroelectronics as the first customer for its low-power...</description>
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			<title>GlobalFoundries Outlines 22 nm Roadmap</title>
			<link>http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/316595-GlobalFoundries_Outlines_22_nm_Roadmap.php?rssid=20224</guid>
			<pubDate>Tue, 28 Jul 2009 15:11:43 GMT</pubDate>
			<description>GlobalFoundries plans to introduce embedded silicon carbon (eSiC) to strain the nFET transistors...</description>
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										<item>
			<title>Pad Conditioner Improves CMP Efficiency</title>
			<link>http://www.semiconductor.net/article/316566-Pad_Conditioner_Improves_CMP_Efficiency.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/316566-Pad_Conditioner_Improves_CMP_Efficiency.php?rssid=20224</guid>
			<pubDate>Tue, 28 Jul 2009 13:02:30 GMT</pubDate>
			<description>Optimization of CMP processes is typically carried out using monitor wafers with off-line...</description>
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										<item>
			<title>Optical Lithography Is Still the Technology to Beat</title>
			<link>http://www.semiconductor.net/article/316386-Optical_Lithography_Is_Still_the_Technology_to_Beat.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/316386-Optical_Lithography_Is_Still_the_Technology_to_Beat.php?rssid=20224</guid>
			<pubDate>Fri, 24 Jul 2009 21:20:35 GMT</pubDate>
			<description>Although EUV lithography is widely considered the prime candidate for post-optical lithography,...</description>
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			<title>GlobalFoundries Breaks Ground in Malta</title>
			<link>http://www.semiconductor.net/article/316284-GlobalFoundries_Breaks_Ground_in_Malta.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/316284-GlobalFoundries_Breaks_Ground_in_Malta.php?rssid=20224</guid>
			<pubDate>Fri, 24 Jul 2009 11:31:08 GMT</pubDate>
			<description>GlobalFoundries held a groundbreaking ceremony for Fab 2 in Malta, N.Y. The foundry's goal is to...</description>
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										<item>
			<title>Solomon to Keynote SWE Conference</title>
			<link>http://www.semiconductor.net/article/316235-Solomon_to_Keynote_SWE_Conference.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/316235-Solomon_to_Keynote_SWE_Conference.php?rssid=20224</guid>
			<pubDate>Thu, 23 Jul 2009 18:20:06 GMT</pubDate>
			<description>The Society of Women Engineers (SWE) recently announced Darlene Solomon, Agilent chief...</description>
		</item>
										<item>
			<title>More on Sematech's TSV Interconnect Program</title>
			<link>http://www.semiconductor.net/article/316223-More_on_Sematech_s_TSV_Interconnect_Program.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/316223-More_on_Sematech_s_TSV_Interconnect_Program.php?rssid=20224</guid>
			<pubDate>Thu, 23 Jul 2009 17:06:42 GMT</pubDate>
			<description>Sematech qualified an infrared inspection tool that can verify the alignment of through-silicon...</description>
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										<item>
			<title>EUV Sources Come Back as Top EUV Lithography Concern</title>
			<link>http://www.semiconductor.net/article/315938-EUV_Sources_Come_Back_as_Top_EUV_Lithography_Concern.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315938-EUV_Sources_Come_Back_as_Top_EUV_Lithography_Concern.php?rssid=20224</guid>
			<pubDate>Tue, 21 Jul 2009 16:15:54 GMT</pubDate>
			<description>This time it's the sources used for extreme ultraviolet (EUV) metrology that are a concern, as...</description>
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										<item>
			<title>3-D IC Technology Continues to Advance</title>
			<link>http://www.semiconductor.net/article/315754-3_D_IC_Technology_Continues_to_Advance.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315754-3_D_IC_Technology_Continues_to_Advance.php?rssid=20224</guid>
			<pubDate>Mon, 20 Jul 2009 14:01:19 GMT</pubDate>
			<description>Despite the downturn, several companies announced 3-D interconnect-related advances at last...</description>
		</item>
										<item>
			<title>ISMI Selects SSEC 450 mm Single-Wafer Cleaner</title>
			<link>http://www.semiconductor.net/article/315628-ISMI_Selects_SSEC_450_mm_Single_Wafer_Cleaner.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315628-ISMI_Selects_SSEC_450_mm_Single_Wafer_Cleaner.php?rssid=20224</guid>
			<pubDate>Fri, 17 Jul 2009 15:09:51 GMT</pubDate>
			<description>The 3400 series single-wafer cleaning processor from Solid State Equipment Corp. has been chosen...</description>
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										<item>
			<title>Commercial Nanotech Applications Continue on Track</title>
			<link>http://www.semiconductor.net/article/315532-Commercial_Nanotech_Applications_Continue_on_Track.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315532-Commercial_Nanotech_Applications_Continue_on_Track.php?rssid=20224</guid>
			<pubDate>Thu, 16 Jul 2009 17:35:02 GMT</pubDate>
			<description>At SEMICON West, the Extreme Nano session pointed to the fact that minuscule dreams are...</description>
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										<item>
			<title>Nano Green Takes Best of West Award</title>
			<link>http://www.semiconductor.net/article/315522-Nano_Green_Takes_Best_of_West_Award.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315522-Nano_Green_Takes_Best_of_West_Award.php?rssid=20224</guid>
			<pubDate>Thu, 16 Jul 2009 17:14:15 GMT</pubDate>
			<description>The Best of West award is bestowed by show organizer SEMI to honor innovations that represent...</description>
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										<item>
			<title>SI Honors Best Products at Awards Breakfast</title>
			<link>http://www.semiconductor.net/article/315514-SI_Honors_Best_Products_at_Awards_Breakfast.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315514-SI_Honors_Best_Products_at_Awards_Breakfast.php?rssid=20224</guid>
			<pubDate>Thu, 16 Jul 2009 15:54:47 GMT</pubDate>
			<description>Semiconductor International honored the 15 products, materials or services proven in the...</description>
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										<item>
			<title>Toolmakers Ease Double Patterning Throughput Hit</title>
			<link>http://www.semiconductor.net/article/315511-Toolmakers_Ease_Double_Patterning_Throughput_Hit.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315511-Toolmakers_Ease_Double_Patterning_Throughput_Hit.php?rssid=20224</guid>
			<pubDate>Thu, 16 Jul 2009 15:38:06 GMT</pubDate>
			<description>At this year's Sokudo Lithography Breakfast Forum at SEMICON West, toolmakers presented their...</description>
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										<item>
			<title>OEM Group Acquires Legacy Tools From Air Products</title>
			<link>http://www.semiconductor.net/article/315509-OEM_Group_Acquires_Legacy_Tools_From_Air_Products.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315509-OEM_Group_Acquires_Legacy_Tools_From_Air_Products.php?rssid=20224</guid>
			<pubDate>Thu, 16 Jul 2009 15:24:10 GMT</pubDate>
			<description>The OEM Group has acquired the legacy equipment lines of Air Products and Chemicals...</description>
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										<item>
			<title>The Steady-State Semiconductor Universe</title>
			<link>http://www.semiconductor.net/article/315501-The_Steady_State_Semiconductor_Universe.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315501-The_Steady_State_Semiconductor_Universe.php?rssid=20224</guid>
			<pubDate>Thu, 16 Jul 2009 15:03:19 GMT</pubDate>
			<description>In a keynote address "World Semiconductor Dynamics: Myth vs. Reality," Walden Rhines, chairman...</description>
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										<item>
			<title>This Year, Entire Roadmap Changes</title>
			<link>http://www.semiconductor.net/article/315494-This_Year_Entire_Roadmap_Changes.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315494-This_Year_Entire_Roadmap_Changes.php?rssid=20224</guid>
			<pubDate>Thu, 16 Jul 2009 14:26:46 GMT</pubDate>
			<description>The ITRS Roadmap will see a new edition go on-line in December. To get ready, participants met...</description>
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										<item>
			<title>Test Solutions Cope With Economic Crisis</title>
			<link>http://www.semiconductor.net/article/315368-Test_Solutions_Cope_With_Economic_Crisis.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315368-Test_Solutions_Cope_With_Economic_Crisis.php?rssid=20224</guid>
			<pubDate>Wed, 15 Jul 2009 15:04:46 GMT</pubDate>
			<description>Presentations at the New Test Solutions TechXPOT addressed how to better mine data, and a...</description>
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										<item>
			<title>Post-Silicon Solutions Emerging</title>
			<link>http://www.semiconductor.net/article/315362-Post_Silicon_Solutions_Emerging.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315362-Post_Silicon_Solutions_Emerging.php?rssid=20224</guid>
			<pubDate>Wed, 15 Jul 2009 14:30:30 GMT</pubDate>
			<description>Researchers have an array of new technologies in the pipeline to boost CMOS logic and memory...</description>
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										<item>
			<title>OCD Software Models in 3-D</title>
			<link>http://www.semiconductor.net/article/315358-OCD_Software_Models_in_3_D.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315358-OCD_Software_Models_in_3_D.php?rssid=20224</guid>
			<pubDate>Wed, 15 Jul 2009 13:54:43 GMT</pubDate>
			<description>Optical critical dimension (OCD) metrology is an established method for production monitoring of...</description>
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			<title>Disaster Stimulates the Industry</title>
			<link>http://www.semiconductor.net/article/315346-Disaster_Stimulates_the_Industry.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315346-Disaster_Stimulates_the_Industry.php?rssid=20224</guid>
			<pubDate>Wed, 15 Jul 2009 13:08:18 GMT</pubDate>
			<description>Every economic crisis over the past 40 years has resulted in significant innovations according...</description>
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			<title>Analysts See Positive Signs in Recent Data</title>
			<link>http://www.semiconductor.net/article/315237-Analysts_See_Positive_Signs_in_Recent_Data.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315237-Analysts_See_Positive_Signs_in_Recent_Data.php?rssid=20224</guid>
			<pubDate>Tue, 14 Jul 2009 18:35:12 GMT</pubDate>
			<description>At SEMICON West a market outlook symposium organized by SEMI and Gartner Inc. has analysts...</description>
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										<item>
			<title>IMEC Reveals Interconnect Roadmap to 10 nm</title>
			<link>http://www.semiconductor.net/article/315224-IMEC_Reveals_Interconnect_Roadmap_to_10_nm.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315224-IMEC_Reveals_Interconnect_Roadmap_to_10_nm.php?rssid=20224</guid>
			<pubDate>Tue, 14 Jul 2009 17:58:06 GMT</pubDate>
			<description>IMEC says there has been great progress in identifying metallization solution for 22 nm. The...</description>
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										<item>
			<title>Soitec to Support IBM's 3-D Chip Effort</title>
			<link>http://www.semiconductor.net/article/315189-Soitec_to_Support_IBM_s_3_D_Chip_Effort.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/315189-Soitec_to_Support_IBM_s_3_D_Chip_Effort.php?rssid=20224</guid>
			<pubDate>Tue, 14 Jul 2009 15:16:44 GMT</pubDate>
			<description>Soitec said it will work with IBM on its memory-on-digital IC development effort, providing...</description>
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			<title>Entegris Advances 300 mm Wafer Environment Control</title>
			<link>http://www.semiconductor.net/article/314995-Entegris_Advances_300_mm_Wafer_Environment_Control.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/314995-Entegris_Advances_300_mm_Wafer_Environment_Control.php?rssid=20224</guid>
			<pubDate>Mon, 13 Jul 2009 14:19:13 GMT</pubDate>
			<description>Entegris Inc. announced several new enhancements to its Spectra line of 300 mm FOUPs to reduce...</description>
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										<item>
			<title>Next-Gen Nanoimprint Stepper Improves Defectivity, Alignment</title>
			<link>http://www.semiconductor.net/article/314889-Next_Gen_Nanoimprint_Stepper_Improves_Defectivity_Alignment.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/314889-Next_Gen_Nanoimprint_Stepper_Improves_Defectivity_Alignment.php?rssid=20224</guid>
			<pubDate>Mon, 13 Jul 2009 13:00:00 GMT</pubDate>
			<description>EV Group announced its latest UV-NIL stepper in conjunction with SEMICON West, but the tool is...</description>
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										<item>
			<title>ST-Ericsson Taking 3-D to Mobile Phones</title>
			<link>http://www.semiconductor.net/article/311613-ST_Ericsson_Taking_3_D_to_Mobile_Phones.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/311613-ST_Ericsson_Taking_3_D_to_Mobile_Phones.php?rssid=20224</guid>
			<pubDate>Thu, 09 Jul 2009 14:49:58 GMT</pubDate>
			<description>ST-Ericsson has a roadmap for commercial wireless products that includes what could be the first...</description>
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										<item>
			<title>Secondary Equipment Market Readies for New Era</title>
			<link>http://www.semiconductor.net/article/307759-Secondary_Equipment_Market_Readies_for_New_Era.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/307759-Secondary_Equipment_Market_Readies_for_New_Era.php?rssid=20224</guid>
			<pubDate>Wed, 08 Jul 2009 15:18:04 GMT</pubDate>
			<description>A lot of used semiconductor equipment is now becoming available, and large IC manufacturers need...</description>
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										<item>
			<title>ISMI to Report Progress at SEMICON West</title>
			<link>http://www.semiconductor.net/article/307479-ISMI_to_Report_Progress_at_SEMICON_West.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/307479-ISMI_to_Report_Progress_at_SEMICON_West.php?rssid=20224</guid>
			<pubDate>Mon, 06 Jul 2009 15:16:40 GMT</pubDate>
			<description>At next week's SEMICON West show, ISMI will meet the supplier community to discuss progress with...</description>
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										<item>
			<title>Cost a Major Challenge for Advanced Packaging Solutions</title>
			<link>http://www.semiconductor.net/article/307271-Cost_a_Major_Challenge_for_Advanced_Packaging_Solutions.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/307271-Cost_a_Major_Challenge_for_Advanced_Packaging_Solutions.php?rssid=20224</guid>
			<pubDate>Thu, 02 Jul 2009 14:16:00 GMT</pubDate>
			<description>Over the past several years, IDMs have seen the price of silicon fabrication fall, while the...</description>
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										<item>
			<title>New Packaging Dimensions, Frontiers</title>
			<link>http://www.semiconductor.net/article/307273-New_Packaging_Dimensions_Frontiers.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/307273-New_Packaging_Dimensions_Frontiers.php?rssid=20224</guid>
			<pubDate>Thu, 02 Jul 2009 16:49:00 GMT</pubDate>
			<description>Packaging technologies are very much at the fore of industry thinking, driven by ICs at 22 nm...</description>
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										<item>
			<title>Wafer-Level Packaging in Africa?</title>
			<link>http://www.semiconductor.net/article/307240-Wafer_Level_Packaging_in_Africa_.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/307240-Wafer_Level_Packaging_in_Africa_.php?rssid=20224</guid>
			<pubDate>Wed, 01 Jul 2009 12:11:34 GMT</pubDate>
			<description>Yes, Africa. Nemotek Technologie is manufacturing wafer-level optics and packaging in its...</description>
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										<item>
			<title>Sematech Seeks EUV Mask Tool Funding</title>
			<link>http://www.semiconductor.net/article/307152-Sematech_Seeks_EUV_Mask_Tool_Funding.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/307152-Sematech_Seeks_EUV_Mask_Tool_Funding.php?rssid=20224</guid>
			<pubDate>Tue, 30 Jun 2009 15:20:52 GMT</pubDate>
			<description>Few commercial suppliers are stepping up to develop the EUV mask inspection tools that will be...</description>
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										<item>
			<title>Sematech Crafts ZIL Solution for 16 nm</title>
			<link>http://www.semiconductor.net/article/307037-Sematech_Crafts_ZIL_Solution_for_16_nm.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/307037-Sematech_Crafts_ZIL_Solution_for_16_nm.php?rssid=20224</guid>
			<pubDate>Mon, 29 Jun 2009 15:34:37 GMT</pubDate>
			<description>Sematech researchers said a zero interface layer (ZIL) approach has been demonstrated, and may...</description>
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			<title>Most Viewed Stories for Week of June 22, 2009</title>
			<link>http://www.semiconductor.net/article/306886-Most_Viewed_Stories_for_Week_of_June_22_2009.php?rssid=20224</link>
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			<pubDate>Fri, 26 Jun 2009 13:13:36 GMT</pubDate>
			<description>This week's top stories included two 3-D-related pieces: a story on the SUSS MicroTec wafer...</description>
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			<title>Advanced Imaging Solutions for Shrinking the k1 Gap</title>
			<link>http://www.semiconductor.net/article/295761-Advanced_Imaging_Solutions_for_Shrinking_the_k1_Gap.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295761-Advanced_Imaging_Solutions_for_Shrinking_the_k1_Gap.php?rssid=20224</guid>
			<pubDate>Thu, 25 Jun 2009 19:15:17 GMT</pubDate>
			<description>There's still room for improvement in optical lithography. At SEMICON West, Stephen Renwick of...</description>
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			<title>SEMICON West Session Focuses on 22 nm Lithography</title>
			<link>http://www.semiconductor.net/article/295755-SEMICON_West_Session_Focuses_on_22_nm_Lithography.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295755-SEMICON_West_Session_Focuses_on_22_nm_Lithography.php?rssid=20224</guid>
			<pubDate>Thu, 25 Jun 2009 18:39:11 GMT</pubDate>
			<description>Moderated by Semiconductor International Executive Editor Aaron Hand, the "Lithography...</description>
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			<title>Printable Electronics Hits Display Needs</title>
			<link>http://www.semiconductor.net/article/295595-Printable_Electronics_Hits_Display_Needs.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295595-Printable_Electronics_Hits_Display_Needs.php?rssid=20224</guid>
			<pubDate>Wed, 24 Jun 2009 14:07:54 GMT</pubDate>
			<description>Printable electronics could reduce the cost of making flexible displays of the kind used in the...</description>
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			<title>Applied, DNS Reshuffle Stakes in Sokudo</title>
			<link>http://www.semiconductor.net/article/295501-Applied_DNS_Reshuffle_Stakes_in_Sokudo.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295501-Applied_DNS_Reshuffle_Stakes_in_Sokudo.php?rssid=20224</guid>
			<pubDate>Tue, 23 Jun 2009 13:51:05 GMT</pubDate>
			<description>Applied Materials and Dainippon Screen said they are adjusting ownership in the Sokudo track...</description>
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			<title>SUSS MicroTec, 3M Partner on 3-D Bonds</title>
			<link>http://www.semiconductor.net/article/295445-SUSS_MicroTec_3M_Partner_on_3_D_Bonds.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295445-SUSS_MicroTec_3M_Partner_on_3_D_Bonds.php?rssid=20224</guid>
			<pubDate>Mon, 22 Jun 2009 15:54:42 GMT</pubDate>
			<description>SUSS MicroTec AG (Garching, Germany) and 3M Corp. (Minneapolis) will work together, offering...</description>
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			<title>Most Viewed Stories for Week of June 15, 2009</title>
			<link>http://www.semiconductor.net/article/295331-Most_Viewed_Stories_for_Week_of_June_15_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295331-Most_Viewed_Stories_for_Week_of_June_15_2009.php?rssid=20224</guid>
			<pubDate>Fri, 19 Jun 2009 16:03:58 GMT</pubDate>
			<description>A report on new displays aimed at E-books and other new markets tops our most-viewed list this...</description>
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			<title>Nanoelectronics Edge Into Production</title>
			<link>http://www.semiconductor.net/article/295296-Nanoelectronics_Edge_Into_Production.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295296-Nanoelectronics_Edge_Into_Production.php?rssid=20224</guid>
			<pubDate>Fri, 19 Jun 2009 12:50:30 GMT</pubDate>
			<description>Graphene and spin wave transistors are among the technologies that look interesting for...</description>
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			<title>MEMS Markets See Growth Opportunities</title>
			<link>http://www.semiconductor.net/article/294858-MEMS_Markets_See_Growth_Opportunities.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/294858-MEMS_Markets_See_Growth_Opportunities.php?rssid=20224</guid>
			<pubDate>Fri, 19 Jun 2009 12:32:00 GMT</pubDate>
			<description>The MEMS industry continues to do remarkably well compared with the IC industry because it is so...</description>
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			<title>Printed Electronics Seeing Wide Progress</title>
			<link>http://www.semiconductor.net/article/295295-Printed_Electronics_Seeing_Wide_Progress.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295295-Printed_Electronics_Seeing_Wide_Progress.php?rssid=20224</guid>
			<pubDate>Fri, 19 Jun 2009 10:56:43 GMT</pubDate>
			<description>Executives from an array of printed electronics companies will describe progress in the field at...</description>
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			<title>Thin SOI Devices Shine at VLSI Symposium</title>
			<link>http://www.semiconductor.net/article/295251-Thin_SOI_Devices_Shine_at_VLSI_Symposium.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/295251-Thin_SOI_Devices_Shine_at_VLSI_Symposium.php?rssid=20224</guid>
			<pubDate>Thu, 18 Jun 2009 14:13:00 GMT</pubDate>
			<description>At the 2009 Symposium on VLSI Technology in Kyoto, Japan, an IBM R&amp;D team described fully...</description>
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			<title>CyberOptics Founder Steven Case Killed in Plane Crash</title>
			<link>http://www.semiconductor.net/article/294851-CyberOptics_Founder_Steven_Case_Killed_in_Plane_Crash.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/294851-CyberOptics_Founder_Steven_Case_Killed_in_Plane_Crash.php?rssid=20224</guid>
			<pubDate>Wed, 17 Jun 2009 18:18:57 GMT</pubDate>
			<description>CyberOptics said its chairman and founder Steven Case died Tuesday night when the small plane he...</description>
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			<title>NEC's MRAM Uses Vertical Magnetic Spin</title>
			<link>http://www.semiconductor.net/article/294804-NEC_s_MRAM_Uses_Vertical_Magnetic_Spin.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/294804-NEC_s_MRAM_Uses_Vertical_Magnetic_Spin.php?rssid=20224</guid>
			<pubDate>Wed, 17 Jun 2009 13:48:22 GMT</pubDate>
			<description>NEC presented a spintronics MRAM cell at the Symposium on VLSI Technology in Kyoto, Japan. The...</description>
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			<title>Alliance Members Tout Oxide EOT Advance</title>
			<link>http://www.semiconductor.net/article/294639-Alliance_Members_Tout_Oxide_EOT_Advance.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/294639-Alliance_Members_Tout_Oxide_EOT_Advance.php?rssid=20224</guid>
			<pubDate>Tue, 16 Jun 2009 15:24:33 GMT</pubDate>
			<description>Researchers from GlobalFoundries and IBM Research went to the 2009 Symposium on VLSI Technology...</description>
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			<title>Equipment Industry Bottomed Out in Q2, Gartner Reports</title>
			<link>http://www.semiconductor.net/article/279366-Equipment_Industry_Bottomed_Out_in_Q2_Gartner_Reports.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/279366-Equipment_Industry_Bottomed_Out_in_Q2_Gartner_Reports.php?rssid=20224</guid>
			<pubDate>Mon, 15 Jun 2009 15:24:39 GMT</pubDate>
			<description>The outlook for the semiconductor equipment industry is beginning to improve, according to...</description>
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			<title>SID: Flexible Displays Are on Their Way</title>
			<link>http://www.semiconductor.net/article/279358-SID_Flexible_Displays_Are_on_Their_Way.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/279358-SID_Flexible_Displays_Are_on_Their_Way.php?rssid=20224</guid>
			<pubDate>Mon, 15 Jun 2009 14:15:53 GMT</pubDate>
			<description>New displays aimed at E-books and other portable products were at center stage at the Society of...</description>
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			<title>Most Viewed Stories for Week of June 8, 2009</title>
			<link>http://www.semiconductor.net/article/279226-Most_Viewed_Stories_for_Week_of_June_8_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/279226-Most_Viewed_Stories_for_Week_of_June_8_2009.php?rssid=20224</guid>
			<pubDate>Fri, 12 Jun 2009 16:02:02 GMT</pubDate>
			<description>Many readers looked at a story about Aviza Technology's Chapter 11 bankruptcy filing this week,...</description>
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			<title>Chang Takes Back CEO Job at TSMC</title>
			<link>http://www.semiconductor.net/article/279193-Chang_Takes_Back_CEO_Job_at_TSMC.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/279193-Chang_Takes_Back_CEO_Job_at_TSMC.php?rssid=20224</guid>
			<pubDate>Fri, 12 Jun 2009 10:13:02 GMT</pubDate>
			<description>TSMC's board of directors named Morris Chang as CEO today, handing back the CEO title to the...</description>
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			<title>IMEC Tips 10 nm Options at Tech Forum</title>
			<link>http://www.semiconductor.net/article/279085-IMEC_Tips_10_nm_Options_at_Tech_Forum.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/279085-IMEC_Tips_10_nm_Options_at_Tech_Forum.php?rssid=20224</guid>
			<pubDate>Thu, 11 Jun 2009 13:40:11 GMT</pubDate>
			<description>IMEC Fellow Marc Heyns described R&amp;D directions at the consortium's recent technology forum,...</description>
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			<title>Aviza Technology Files for Chapter 11</title>
			<link>http://www.semiconductor.net/article/279019-Aviza_Technology_Files_for_Chapter_11.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/279019-Aviza_Technology_Files_for_Chapter_11.php?rssid=20224</guid>
			<pubDate>Wed, 10 Jun 2009 16:20:01 GMT</pubDate>
			<description>Aviza Technology Inc. declared voluntary Chapter 11 bankruptcy, and said it expects to continue...</description>
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			<title>SEMI World Fab Forecast Reveals Signs of Increased Investment</title>
			<link>http://www.semiconductor.net/article/278994-SEMI_World_Fab_Forecast_Reveals_Signs_of_Increased_Investment.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278994-SEMI_World_Fab_Forecast_Reveals_Signs_of_Increased_Investment.php?rssid=20224</guid>
			<pubDate>Wed, 10 Jun 2009 14:25:55 GMT</pubDate>
			<description>SEMI said total 2009 fab spending is expected to decline by ~51% this year. However, spending is...</description>
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			<title>EUV Reduced to an Engineering Problem</title>
			<link>http://www.semiconductor.net/article/278860-EUV_Reduced_to_an_Engineering_Problem.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278860-EUV_Reduced_to_an_Engineering_Problem.php?rssid=20224</guid>
			<pubDate>Tue, 09 Jun 2009 16:15:36 GMT</pubDate>
			<description>EUV seems to be finally at the stage of "just an engineering problem," though a sufficiently...</description>
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			<title>Rave Lands Rhazer at Chartered's Fab 7</title>
			<link>http://www.semiconductor.net/article/278844-Rave_Lands_Rhazer_at_Chartered_s_Fab_7.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278844-Rave_Lands_Rhazer_at_Chartered_s_Fab_7.php?rssid=20224</guid>
			<pubDate>Tue, 09 Jun 2009 15:05:14 GMT</pubDate>
			<description>Rave LLC said its Rhazer haze removal technology has been evaluated by Chartered Semiconductor....</description>
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			<title>Novellus Improves Clean Process for Speed Max Gapfill Tool</title>
			<link>http://www.semiconductor.net/article/278834-Novellus_Improves_Clean_Process_for_Speed_Max_Gapfill_Tool.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278834-Novellus_Improves_Clean_Process_for_Speed_Max_Gapfill_Tool.php?rssid=20224</guid>
			<pubDate>Tue, 09 Jun 2009 14:19:27 GMT</pubDate>
			<description>Novellus said it has improved the in situ clean steps for its CVD gapfill platform, reducing...</description>
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			<title>SEMICON West: Timans to Present on Millisecond Annealing</title>
			<link>http://www.semiconductor.net/article/278179-SEMICON_West_Timans_to_Present_on_Millisecond_Annealing.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278179-SEMICON_West_Timans_to_Present_on_Millisecond_Annealing.php?rssid=20224</guid>
			<pubDate>Fri, 05 Jun 2009 15:25:00 GMT</pubDate>
			<description>Paul Timans, director of technology for the RTP Products Business Unit at Mattson Technology...</description>
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			<title>What's New at SEMICON West 2009?</title>
			<link>http://www.semiconductor.net/article/278341-What_s_New_at_SEMICON_West_2009_.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278341-What_s_New_at_SEMICON_West_2009_.php?rssid=20224</guid>
			<pubDate>Fri, 05 Jun 2009 14:34:00 GMT</pubDate>
			<description>The most prominent new addition to the SEMICON West show this year is Extreme Electronics, a...</description>
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			<title>Samsung's Kim Claims No Limit to Scaling</title>
			<link>http://www.semiconductor.net/article/278328-Samsung_s_Kim_Claims_No_Limit_to_Scaling.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278328-Samsung_s_Kim_Claims_No_Limit_to_Scaling.php?rssid=20224</guid>
			<pubDate>Thu, 04 Jun 2009 17:13:45 GMT</pubDate>
			<description>Speaking at IMEC's Technology Forum this week, the ever-optimistic Kinam Kim of Samsung...</description>
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			<title>Qualcomm Claims New Industry Model</title>
			<link>http://www.semiconductor.net/article/278126-Qualcomm_Claims_New_Industry_Model.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278126-Qualcomm_Claims_New_Industry_Model.php?rssid=20224</guid>
			<pubDate>Thu, 04 Jun 2009 12:48:46 GMT</pubDate>
			<description>A change to the fabless/foundry model is already taking place, according to a talk given by Jim...</description>
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										<item>
			<title>IMEC Expands Its Partnership with TSMC</title>
			<link>http://www.semiconductor.net/article/278103-IMEC_Expands_Its_Partnership_with_TSMC.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/278103-IMEC_Expands_Its_Partnership_with_TSMC.php?rssid=20224</guid>
			<pubDate>Wed, 03 Jun 2009 21:39:00 GMT</pubDate>
			<description>TSMC will base its European R&amp;D at IMEC. The Taiwan-based foundry will play a more active role...</description>
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										<item>
			<title>IMEC Changes Leadership, Broadens Scope</title>
			<link>http://www.semiconductor.net/article/277965-IMEC_Changes_Leadership_Broadens_Scope.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277965-IMEC_Changes_Leadership_Broadens_Scope.php?rssid=20224</guid>
			<pubDate>Wed, 03 Jun 2009 11:53:00 GMT</pubDate>
			<description>Luc Van den hove was named CEO at IMEC, taking over the role held by Gilbert Declerck for the...</description>
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			<title>Komatsu Laser Marks on Silicon Surface</title>
			<link>http://www.semiconductor.net/article/277771-Komatsu_Laser_Marks_on_Silicon_Surface.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277771-Komatsu_Laser_Marks_on_Silicon_Surface.php?rssid=20224</guid>
			<pubDate>Tue, 02 Jun 2009 13:07:00 GMT</pubDate>
			<description>Komatsu Engineering Corp. said it has developed a laser marker that can better identify...</description>
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			<title>Entrepix Key to Schiltron’s Prototypes</title>
			<link>http://www.semiconductor.net/article/277547-Entrepix_Key_to_Schiltron_s_Prototypes.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277547-Entrepix_Key_to_Schiltron_s_Prototypes.php?rssid=20224</guid>
			<pubDate>Mon, 01 Jun 2009 10:01:00 GMT</pubDate>
			<description>Schiltron, a startup with a thin-film transistor 3-D memory architecture, said Entrepix, a CMP...</description>
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			<title>Most Viewed Stories for Week of May 25, 2009</title>
			<link>http://www.semiconductor.net/article/277380-Most_Viewed_Stories_for_Week_of_May_25_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277380-Most_Viewed_Stories_for_Week_of_May_25_2009.php?rssid=20224</guid>
			<pubDate>Fri, 29 May 2009 12:30:00 GMT</pubDate>
			<description>A story about Sanyo’s more-efficient c-Si solar cell engaged the most readers this week. Nikon...</description>
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			<title>Chartered Denies Bid From Abu Dhabi’s ATIC</title>
			<link>http://www.semiconductor.net/article/277379-Chartered_Denies_Bid_From_Abu_Dhabi_s_ATIC.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277379-Chartered_Denies_Bid_From_Abu_Dhabi_s_ATIC.php?rssid=20224</guid>
			<pubDate>Fri, 29 May 2009 10:32:00 GMT</pubDate>
			<description>Chartered Semiconductor Manufacturing Ltd. (Singapore) denied a report in a Singapore business...</description>
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			<title>Confluense Readies CMP Pad Surface Manager</title>
			<link>http://www.semiconductor.net/article/277377-Confluense_Readies_CMP_Pad_Surface_Manager.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277377-Confluense_Readies_CMP_Pad_Surface_Manager.php?rssid=20224</guid>
			<pubDate>Thu, 28 May 2009 20:28:00 GMT</pubDate>
			<description>Confluense LLC (Allentown, Pa.) said its pad conditioning system, called Pad Surface Manager,...</description>
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			<title>Job Fair Seeks Managers for GlobalFoundries Project</title>
			<link>http://www.semiconductor.net/article/277230-Job_Fair_Seeks_Managers_for_GlobalFoundries_Project.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277230-Job_Fair_Seeks_Managers_for_GlobalFoundries_Project.php?rssid=20224</guid>
			<pubDate>Thu, 28 May 2009 15:27:00 GMT</pubDate>
			<description>A job fair is being planned as part of an effort to hire fab construction experts for the...</description>
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			<title>Novellus Advances PVD TaN Barrier Film</title>
			<link>http://www.semiconductor.net/article/277206-Novellus_Advances_PVD_TaN_Barrier_Film.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277206-Novellus_Advances_PVD_TaN_Barrier_Film.php?rssid=20224</guid>
			<pubDate>Thu, 28 May 2009 14:40:00 GMT</pubDate>
			<description>Novellus said its has developed a conformal hollow cathode magnetron (HCM) PVD technology,...</description>
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			<title>Downturn to Spur Shift to 3-D Packaging</title>
			<link>http://www.semiconductor.net/article/277066-Downturn_to_Spur_Shift_to_3_D_Packaging.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277066-Downturn_to_Spur_Shift_to_3_D_Packaging.php?rssid=20224</guid>
			<pubDate>Wed, 27 May 2009 15:01:00 GMT</pubDate>
			<description>The past several semiconductor downturns have resulted in transitions from one generation of...</description>
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			<title>Nikon to Reduce Lithography Workforce by 1000</title>
			<link>http://www.semiconductor.net/article/277015-Nikon_to_Reduce_Lithography_Workforce_by_1000.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/277015-Nikon_to_Reduce_Lithography_Workforce_by_1000.php?rssid=20224</guid>
			<pubDate>Wed, 27 May 2009 11:24:00 GMT</pubDate>
			<description>Facing “further severe business conditions,” Nikon Corp. said it will reorganize its...</description>
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			<title>Most Viewed Stories for Week of May 18, 2009</title>
			<link>http://www.semiconductor.net/article/263531-Most_Viewed_Stories_for_Week_of_May_18_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/263531-Most_Viewed_Stories_for_Week_of_May_18_2009.php?rssid=20224</guid>
			<pubDate>Fri, 22 May 2009 12:34:00 GMT</pubDate>
			<description>Readers paid close attention to an overview story on flip-chip packaging, and to an account of...</description>
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			<title>VLSI Customer Survey Ranks Top Suppliers</title>
			<link>http://www.semiconductor.net/article/253311-VLSI_Customer_Survey_Ranks_Top_Suppliers.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/253311-VLSI_Customer_Survey_Ranks_Top_Suppliers.php?rssid=20224</guid>
			<pubDate>Thu, 21 May 2009 15:14:00 GMT</pubDate>
			<description>VLSI Research Inc. ranked Varian and Novellus as the top large equipment suppliers, based on...</description>
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			<title>GlobalFoundries and T-RAM to Tackle Advanced Nodes</title>
			<link>http://www.semiconductor.net/article/232926-GlobalFoundries_and_T_RAM_to_Tackle_Advanced_Nodes.php?rssid=20224</link>
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			<pubDate>Tue, 19 May 2009 13:35:00 GMT</pubDate>
			<description>T-RAM Semiconductor, which develops embedded memory IP based on thyristor technology, will work...</description>
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			<title>Everspin MRAM Cited for Zero Defects</title>
			<link>http://www.semiconductor.net/article/232764-Everspin_MRAM_Cited_for_Zero_Defects.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/232764-Everspin_MRAM_Cited_for_Zero_Defects.php?rssid=20224</guid>
			<pubDate>Mon, 18 May 2009 14:11:00 GMT</pubDate>
			<description>Everspin Technologies, a venture-backed MRAM manufacturer that spun out of Freescale last year,...</description>
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			<title>Most Viewed Stories for Week of May 11, 2009</title>
			<link>http://www.semiconductor.net/article/232591-Most_Viewed_Stories_for_Week_of_May_11_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/232591-Most_Viewed_Stories_for_Week_of_May_11_2009.php?rssid=20224</guid>
			<pubDate>Fri, 15 May 2009 13:43:00 GMT</pubDate>
			<description>Freescale’s plan to use nanocrystal flash in its MCUs led our Top 5 list this week, followed...</description>
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			<title>Metrologists: Measure Twice, Process Once</title>
			<link>http://www.semiconductor.net/article/232566-Metrologists_Measure_Twice_Process_Once.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/232566-Metrologists_Measure_Twice_Process_Once.php?rssid=20224</guid>
			<pubDate>Thu, 14 May 2009 23:56:00 GMT</pubDate>
			<description>IBM’s T.C. Chen, Alain Diebold of CNSE, and J. Alexander Liddle of NIST were among the...</description>
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			<title>Harman to Receive IEEE Packaging Award</title>
			<link>http://www.semiconductor.net/article/232541-Harman_to_Receive_IEEE_Packaging_Award.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/232541-Harman_to_Receive_IEEE_Packaging_Award.php?rssid=20224</guid>
			<pubDate>Thu, 14 May 2009 16:14:00 GMT</pubDate>
			<description>George Harman, a retired NIST scientist, will receive the IEEE Components, Packaging and...</description>
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			<title>Novellus Adapts Resist Strip for 3X Node</title>
			<link>http://www.semiconductor.net/article/232542-Novellus_Adapts_Resist_Strip_for_3X_Node.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/232542-Novellus_Adapts_Resist_Strip_for_3X_Node.php?rssid=20224</guid>
			<pubDate>Thu, 14 May 2009 15:39:00 GMT</pubDate>
			<description>Novellus Systems said it has developed a photoresist stripping process that meets the challenges...</description>
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			<title>Emtec Microscope Tilts Light Source</title>
			<link>http://www.semiconductor.net/article/232188-Emtec_Microscope_Tilts_Light_Source.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/232188-Emtec_Microscope_Tilts_Light_Source.php?rssid=20224</guid>
			<pubDate>Tue, 12 May 2009 15:03:00 GMT</pubDate>
			<description>Japan-based Emtec Co. Ltd. has developed an optical microscope that uses a slightly tilted light...</description>
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			<title>Freescale Taking Nanocrystal Flash to Production</title>
			<link>http://www.semiconductor.net/article/232200-Freescale_Taking_Nanocrystal_Flash_to_Production.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/232200-Freescale_Taking_Nanocrystal_Flash_to_Production.php?rssid=20224</guid>
			<pubDate>Mon, 11 May 2009 16:19:00 GMT</pubDate>
			<description>After five years of technology development, Freescale said it is ready to move nanocrystal flash...</description>
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			<title>Most Viewed Stories for Week of May 4, 2009</title>
			<link>http://www.semiconductor.net/article/231837-Most_Viewed_Stories_for_Week_of_May_4_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/231837-Most_Viewed_Stories_for_Week_of_May_4_2009.php?rssid=20224</guid>
			<pubDate>Fri, 08 May 2009 13:14:00 GMT</pubDate>
			<description>Two stories about the upcoming International Interconnect Technology Conference (IITC) lead our...</description>
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			<title>iSuppli Sees Q2 Fab Utilization Improving to 60%</title>
			<link>http://www.semiconductor.net/article/231687-iSuppli_Sees_Q2_Fab_Utilization_Improving_to_60_.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/231687-iSuppli_Sees_Q2_Fab_Utilization_Improving_to_60_.php?rssid=20224</guid>
			<pubDate>Thu, 07 May 2009 15:24:00 GMT</pubDate>
			<description>iSuppli said semiconductor manufacturers will enjoy the first improvement in fab utilization in...</description>
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			<title>Novellus Rolls UV-Absorbing Dielectrics</title>
			<link>http://www.semiconductor.net/article/231671-Novellus_Rolls_UV_Absorbing_Dielectrics.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/231671-Novellus_Rolls_UV_Absorbing_Dielectrics.php?rssid=20224</guid>
			<pubDate>Thu, 07 May 2009 13:52:00 GMT</pubDate>
			<description>Novellus has developed a dense ultralow-k and diffusion barrier stack that absorbs ultraviolet...</description>
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										<item>
			<title>Mentor Enhancing Yield Diagnostics Tool</title>
			<link>http://www.semiconductor.net/article/231572-Mentor_Enhancing_Yield_Diagnostics_Tool.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/231572-Mentor_Enhancing_Yield_Diagnostics_Tool.php?rssid=20224</guid>
			<pubDate>Wed, 06 May 2009 16:00:00 GMT</pubDate>
			<description>Mentor Graphics is adding more powerful statistical analysis techniques to its yield diagnostics...</description>
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			<title>Helium Ion Scope Aids Interconnect Study</title>
			<link>http://www.semiconductor.net/article/231398-Helium_Ion_Scope_Aids_Interconnect_Study.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/231398-Helium_Ion_Scope_Aids_Interconnect_Study.php?rssid=20224</guid>
			<pubDate>Tue, 05 May 2009 13:57:00 GMT</pubDate>
			<description>Researchers from Carl Zeiss SMT and Selete will go to the International Interconnect Technology...</description>
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			<title>2009 IITC to Consider Metals for 22 nm</title>
			<link>http://www.semiconductor.net/article/231189-2009_IITC_to_Consider_Metals_for_22_nm.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/231189-2009_IITC_to_Consider_Metals_for_22_nm.php?rssid=20224</guid>
			<pubDate>Mon, 04 May 2009 15:45:00 GMT</pubDate>
			<description>The upcoming International Interconnect Technology Conference (IITC) will consider a variety of...</description>
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			<title>Most Viewed Stories for Week of April 27, 2009</title>
			<link>http://www.semiconductor.net/article/230990-Most_Viewed_Stories_for_Week_of_April_27_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/230990-Most_Viewed_Stories_for_Week_of_April_27_2009.php?rssid=20224</guid>
			<pubDate>Fri, 01 May 2009 13:42:00 GMT</pubDate>
			<description>Change is constant, and that is reflected in our most-viewed stories for this week. TI’s new...</description>
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			<title>Coping With New Metrology Requirements During Difficult Times</title>
			<link>http://www.semiconductor.net/article/232191-Coping_With_New_Metrology_Requirements_During_Difficult_Times.php?rssid=20224</link>
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			<pubDate>Fri, 01 May 2009 06:00:00 GMT</pubDate>
			<description>This month's podcast interview features Linda Rae, executive vice president and COO at Keithley...</description>
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			<title>Amkor Sees Rebound, Stable OSAT Pricing</title>
			<link>http://www.semiconductor.net/article/230886-Amkor_Sees_Rebound_Stable_OSAT_Pricing.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/230886-Amkor_Sees_Rebound_Stable_OSAT_Pricing.php?rssid=20224</guid>
			<pubDate>Thu, 30 Apr 2009 15:26:00 GMT</pubDate>
			<description>Amkor Technology executives said they expect revenues to jump ~20% in the second quarter, but...</description>
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			<title>Saudi Arabia and Intel Plan R&amp;D Center</title>
			<link>http://www.semiconductor.net/article/210418-Saudi_Arabia_and_Intel_Plan_R_D_Center.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/210418-Saudi_Arabia_and_Intel_Plan_R_D_Center.php?rssid=20224</guid>
			<pubDate>Wed, 29 Apr 2009 15:48:00 GMT</pubDate>
			<description>Intel will help establish a center for nano-manufacturing in the Kingdom of Saudi Arabia,...</description>
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			<title>VLSI Research Foresees Weak Probe Card Market</title>
			<link>http://www.semiconductor.net/article/210198-VLSI_Research_Foresees_Weak_Probe_Card_Market.php?rssid=20224</link>
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			<pubDate>Tue, 28 Apr 2009 15:12:00 GMT</pubDate>
			<description>VLSI Research said the hard-hit probe card market will remain relatively weak over the next five...</description>
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			<title>TI Ramps Up New Assembly/Test Facility</title>
			<link>http://www.semiconductor.net/article/210195-TI_Ramps_Up_New_Assembly_Test_Facility.php?rssid=20224</link>
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			<pubDate>Tue, 28 Apr 2009 13:55:00 GMT</pubDate>
			<description>Texas Instruments’ newest assembly/test facility expands its overall capacity in the...</description>
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			<title>Capex Likely to Remain Conservative, IC Insights Predicts</title>
			<link>http://www.semiconductor.net/article/209943-Capex_Likely_to_Remain_Conservative_IC_Insights_Predicts.php?rssid=20224</link>
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			<pubDate>Fri, 24 Apr 2009 16:10:00 GMT</pubDate>
			<description>Market research firm IC Insights said a rebound in capital spending in 2010 and 2011 is likely,...</description>
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			<title>Most Viewed Stories for Week of April 20, 2009</title>
			<link>http://www.semiconductor.net/article/209878-Most_Viewed_Stories_for_Week_of_April_20_2009.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/209878-Most_Viewed_Stories_for_Week_of_April_20_2009.php?rssid=20224</guid>
			<pubDate>Fri, 24 Apr 2009 13:40:00 GMT</pubDate>
			<description>Asyst Technologies’ bombshell Chapter 11 bankruptcy filing leads our Top 5 list this week,...</description>
		</item>
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			<title>Freescale to Close Fabs in Japan and France</title>
			<link>http://www.semiconductor.net/article/209786-Freescale_to_Close_Fabs_in_Japan_and_France.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/209786-Freescale_to_Close_Fabs_in_Japan_and_France.php?rssid=20224</guid>
			<pubDate>Wed, 22 Apr 2009 22:36:00 GMT</pubDate>
			<description>Freescale Semiconductor executives said the company will close two 150 mm fabs, in Sendai,...</description>
		</item>
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			<title>IMEC Makes Functional 22 nm SRAM Cells With EUV Lithography</title>
			<link>http://www.semiconductor.net/article/209743-IMEC_Makes_Functional_22_nm_SRAM_Cells_With_EUV_Lithography.php?rssid=20224</link>
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			<pubDate>Wed, 22 Apr 2009 16:44:00 GMT</pubDate>
			<description>IMEC has achieved its next milestone with EUV lithography, creating the first functional 22 nm...</description>
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			<title>2009 VLSI Technology Symposium Takes Up Heterogeneous IC Challenges</title>
			<link>http://www.semiconductor.net/article/209744-2009_VLSI_Technology_Symposium_Takes_Up_Heterogeneous_IC_Challenges.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/209744-2009_VLSI_Technology_Symposium_Takes_Up_Heterogeneous_IC_Challenges.php?rssid=20224</guid>
			<pubDate>Wed, 22 Apr 2009 16:11:00 GMT</pubDate>
			<description>The time for first introduction of heterogeneous ICs — based on germanium or SiGe PFET...</description>
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			<title>IMEC Sends Memory DFM Tool to Samsung Electronics</title>
			<link>http://www.semiconductor.net/article/209639-IMEC_Sends_Memory_DFM_Tool_to_Samsung_Electronics.php?rssid=20224</link>
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			<pubDate>Tue, 21 Apr 2009 15:37:00 GMT</pubDate>
			<description>IMEC has transferred its Memory Variability Aware Modeling tool to Samsung Electronics. The...</description>
		</item>
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			<title>Dual-Track Sokudo Duo Boosts Throughput</title>
			<link>http://www.semiconductor.net/article/209624-Dual_Track_Sokudo_Duo_Boosts_Throughput.php?rssid=20224</link>
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			<pubDate>Tue, 21 Apr 2009 13:16:00 GMT</pubDate>
			<description>Sokudo announced a dual-track system, the Sokudo Duo, aimed at boosting throughput of the coat,...</description>
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			<title>Asyst Files for Chapter 11 Bankruptcy</title>
			<link>http://www.semiconductor.net/article/209605-Asyst_Files_for_Chapter_11_Bankruptcy.php?rssid=20224</link>
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			<pubDate>Mon, 20 Apr 2009 16:25:00 GMT</pubDate>
			<description>Asyst Technologies Inc. announced this morning that it expects to file for Chapter 11 bankruptcy...</description>
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			<title>Imprint Rides Photonic Crystal Wave</title>
			<link>http://www.semiconductor.net/article/209833-Imprint_Rides_Photonic_Crystal_Wave.php?rssid=20224</link>
			<guid isPermaLink="true">http://www.semiconductor.net/article/209833-Imprint_Rides_Photonic_Crystal_Wave.php?rssid=20224</guid>
			<pubDate>Mon, 20 Apr 2009 14:27:00 GMT</pubDate>
			<description>Light-emitting diodes (LEDs) may gain efficiencies by using photonic crystals defined by imprint...</description>
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			<title>Most Viewed Stories for the Week of April 13, 2009</title>
			<link>http://www.semiconductor.net/article/209606-Most_Viewed_Stories_for_the_Week_of_April_13_2009.php?rssid=20224</link>
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			<pubDate>Fri, 17 Apr 2009 13:58:00 GMT</pubDate>
			<description>Variety marks our Top 5 list for this week. Readers looked at stories about reliability measures...</description>
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			<title>IBM Alliance Ready With 28 nm Eval Kits</title>
			<link>http://www.semiconductor.net/article/200711-IBM_Alliance_Ready_With_28_nm_Eval_Kits.php?rssid=20224</link>
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			<pubDate>Thu, 16 Apr 2009 16:07:00 GMT</pubDate>
			<description>The IBM-led alliance said the evaluation kits for its 28 nm technology are now available, with...</description>
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			<title>ASML Expects Demand Collapse to Turn Around in Second Half</title>
			<link>http://www.semiconductor.net/article/197886-ASML_Expects_Demand_Collapse_to_Turn_Around_in_Second_Half.php?rssid=20224</link>
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			<pubDate>Wed, 15 Apr 2009 16:37:00 GMT</pubDate>
			<description>The first quarter saw the lithography tool manufacturer’s sales plummet 80% year over year,...</description>
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			<title>IDMs, Fabless Face Reliability Challenges</title>
			<link>http://www.semiconductor.net/article/204669-IDMs_Fabless_Face_Reliability_Challenges.php?rssid=20224</link>
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			<pubDate>Wed, 15 Apr 2009 15:23:00 GMT</pubDate>
			<description>Managers from Broadcom, Intel and Xilinx are among the invited speakers at the upcoming...</description>
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			<title>Asyst Receives Default Letter From KeyBank</title>
			<link>http://www.semiconductor.net/article/207131-Asyst_Receives_Default_Letter_From_KeyBank.php?rssid=20224</link>
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			<pubDate>Wed, 15 Apr 2009 12:06:00 GMT</pubDate>
			<description>Asyst Technologies Inc. reported to the SEC that it received a default letter from KeyBank...</description>
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			<title>Sp3 Diamond Revs SOD Wafer Production</title>
			<link>http://www.semiconductor.net/article/206336-Sp3_Diamond_Revs_SOD_Wafer_Production.php?rssid=20224</link>
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			<pubDate>Tue, 14 Apr 2009 16:02:00 GMT</pubDate>
			<description>Sp3 Diamond Technologies is producing 2 and 4 in. silicon-on-diamond (SOD) wafers for production...</description>
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			<title>Inlustra Starts Nonpolar GaN Production</title>
			<link>http://www.semiconductor.net/article/198545-Inlustra_Starts_Nonpolar_GaN_Production.php?rssid=20224</link>
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			<pubDate>Tue, 14 Apr 2009 14:51:00 GMT</pubDate>
			<description>Inlustra said it is beginning to deliver nonpolar GaN substrates to customers. Started in 2005...</description>
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			<title>Gartner’s Final Tally: 2008 Equipment Spending Down 31.7%</title>
			<link>http://www.semiconductor.net/article/196788-Gartner_s_Final_Tally_2008_Equipment_Spending_Down_31_7_.php?rssid=20224</link>
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			<pubDate>Mon, 13 Apr 2009 16:28:00 GMT</pubDate>
			<description>Gartner Inc. said its final results for worldwide semiconductor capital equipment spending are...</description>
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