tag:blogger.com,1999:blog-72444202372582151122024-09-02T06:17:35.678+07:00PCBA Rework Process InstructionMochita10http://www.blogger.com/profile/11680045413583331243noreply@blogger.comBlogger1125tag:blogger.com,1999:blog-7244420237258215112.post-7627963371277016852009-06-13T21:29:00.000+07:002009-06-14T13:21:47.787+07:00BGA rework process by SRT machine<span style="font-size:130%;"><b><u><span style="font-family:Tahoma;">
<br />Operating Instruction</span></u></b></span><p class="MsoNormal"><span style="font-size:78%;">
<br /></span><span style="font-size:78%;"><b><u><span style="font-family:Tahoma;"><o:p></o:p></span></u></b></span></p> <p class="MsoNormal"><span style="font-size:78%;"><b><span style="font-family:Tahoma;">1. BGA Removal process</span></b></span></p><p class="MsoNormal"><span style="font-size:78%;"><a onblur="try {parent.deselectBloggerImageGracefully();} catch(e) {}" href="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiURZRtXndSsegYMc6J4AygcuIO4ri87l3HGxuA6GLTrhECLxisQ1yUXKAjolLTyemNuTNJ_WFXVMy-L8ZIWz5RqnQBsoilTGXeOkBWCF69wd8PpxykekxSS6-cyNiMoblGqyt92GZChfU/s1600-h/BGA+Removal.jpg"><img style="cursor: pointer; width: 96px; height: 69px;" src="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiURZRtXndSsegYMc6J4AygcuIO4ri87l3HGxuA6GLTrhECLxisQ1yUXKAjolLTyemNuTNJ_WFXVMy-L8ZIWz5RqnQBsoilTGXeOkBWCF69wd8PpxykekxSS6-cyNiMoblGqyt92GZChfU/s200/BGA+Removal.jpg" alt="" id="BLOGGER_PHOTO_ID_5346830491154656530" border="0" /></a></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >1.1 Select Rework nozzle and Rework pallet and place on X-Y table of SRT machine in suitable direction.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >1.2 Take PCBA that failed at BGA location and already baked place into the rework pallet.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >1.3 Stick kapton tape (1 layer) at adjacent area around 4 sides to prevent solder splash and solder ball defect during site-dressing process in next step.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >1.4 Cover heat protection shield at adjacent component around 4 sides and/or stick kapton tape (2 Layer) for header component (or other component which can not use heat shield) to protect the site effect during rework.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >1.5 Attach the thermocouple with kapton tape (1 layer) on the PCB top side by distance 1 inch from BGA location.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >1.6 Adjust the height of nozzle over PCB surface about 2 mm.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >1.7 Select program for remove component by parameters setting in SRT machine.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >1.8 Click Go button to start removal process.</span></p><p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >
<br /></span></p><p class="MsoNormal"><meta equiv="Content-Type" content="text/html; charset=utf-8"><meta name="ProgId" content="Word.Document"><meta name="Generator" content="Microsoft Word 11"><meta name="Originator" content="Microsoft Word 11"><link rel="File-List" href="file:///C:%5CDOCUME%7E1%5CADMINI%7E1%5CLOCALS%7E1%5CTemp%5Cmsohtml1%5C01%5Cclip_filelist.xml"><!--[if gte mso 9]><xml> <w:worddocument> <w:view>Normal</w:View> <w:zoom>0</w:Zoom> <w:punctuationkerning/> <w:validateagainstschemas/> <w:saveifxmlinvalid>false</w:SaveIfXMLInvalid> <w:ignoremixedcontent>false</w:IgnoreMixedContent> <w:alwaysshowplaceholdertext>false</w:AlwaysShowPlaceholderText> <w:compatibility> <w:breakwrappedtables/> <w:snaptogridincell/> <w:applybreakingrules/> <w:wraptextwithpunct/> <w:useasianbreakrules/> <w:dontgrowautofit/> </w:Compatibility> <w:browserlevel>MicrosoftInternetExplorer4</w:BrowserLevel> </w:WordDocument> </xml><![endif]--><!--[if gte mso 9]><xml> <w:latentstyles deflockedstate="false" latentstylecount="156"> </w:LatentStyles> </xml><![endif]--><style> <!-- /* Font Definitions */ @font-face {font-family:"Angsana New"; panose-1:2 2 6 3 5 4 5 2 3 4; mso-font-charset:0; mso-generic-font-family:roman; mso-font-pitch:variable; mso-font-signature:16777219 0 0 0 65537 0;} @font-face {font-family:Tahoma; panose-1:2 11 6 4 3 5 4 4 2 4; mso-font-charset:0; mso-generic-font-family:swiss; mso-font-pitch:variable; mso-font-signature:1627421319 -2147483648 8 0 66047 0;} /* Style Definitions */ p.MsoNormal, li.MsoNormal, div.MsoNormal {mso-style-parent:""; margin:0cm; margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:12.0pt; mso-bidi-font-size:14.0pt; font-family:"Times New Roman"; mso-fareast-font-family:"Times New Roman"; mso-bidi-font-family:"Angsana New";} @page Section1 {size:595.3pt 841.9pt; margin:72.0pt 90.0pt 72.0pt 90.0pt; mso-header-margin:35.4pt; mso-footer-margin:35.4pt; mso-paper-source:0;} div.Section1 {page:Section1;} --> </style><!--[if gte mso 10]> <style> /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Table Normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:10.0pt; font-family:"Times New Roman"; mso-ansi-language:#0400; mso-fareast-language:#0400; mso-bidi-language:#0400;} </style> <![endif]--> </p><p class="MsoNormal"><span style="font-size:78%;"><b><span style="font-family:Tahoma;">2. Pad site-dressing & Visual Inspection</span></b></span></p><p class="MsoNormal"><span style="font-size:78%;"><a onblur="try {parent.deselectBloggerImageGracefully();} catch(e) {}" href="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEj6-N6aSXSjXfT0Vw5j6AI88m0JE9v5zjJ_0mCwPEuzrNYnRzPgWzMNXx1Y9PHmT6-2BqjbzH4nA6J3HAfyH-KG_7pJdSVQ15A66-DKuXJ3M4om_FGUfvyn2MygTrJ_ZkgO6xoyIsF-Fwk/s1600-h/Pad+site+dressing.jpg"><img style="cursor: pointer; width: 105px; height: 76px;" src="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEj6-N6aSXSjXfT0Vw5j6AI88m0JE9v5zjJ_0mCwPEuzrNYnRzPgWzMNXx1Y9PHmT6-2BqjbzH4nA6J3HAfyH-KG_7pJdSVQ15A66-DKuXJ3M4om_FGUfvyn2MygTrJ_ZkgO6xoyIsF-Fwk/s200/Pad+site+dressing.jpg" alt="" id="BLOGGER_PHOTO_ID_5346836640553187714" border="0" /></a>
<br /><b><span style="font-family:Tahoma;"><o:p></o:p></span></b></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >2.1 After BGA removal process, inspect pad damage by Microscope. (For big size board, must place the board into fixture before inspection).<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >2.2 Apply paste flux at all BGA pads.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >2.3 Site dress BGA pads row when board still hot.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >2.4 After pad site-dressing, inspect the criteria defect by Microscope 7X-40X<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" ><o:p>
<br /></o:p></span></p> <p class="MsoNormal"><span style="font-size:78%;"><b><span style="font-family:Tahoma;">3. Solder paste printing</span></b></span></p><p class="MsoNormal"><span style="font-size:78%;"><a onblur="try {parent.deselectBloggerImageGracefully();} catch(e) {}" href="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiLW6e0LBABzf7IOEpwTKhR1ECg8HAAS8NaiAyr-JeoyIo1DciXkeMq3FETMyEjLvLQIsNCtlBcy8IgSPp4zV6M2lJMZHT1sgj9wRoJsudPm543jq14rwQboSpaEAjeoSMNvfvrR6aKCm0/s1600-h/Solder+paste+printing.png"><img style="cursor: pointer; width: 104px; height: 78px;" src="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiLW6e0LBABzf7IOEpwTKhR1ECg8HAAS8NaiAyr-JeoyIo1DciXkeMq3FETMyEjLvLQIsNCtlBcy8IgSPp4zV6M2lJMZHT1sgj9wRoJsudPm543jq14rwQboSpaEAjeoSMNvfvrR6aKCm0/s200/Solder+paste+printing.png" alt="" id="BLOGGER_PHOTO_ID_5346836955900884466" border="0" /></a>
<br /></span><span style="font-size:78%;"><b><span style="font-family:Tahoma;"><o:p></o:p></span></b></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >3.1 Using specific mini stencil and alignment with BGA pad then fix mini stencil by using kapton tape (1 Layer).<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >3.2 Print the solder paste by take a small amount of solder paste by squeegee (not over½ of Squeegee) then apply on mini stencil.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >3.3 Remove kapton tape side by side and lift mini stencil.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >3.4 After printing solder paste, cleaning mini stencil by Ultrasonic machine.</span></p><p class="MsoNormal"><span style="font-size:78%;">
<br /></span><span style=";font-family:Tahoma;font-size:78%;" ><o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" ><o:p> </o:p></span></p> <p class="MsoNormal"><span style="font-size:78%;"><b><span style="font-family:Tahoma;">4. BGA replacement process by SRT machine</span></b></span></p><p class="MsoNormal"><span style="font-size:78%;"><a onblur="try {parent.deselectBloggerImageGracefully();} catch(e) {}" href="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgRqQTHymGWtVFGg0CiSkOLyeLF_ULk1vPOiUgMM29wj6oeRGfD3WDmlFuEIdUjWhqLqFu2wQ0-SWdtEAzSr-zp41PNaafEf4syuG0hqbM4wqvtNOYgkYOFJlZQVr-0YEqyumq6MbVm6wE/s1600-h/BGA+Replacement.jpg"><img style="cursor: pointer; width: 107px; height: 79px;" src="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgRqQTHymGWtVFGg0CiSkOLyeLF_ULk1vPOiUgMM29wj6oeRGfD3WDmlFuEIdUjWhqLqFu2wQ0-SWdtEAzSr-zp41PNaafEf4syuG0hqbM4wqvtNOYgkYOFJlZQVr-0YEqyumq6MbVm6wE/s200/BGA+Replacement.jpg" alt="" id="BLOGGER_PHOTO_ID_5346837349006199138" border="0" /></a>
<br /></span><span style="font-size:78%;"><b><span style="font-family:Tahoma;"><o:p></o:p></span></b></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >4.1 Select Rework nozzle and Rework pallet and place on X-Y table of SRT machine in suitable direction.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >4.2 Take board that already print solder paste place into rework pallet.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >4.3 Cover heat protection shield at adjacent components around 4 sides and/or stick<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >kapton tape (2 Layer) for header components (or other components which can not use heat shield) to protect the site effects.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >4.4 Attach the thermocouple with kapton tape (1 layer) on the PCB top side by distance 1 inch from BGA rework location.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >4.5 Adjust the height of nozzle over PCB surface about 2 mm. <o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >4.6 Select program for replace component by parameters setting in SRT machine.<o:p></o:p></span></p> <p class="MsoNormal"><span style=";font-family:Tahoma;font-size:78%;" >4.8 Click Go button to start BGA replacement process<o:p></o:p></span></p> <p class="MsoNormal"><span style="font-size:78%;">
<br /></span><span style=";font-family:Tahoma;font-size:78%;" ><o:p></o:p></span></p> <div class="blogger-post-footer">PCBA Rework Process Instruction</div>Mochita10http://www.blogger.com/profile/11680045413583331243noreply@blogger.com3