<?xml version="1.0" encoding="UTF-8"?>
<?xml-stylesheet type="text/xsl" media="screen" href="/~d/styles/rss2full.xsl"?><?xml-stylesheet type="text/css" media="screen" href="http://feeds.feedburner.com/~d/styles/itemcontent.css"?><rss xmlns:atom="http://www.w3.org/2005/Atom" version="2.0">
	<channel>
		<title>Semiconductor International - Perspectives From the Leading Edge</title>
		<link>http://www.semiconductor.net</link>
		<pubDate>Sun, 08 Nov 2009 19:07:07 MST</pubDate>
		<description />
		<language>eng</language>
		<copyright>Copyright 2009 Reed Business Information. Subject to its Terms of Use (http://www.semiconductor.net/info/terms-and-conditions.php)</copyright>
		


										<atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="self" href="http://feeds.feedburner.com/PerspectivesFromTheLeadingEdge" type="application/rss+xml" /><atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="hub" href="http://pubsubhubbub.appspot.com" /><item>
			<title>Taiwanese Focus on 3D IC</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/25466-Taiwanese_Focus_on_3D_IC.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/25466-Taiwanese_Focus_on_3D_IC.php?rssid=20238</guid>
			<pubDate>Fri, 06 Nov 2009 21:59:18 GMT</pubDate>
			<description />
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			<title>3D IC From the Land of the Rising Sun</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/24844-3D_IC_From_the_Land_of_the_Rising_Sun.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/24844-3D_IC_From_the_Land_of_the_Rising_Sun.php?rssid=20238</guid>
			<pubDate>Fri, 30 Oct 2009 16:09:07 GMT</pubDate>
			<description />
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										<item>
			<title>Show me the Copper !</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/24666-Show_me_the_Copper_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/24666-Show_me_the_Copper_.php?rssid=20238</guid>
			<pubDate>Fri, 23 Oct 2009 14:44:10 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>The 4 Horsemen of 3D IC</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23860-The_4_Horsemen_of_3D_IC.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23860-The_4_Horsemen_of_3D_IC.php?rssid=20238</guid>
			<pubDate>Fri, 16 Oct 2009 17:27:36 GMT</pubDate>
			<description />
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										<item>
			<title>Optimism vs Reality ; Semantics or Lost  in Translation ??</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23730-Optimism_vs_Reality_Semantics_or_Lost_in_Translation_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23730-Optimism_vs_Reality_Semantics_or_Lost_in_Translation_.php?rssid=20238</guid>
			<pubDate>Sun, 11 Oct 2009 15:16:09 GMT</pubDate>
			<description />
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										<item>
			<title>3D IC in the City by the Bay</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23645-3D_IC_in_the_City_by_the_Bay.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23645-3D_IC_in_the_City_by_the_Bay.php?rssid=20238</guid>
			<pubDate>Wed, 07 Oct 2009 14:54:35 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>3D IC at ITRI</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23392-3D_IC_at_ITRI.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23392-3D_IC_at_ITRI.php?rssid=20238</guid>
			<pubDate>Thu, 24 Sep 2009 23:02:58 GMT</pubDate>
			<description />
		</item>
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			<title>TSMC Confirms 3D Intent / Singapore Launches 3D IC Consortium</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23232-TSMC_Confirms_3D_Intent_Singapore_Launches_3D_IC_Consortium.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23232-TSMC_Confirms_3D_Intent_Singapore_Launches_3D_IC_Consortium.php?rssid=20238</guid>
			<pubDate>Fri, 18 Sep 2009 11:25:26 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Ginkgo Biloba</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23085-Ginkgo_Biloba.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/23085-Ginkgo_Biloba.php?rssid=20238</guid>
			<pubDate>Sat, 12 Sep 2009 18:02:30 GMT</pubDate>
			<description />
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			<title>Suss Microtec Thin Wafer Processing 3D IC Workshop</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/22642-Suss_Microtec_Thin_Wafer_Processing_3D_IC_Workshop.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/22642-Suss_Microtec_Thin_Wafer_Processing_3D_IC_Workshop.php?rssid=20238</guid>
			<pubDate>Sat, 05 Sep 2009 18:28:02 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>IEEE International Conference on 3D System Integration (3D IC )</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/22551-IEEE_International_Conference_on_3D_System_Integration_3D_IC_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/22551-IEEE_International_Conference_on_3D_System_Integration_3D_IC_.php?rssid=20238</guid>
			<pubDate>Tue, 01 Sep 2009 15:13:14 GMT</pubDate>
			<description />
		</item>
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			<title>3D IC at IME Singapore</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/21381-3D_IC_at_IME_Singapore.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/21381-3D_IC_at_IME_Singapore.php?rssid=20238</guid>
			<pubDate>Wed, 26 Aug 2009 20:43:44 GMT</pubDate>
			<description />
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			<title>Semicon TechXPOTs</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/21326-Semicon_TechXPOTs.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/21326-Semicon_TechXPOTs.php?rssid=20238</guid>
			<pubDate>Sat, 22 Aug 2009 20:26:45 GMT</pubDate>
			<description />
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										<item>
			<title>EVG, EMC3D - More 3D IC News from Semicon 2009</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/20894-EVG_EMC3D_More_3D_IC_News_from_Semicon_2009.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/20894-EVG_EMC3D_More_3D_IC_News_from_Semicon_2009.php?rssid=20238</guid>
			<pubDate>Fri, 14 Aug 2009 17:25:13 GMT</pubDate>
			<description />
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										<item>
			<title>Quotes from the Summit</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/20771-Quotes_from_the_Summit.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/20771-Quotes_from_the_Summit.php?rssid=20238</guid>
			<pubDate>Sun, 09 Aug 2009 18:01:00 GMT</pubDate>
			<description />
		</item>
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			<title>MCA Delivers 3D Brightspot at Semicon</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/20668-MCA_Delivers_3D_Brightspot_at_Semicon.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/20668-MCA_Delivers_3D_Brightspot_at_Semicon.php?rssid=20238</guid>
			<pubDate>Fri, 31 Jul 2009 16:44:33 GMT</pubDate>
			<description />
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			<title>The French Connection</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/19652-The_French_Connection.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/19652-The_French_Connection.php?rssid=20238</guid>
			<pubDate>Sun, 26 Jul 2009 14:37:07 GMT</pubDate>
			<description />
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			<title>IBM’s Meyerson -  3D IC Interview in Nikkei Micro</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/19612-IBM_s_Meyerson_3D_IC_Interview_in_Nikkei_Micro.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/19612-IBM_s_Meyerson_3D_IC_Interview_in_Nikkei_Micro.php?rssid=20238</guid>
			<pubDate>Thu, 23 Jul 2009 22:12:45 GMT</pubDate>
			<description />
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			<title>NEC points to  Nickel for Memory 3D TSV</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/19521-NEC_points_to_Nickel_for_Memory_3D_TSV.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/19521-NEC_points_to_Nickel_for_Memory_3D_TSV.php?rssid=20238</guid>
			<pubDate>Sun, 19 Jul 2009 15:43:21 GMT</pubDate>
			<description />
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			<title>Advanced Packaging From Rimini</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/18717-Advanced_Packaging_From_Rimini.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/18717-Advanced_Packaging_From_Rimini.php?rssid=20238</guid>
			<pubDate>Sun, 12 Jul 2009 21:42:06 GMT</pubDate>
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			<title>From the home of Fellini – 3D IC Integration Technology</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/18692-From_the_home_of_Fellini_3D_IC_Integration_Technology.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/18692-From_the_home_of_Fellini_3D_IC_Integration_Technology.php?rssid=20238</guid>
			<pubDate>Thu, 09 Jul 2009 23:52:35 GMT</pubDate>
			<description />
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			<title>ESI Acquires XSil IP and Assets</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/18606-ESI_Acquires_XSil_IP_and_Assets.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/18606-ESI_Acquires_XSil_IP_and_Assets.php?rssid=20238</guid>
			<pubDate>Thu, 02 Jul 2009 22:47:33 GMT</pubDate>
			<description />
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			<title>The European Microelectronics &amp; Packaging Conf   (EMPC)</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/17427-The_European_Microelectronics_Packaging_Conf_EMPC_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/17427-The_European_Microelectronics_Packaging_Conf_EMPC_.php?rssid=20238</guid>
			<pubDate>Mon, 29 Jun 2009 20:08:36 GMT</pubDate>
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			<title>SUSS MicroTec  Bonders for Temporary and Permanent 3D Bonding Solutions</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/17348-SUSS_MicroTec_Bonders_for_Temporary_and_Permanent_3D_Bonding_Solutions.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/17348-SUSS_MicroTec_Bonders_for_Temporary_and_Permanent_3D_Bonding_Solutions.php?rssid=20238</guid>
			<pubDate>Wed, 24 Jun 2009 22:23:20 GMT</pubDate>
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			<title>Start Ups with a Future</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/17297-Start_Ups_with_a_Future.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/17297-Start_Ups_with_a_Future.php?rssid=20238</guid>
			<pubDate>Sat, 20 Jun 2009 21:47:54 GMT</pubDate>
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			<title>3D IC at the 2009 ECTC</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15406-3D_IC_at_the_2009_ECTC.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15406-3D_IC_at_the_2009_ECTC.php?rssid=20238</guid>
			<pubDate>Wed, 10 Jun 2009 13:45:53 GMT</pubDate>
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			<title>Experience or Prejudice? The Case for Silicon Interposers</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15385-Experience_or_Prejudice_The_Case_for_Silicon_Interposers.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15385-Experience_or_Prejudice_The_Case_for_Silicon_Interposers.php?rssid=20238</guid>
			<pubDate>Sat, 06 Jun 2009 16:55:44 GMT</pubDate>
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			<title>ECTC 2009 San Diego</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15341-ECTC_2009_San_Diego.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15341-ECTC_2009_San_Diego.php?rssid=20238</guid>
			<pubDate>Tue, 02 Jun 2009 17:44:00 GMT</pubDate>
			<description />
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			<title>Temporary Bonding for 3-D IC Thinning and Backside Processing</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15333-Temporary_Bonding_for_3_D_IC_Thinning_and_Backside_Processing.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15333-Temporary_Bonding_for_3_D_IC_Thinning_and_Backside_Processing.php?rssid=20238</guid>
			<pubDate>Sun, 24 May 2009 13:33:00 GMT</pubDate>
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			<title>NXP Sells Off PICS Passive Integration</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15337-NXP_Sells_Off_PICS_Passive_Integration.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15337-NXP_Sells_Off_PICS_Passive_Integration.php?rssid=20238</guid>
			<pubDate>Sun, 17 May 2009 09:37:00 GMT</pubDate>
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			<title>Nice DATE</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15335-Nice_DATE.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15335-Nice_DATE.php?rssid=20238</guid>
			<pubDate>Sat, 09 May 2009 06:51:00 GMT</pubDate>
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			<title>All Silicon System Integration Dresden (ASSID) – A 300 mm 3-D IC Line for Germany</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15528-All_Silicon_System_Integration_Dresden_ASSID_A_300_mm_3_D_IC_Line_for_Germany.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15528-All_Silicon_System_Integration_Dresden_ASSID_A_300_mm_3_D_IC_Line_for_Germany.php?rssid=20238</guid>
			<pubDate>Thu, 30 Apr 2009 11:39:00 GMT</pubDate>
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			<title>TSMC Reconfirms Plans for Fab-Based TSV</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15529-TSMC_Reconfirms_Plans_for_Fab_Based_TSV.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/15529-TSMC_Reconfirms_Plans_for_Fab_Based_TSV.php?rssid=20238</guid>
			<pubDate>Sat, 25 Apr 2009 13:24:00 GMT</pubDate>
			<description />
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			<title>Samsung 3-D 'Roadmap' That Isn't</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12487-Samsung_3_D_Roadmap_That_Isn_t.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12487-Samsung_3_D_Roadmap_That_Isn_t.php?rssid=20238</guid>
			<pubDate>Thu, 16 Apr 2009 11:15:00 GMT</pubDate>
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			<title>3-D Infrastructure as Seen by the IMAPS Global Business Council</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12485-3_D_Infrastructure_as_Seen_by_the_IMAPS_Global_Business_Council.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12485-3_D_Infrastructure_as_Seen_by_the_IMAPS_Global_Business_Council.php?rssid=20238</guid>
			<pubDate>Sun, 12 Apr 2009 09:22:00 GMT</pubDate>
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			<title>Deep in the Heart of Texas</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12486-Deep_in_the_Heart_of_Texas.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12486-Deep_in_the_Heart_of_Texas.php?rssid=20238</guid>
			<pubDate>Sat, 04 Apr 2009 11:57:00 GMT</pubDate>
			<description />
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			<title>3D IC Practitioners Assemble at Ft. McDowell</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12484-3D_IC_Practitioners_Assemble_at_Ft_McDowell.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12484-3D_IC_Practitioners_Assemble_at_Ft_McDowell.php?rssid=20238</guid>
			<pubDate>Tue, 24 Mar 2009 12:35:00 GMT</pubDate>
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										<item>
			<title>Like Swallows Returning to San Juan Capistrano</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12492-Like_Swallows_Returning_to_San_Juan_Capistrano.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12492-Like_Swallows_Returning_to_San_Juan_Capistrano.php?rssid=20238</guid>
			<pubDate>Fri, 20 Mar 2009 09:46:00 GMT</pubDate>
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			<title>IC Insights Predicts Fast Industry Rebound at IMAPS Global Business Council</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12489-IC_Insights_Predicts_Fast_Industry_Rebound_at_IMAPS_Global_Business_Council.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12489-IC_Insights_Predicts_Fast_Industry_Rebound_at_IMAPS_Global_Business_Council.php?rssid=20238</guid>
			<pubDate>Sun, 15 Mar 2009 10:18:00 GMT</pubDate>
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			<title>Memories</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12482-Memories.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12482-Memories.php?rssid=20238</guid>
			<pubDate>Thu, 05 Mar 2009 15:09:00 GMT</pubDate>
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			<title>3D IC at the 2009 ISSCC contd.</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12499-3D_IC_at_the_2009_ISSCC_contd_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12499-3D_IC_at_the_2009_ISSCC_contd_.php?rssid=20238</guid>
			<pubDate>Wed, 25 Feb 2009 09:34:00 GMT</pubDate>
			<description />
		</item>
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			<title>3D IC Integration at the 2009 IEEE ISSCC</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12491-3D_IC_Integration_at_the_2009_IEEE_ISSCC.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12491-3D_IC_Integration_at_the_2009_IEEE_ISSCC.php?rssid=20238</guid>
			<pubDate>Fri, 20 Feb 2009 08:06:00 GMT</pubDate>
			<description />
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										<item>
			<title>Baseball, Hotdogs, Apple pie and Layoffs</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12544-Baseball_Hotdogs_Apple_pie_and_Layoffs.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12544-Baseball_Hotdogs_Apple_pie_and_Layoffs.php?rssid=20238</guid>
			<pubDate>Sun, 08 Feb 2009 07:21:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Tezzaron announces 3D IC Multi Project Wafer Program</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12483-Tezzaron_announces_3D_IC_Multi_Project_Wafer_Program.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12483-Tezzaron_announces_3D_IC_Multi_Project_Wafer_Program.php?rssid=20238</guid>
			<pubDate>Mon, 02 Feb 2009 10:31:00 GMT</pubDate>
			<description />
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										<item>
			<title>Replisaurus moving forward despite harsh economic environment</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12543-Replisaurus_moving_forward_despite_harsh_economic_environment.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12543-Replisaurus_moving_forward_despite_harsh_economic_environment.php?rssid=20238</guid>
			<pubDate>Mon, 26 Jan 2009 08:08:00 GMT</pubDate>
			<description />
		</item>
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			<title>RHEM's Linehan "significant 3D traction coming in 2012-2013"</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12495-RHEM_s_Linehan_significant_3D_traction_coming_in_2012_2013_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12495-RHEM_s_Linehan_significant_3D_traction_coming_in_2012_2013_.php?rssid=20238</guid>
			<pubDate>Thu, 15 Jan 2009 08:26:00 GMT</pubDate>
			<description />
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			<title>3D Integration Highlights of the 2008 MRS contd.</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12496-3D_Integration_Highlights_of_the_2008_MRS_contd_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12496-3D_Integration_Highlights_of_the_2008_MRS_contd_.php?rssid=20238</guid>
			<pubDate>Thu, 08 Jan 2009 11:36:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Fisk, Buckner and Pasta on the North End</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12501-Fisk_Buckner_and_Pasta_on_the_North_End.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12501-Fisk_Buckner_and_Pasta_on_the_North_End.php?rssid=20238</guid>
			<pubDate>Wed, 31 Dec 2008 16:19:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Toshiba CIS Camera Module Details &amp; EVG and 3M Settle</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12497-Toshiba_CIS_Camera_Module_Details_EVG_and_3M_Settle.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12497-Toshiba_CIS_Camera_Module_Details_EVG_and_3M_Settle.php?rssid=20238</guid>
			<pubDate>Mon, 22 Dec 2008 10:57:00 GMT</pubDate>
			<description />
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			<title>Applied on 3D,  256 Gb Samsung SSDs and a  Semprius / CDT joint development program</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12535-Applied_on_3D_256_Gb_Samsung_SSDs_and_a_Semprius_CDT_joint_development_program.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12535-Applied_on_3D_256_Gb_Samsung_SSDs_and_a_Semprius_CDT_joint_development_program.php?rssid=20238</guid>
			<pubDate>Wed, 17 Dec 2008 08:45:00 GMT</pubDate>
			<description />
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										<item>
			<title>Best of the Rest at 3D ASIP</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12534-Best_of_the_Rest_at_3D_ASIP.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12534-Best_of_the_Rest_at_3D_ASIP.php?rssid=20238</guid>
			<pubDate>Thu, 04 Dec 2008 11:24:00 GMT</pubDate>
			<description />
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										<item>
			<title>Highlights of 3D ASIP</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12533-Highlights_of_3D_ASIP.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12533-Highlights_of_3D_ASIP.php?rssid=20238</guid>
			<pubDate>Sat, 29 Nov 2008 08:35:00 GMT</pubDate>
			<description />
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										<item>
			<title>You Can't Always Get What You Want....</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12490-You_Can_t_Always_Get_What_You_Want_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12490-You_Can_t_Always_Get_What_You_Want_.php?rssid=20238</guid>
			<pubDate>Mon, 24 Nov 2008 13:42:00 GMT</pubDate>
			<description />
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			<title>3D IC at the WLP Conference</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12488-3D_IC_at_the_WLP_Conference.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12488-3D_IC_at_the_WLP_Conference.php?rssid=20238</guid>
			<pubDate>Mon, 17 Nov 2008 07:16:00 GMT</pubDate>
			<description />
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										<item>
			<title>3D Global  Meeting next  week in San Francisco</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12537-3D_Global_Meeting_next_week_in_San_Francisco.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12537-3D_Global_Meeting_next_week_in_San_Francisco.php?rssid=20238</guid>
			<pubDate>Tue, 11 Nov 2008 11:49:00 GMT</pubDate>
			<description />
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			<title>TSMC Roadmap, DRAM Timing and Sematech Highlights</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12493-TSMC_Roadmap_DRAM_Timing_and_Sematech_Highlights.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12493-TSMC_Roadmap_DRAM_Timing_and_Sematech_Highlights.php?rssid=20238</guid>
			<pubDate>Mon, 27 Oct 2008 12:06:00 GMT</pubDate>
			<description />
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			<title>Memory market headed South ...Will SSD's lead the recovery?</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12551-Memory_market_headed_South_Will_SSD_s_lead_the_recovery_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12551-Memory_market_headed_South_Will_SSD_s_lead_the_recovery_.php?rssid=20238</guid>
			<pubDate>Sun, 19 Oct 2008 12:35:00 GMT</pubDate>
			<description />
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			<title>Opening the Kimono, Ziptronix gives details on DBI Process</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12506-Opening_the_Kimono_Ziptronix_gives_details_on_DBI_Process.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12506-Opening_the_Kimono_Ziptronix_gives_details_on_DBI_Process.php?rssid=20238</guid>
			<pubDate>Mon, 13 Oct 2008 20:06:00 GMT</pubDate>
			<description />
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			<title>3D IC Questions and Answers with the EMC-3D Consortium</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12504-3D_IC_Questions_and_Answers_with_the_EMC_3D_Consortium.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12504-3D_IC_Questions_and_Answers_with_the_EMC_3D_Consortium.php?rssid=20238</guid>
			<pubDate>Sun, 05 Oct 2008 12:16:00 GMT</pubDate>
			<description />
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										<item>
			<title>....on Mechanical Bulls, Rollercoasters and CIS with TSV</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12505-_on_Mechanical_Bulls_Rollercoasters_and_CIS_with_TSV.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12505-_on_Mechanical_Bulls_Rollercoasters_and_CIS_with_TSV.php?rssid=20238</guid>
			<pubDate>Fri, 26 Sep 2008 08:21:00 GMT</pubDate>
			<description />
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										<item>
			<title>It Depends on What the Meaning of Is, Is</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12546-It_Depends_on_What_the_Meaning_of_Is_Is.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12546-It_Depends_on_What_the_Meaning_of_Is_Is.php?rssid=20238</guid>
			<pubDate>Tue, 16 Sep 2008 16:23:00 GMT</pubDate>
			<description />
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			<title>Upcoming 3D Integration events &amp; Issues with the ITRS 3D Roadmaps</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12545-Upcoming_3D_Integration_events_Issues_with_the_ITRS_3D_Roadmaps.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12545-Upcoming_3D_Integration_events_Issues_with_the_ITRS_3D_Roadmaps.php?rssid=20238</guid>
			<pubDate>Thu, 11 Sep 2008 11:33:00 GMT</pubDate>
			<description />
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			<title>Keepin' it Cool in the Dog Days of Summer</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12532-Keepin_it_Cool_in_the_Dog_Days_of_Summer.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12532-Keepin_it_Cool_in_the_Dog_Days_of_Summer.php?rssid=20238</guid>
			<pubDate>Mon, 01 Sep 2008 08:50:00 GMT</pubDate>
			<description />
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			<title>3D Integration – Sources of  Information -  Update</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12500-3D_Integration_Sources_of_Information_Update.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12500-3D_Integration_Sources_of_Information_Update.php?rssid=20238</guid>
			<pubDate>Fri, 22 Aug 2008 11:39:00 GMT</pubDate>
			<description />
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			<title>3D Integration Stays HOT at Semicon West</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12494-3D_Integration_Stays_HOT_at_Semicon_West.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12494-3D_Integration_Stays_HOT_at_Semicon_West.php?rssid=20238</guid>
			<pubDate>Wed, 13 Aug 2008 11:48:00 GMT</pubDate>
			<description />
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			<title>Backside Illumination (BSI) Architecture next for CMOS Image Sensors</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12503-Backside_Illumination_BSI_Architecture_next_for_CMOS_Image_Sensors.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12503-Backside_Illumination_BSI_Architecture_next_for_CMOS_Image_Sensors.php?rssid=20238</guid>
			<pubDate>Sun, 03 Aug 2008 10:14:00 GMT</pubDate>
			<description />
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			<title>Recent 3D IC Integration Activity</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12502-Recent_3D_IC_Integration_Activity.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12502-Recent_3D_IC_Integration_Activity.php?rssid=20238</guid>
			<pubDate>Sun, 27 Jul 2008 10:04:00 GMT</pubDate>
			<description />
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			<title>Intel 45 nm Processor Technology for Mobile Products</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12498-Intel_45_nm_Processor_Technology_for_Mobile_Products.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12498-Intel_45_nm_Processor_Technology_for_Mobile_Products.php?rssid=20238</guid>
			<pubDate>Wed, 16 Jul 2008 13:25:00 GMT</pubDate>
			<description />
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			<title>IITC on the 3D Integration Bandwagon</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12523-IITC_on_the_3D_Integration_Bandwagon.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12523-IITC_on_the_3D_Integration_Bandwagon.php?rssid=20238</guid>
			<pubDate>Mon, 07 Jul 2008 07:56:00 GMT</pubDate>
			<description />
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			<title>More 3D Integration at ECTC 2008</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12512-More_3D_Integration_at_ECTC_2008.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12512-More_3D_Integration_at_ECTC_2008.php?rssid=20238</guid>
			<pubDate>Sat, 28 Jun 2008 12:10:00 GMT</pubDate>
			<description />
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			<title>ASET drives 3D Integration workshop in Tokyo</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12525-ASET_drives_3D_Integration_workshop_in_Tokyo.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12525-ASET_drives_3D_Integration_workshop_in_Tokyo.php?rssid=20238</guid>
			<pubDate>Sat, 21 Jun 2008 12:16:00 GMT</pubDate>
			<description />
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										<item>
			<title>.......If it's Thursday it must be San Jose</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12508-_If_it_s_Thursday_it_must_be_San_Jose.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12508-_If_it_s_Thursday_it_must_be_San_Jose.php?rssid=20238</guid>
			<pubDate>Sun, 08 Jun 2008 09:20:00 GMT</pubDate>
			<description />
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										<item>
			<title>3D Road Tour contd</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12507-3D_Road_Tour_contd.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12507-3D_Road_Tour_contd.php?rssid=20238</guid>
			<pubDate>Wed, 28 May 2008 15:17:00 GMT</pubDate>
			<description />
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										<item>
			<title>Road Trip Revelations</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12553-Road_Trip_Revelations.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12553-Road_Trip_Revelations.php?rssid=20238</guid>
			<pubDate>Sun, 18 May 2008 13:18:00 GMT</pubDate>
			<description />
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			<title>SMTA 3D Meeting in Research Triangle PArk</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12531-SMTA_3D_Meeting_in_Research_Triangle_PArk.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12531-SMTA_3D_Meeting_in_Research_Triangle_PArk.php?rssid=20238</guid>
			<pubDate>Sat, 10 May 2008 09:55:00 GMT</pubDate>
			<description />
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			<title>Foundry TSVs are a comin' - TSMC makes their play for a bigger portion of the pie</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12538-Foundry_TSVs_are_a_comin_TSMC_makes_their_play_for_a_bigger_portion_of_the_pie.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12538-Foundry_TSVs_are_a_comin_TSMC_makes_their_play_for_a_bigger_portion_of_the_pie.php?rssid=20238</guid>
			<pubDate>Fri, 02 May 2008 09:30:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>COSMOS</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12548-COSMOS.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12548-COSMOS.php?rssid=20238</guid>
			<pubDate>Sat, 19 Apr 2008 12:17:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>NXP Proposes Passive Integration in 3D IC Stacks</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12511-NXP_Proposes_Passive_Integration_in_3D_IC_Stacks.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12511-NXP_Proposes_Passive_Integration_in_3D_IC_Stacks.php?rssid=20238</guid>
			<pubDate>Sun, 13 Apr 2008 09:53:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>More 3D IC Integration from Ft McDowell</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12540-More_3D_IC_Integration_from_Ft_McDowell.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12540-More_3D_IC_Integration_from_Ft_McDowell.php?rssid=20238</guid>
			<pubDate>Sun, 30 Mar 2008 12:41:00 GMT</pubDate>
			<description />
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										<item>
			<title>3D Practitioners Assemble at Ft McDowell</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12547-3D_Practitioners_Assemble_at_Ft_McDowell.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12547-3D_Practitioners_Assemble_at_Ft_McDowell.php?rssid=20238</guid>
			<pubDate>Sun, 23 Mar 2008 12:54:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>3D IC Integration : Evolution or Revolution ?</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12526-3D_IC_Integration_Evolution_or_Revolution_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12526-3D_IC_Integration_Evolution_or_Revolution_.php?rssid=20238</guid>
			<pubDate>Sun, 16 Mar 2008 20:28:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>ST Micro announces more CMOS Image Sensor Packaging Capacity with TSV</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12517-ST_Micro_announces_more_CMOS_Image_Sensor_Packaging_Capacity_with_TSV.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12517-ST_Micro_announces_more_CMOS_Image_Sensor_Packaging_Capacity_with_TSV.php?rssid=20238</guid>
			<pubDate>Wed, 05 Mar 2008 07:09:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>IMEC arrives in Hsinchu and other 3D IC News</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12516-IMEC_arrives_in_Hsinchu_and_other_3D_IC_News.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12516-IMEC_arrives_in_Hsinchu_and_other_3D_IC_News.php?rssid=20238</guid>
			<pubDate>Tue, 26 Feb 2008 11:21:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>High Throughput Laser Drilling for 3D IC TSV</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12519-High_Throughput_Laser_Drilling_for_3D_IC_TSV.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12519-High_Throughput_Laser_Drilling_for_3D_IC_TSV.php?rssid=20238</guid>
			<pubDate>Sun, 17 Feb 2008 10:32:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>3D IC Integration: Rumors and Ruminations</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12536-3D_IC_Integration_Rumors_and_Ruminations.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12536-3D_IC_Integration_Rumors_and_Ruminations.php?rssid=20238</guid>
			<pubDate>Fri, 08 Feb 2008 12:12:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>EVG discusses status of 3D Integration</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12524-EVG_discusses_status_of_3D_Integration.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12524-EVG_discusses_status_of_3D_Integration.php?rssid=20238</guid>
			<pubDate>Sun, 20 Jan 2008 09:51:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Semprius</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12521-Semprius.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12521-Semprius.php?rssid=20238</guid>
			<pubDate>Wed, 16 Jan 2008 06:30:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>ECPR for short</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12528-ECPR_for_short.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12528-ECPR_for_short.php?rssid=20238</guid>
			<pubDate>Sun, 06 Jan 2008 07:24:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>October in Munich</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12514-October_in_Munich.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12514-October_in_Munich.php?rssid=20238</guid>
			<pubDate>Sun, 16 Dec 2007 12:41:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>More TSV commercial capacity on line.....</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12513-More_TSV_commercial_capacity_on_line_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12513-More_TSV_commercial_capacity_on_line_.php?rssid=20238</guid>
			<pubDate>Wed, 05 Dec 2007 07:55:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>A Rose by any other name is not 3D IC Integration</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12509-A_Rose_by_any_other_name_is_not_3D_IC_Integration.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12509-A_Rose_by_any_other_name_is_not_3D_IC_Integration.php?rssid=20238</guid>
			<pubDate>Tue, 20 Nov 2007 07:42:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>3D discussions in the valley... continued</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12527-3D_discussions_in_the_valley_continued.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12527-3D_discussions_in_the_valley_continued.php?rssid=20238</guid>
			<pubDate>Sun, 04 Nov 2007 09:33:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>50$ 3D bonding coming ??; Intel announces "...we are ready"</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12549-50_3D_bonding_coming_Intel_announces_we_are_ready_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12549-50_3D_bonding_coming_Intel_announces_we_are_ready_.php?rssid=20238</guid>
			<pubDate>Mon, 29 Oct 2007 15:05:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Imaging chips with TSV announced for commercialization</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12510-Imaging_chips_with_TSV_announced_for_commercialization.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12510-Imaging_chips_with_TSV_announced_for_commercialization.php?rssid=20238</guid>
			<pubDate>Sat, 27 Oct 2007 08:48:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>SEMATECH arrives in Albany with 3D Integration program...contd</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12522-SEMATECH_arrives_in_Albany_with_3D_Integration_program_contd.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12522-SEMATECH_arrives_in_Albany_with_3D_Integration_program_contd.php?rssid=20238</guid>
			<pubDate>Mon, 15 Oct 2007 08:33:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>What is the capital of New York State ?</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12542-What_is_the_capital_of_New_York_State_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12542-What_is_the_capital_of_New_York_State_.php?rssid=20238</guid>
			<pubDate>Sun, 14 Oct 2007 20:03:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>WLP changes are now evolutionary</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12530-WLP_changes_are_now_evolutionary.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12530-WLP_changes_are_now_evolutionary.php?rssid=20238</guid>
			<pubDate>Mon, 08 Oct 2007 16:15:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Some things need repeating....</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12550-Some_things_need_repeating_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12550-Some_things_need_repeating_.php?rssid=20238</guid>
			<pubDate>Sat, 29 Sep 2007 13:13:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>In Boston its called Scrod</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12552-In_Boston_its_called_Scrod.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12552-In_Boston_its_called_Scrod.php?rssid=20238</guid>
			<pubDate>Mon, 17 Sep 2007 16:55:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Going Vertical in Whitefish</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12520-Going_Vertical_in_Whitefish.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12520-Going_Vertical_in_Whitefish.php?rssid=20238</guid>
			<pubDate>Sun, 09 Sep 2007 13:55:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>3D Integration invades Whitefish Montana</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12539-3D_Integration_invades_Whitefish_Montana.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12539-3D_Integration_invades_Whitefish_Montana.php?rssid=20238</guid>
			<pubDate>Fri, 07 Sep 2007 09:18:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>3D Equipment and Materials Vendors Consortium</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12529-3D_Equipment_and_Materials_Vendors_Consortium.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12529-3D_Equipment_and_Materials_Vendors_Consortium.php?rssid=20238</guid>
			<pubDate>Sun, 26 Aug 2007 13:16:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Time isn't on your side....</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12541-Time_isn_t_on_your_side_.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12541-Time_isn_t_on_your_side_.php?rssid=20238</guid>
			<pubDate>Sun, 12 Aug 2007 14:57:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>3D Integration - Sources</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12518-3D_Integration_Sources.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12518-3D_Integration_Sources.php?rssid=20238</guid>
			<pubDate>Sun, 05 Aug 2007 14:22:00 GMT</pubDate>
			<description />
		</item>
										<item>
			<title>Introduction</title>
			<link>http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12515-Introduction.php?rssid=20238</link>
			<guid isPermaLink="true">http://www.semiconductor.net/blog/Perspectives_From_the_Leading_Edge/12515-Introduction.php?rssid=20238</guid>
			<pubDate>Sat, 28 Jul 2007 13:06:00 GMT</pubDate>
			<description />
		</item>
	</channel>
</rss>
