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		    <title>PatentStorm -&gt; Patents -&gt; Metal fusion bonding</title>
		    <link>http://www.patentstorm.us/rss/class/patents/rss-228.xml</link>
		    <description>Recent patents filings in USPTO Class 228 Metal fusion bonding.</description>
		    <pubDate>Tue, 21 May 2013 16:08:19</pubDate>
		    <managingEditor>patents@patentstorm.us</managingEditor>
		    <language>en</language><atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="self" type="application/rss+xml" href="http://feeds.feedburner.com/Patentstorm-Patents-MetalFusionBonding" /><feedburner:info uri="patentstorm-patents-metalfusionbonding" /><atom10:link xmlns:atom10="http://www.w3.org/2005/Atom" rel="hub" href="http://pubsubhubbub.appspot.com/" /><item>
			         <title><![CDATA[Joining of parts via magnetic heating of metal aluminum powders]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/w0f1SH1uo-E/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8444045&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-21&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A method of joining at least two parts includes steps of dispersing a joining material comprising a multi-phase magnetic metal-aluminum powder at an interface between the at least two parts to be joined and applying an alternating magnetic field (AMF). The AMF has a magnetic field strength and frequency suitable for inducing magnetic hysteresis losses in the metal-aluminum powder and is applied for a period that raises temperature of the metal-aluminum powder to an exothermic transformation ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/w0f1SH1uo-E" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8444045/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Apparatus and methods for forming wire bonds]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/icp0oclcaTk/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8444044&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-21&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A wire bonding apparatus includes a processing block, a bond head assembly and an infrared radiation source for selectively heating the bond pad areas of one or more semiconductor dies and/or bonding sites on a substrate. Methods for forming wire bonds using selective heating of the bond pad areas of one or more semiconductor dies and/or bonding sites on the substrate are also ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/icp0oclcaTk" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8444044</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8444044/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Uniform solder reflow fixture]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/LjuhdlMYKcA/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8444043&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-21&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; ; ; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;An array of solder balls is attached to solder pads of one of a first substrate and a second substrate. After aligning the array of solder balls relative to solder pads of the other of the first substrate and the second substrate, a thermal-mass-increasing fixture is placed on a surface of the second substrate to form an assembly of the first substrate, the second substrate, and the array of the solder balls therebetween, and the thermal-mass-increasing fixture. The thermal-mass-increasing ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/LjuhdlMYKcA" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8444043</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8444043/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Method for producing steel pipe plated with metal by thermal spraying]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/_zBlBtRTNqE/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8444042&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-21&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;[Problems] To provide a process for producing a thermal sprayed, metal plated steel tube having a metal layer substantially uniform and favorable over the whole surface in a highly productive manner.&lt;/p&gt;
&lt;p&gt;[Means for solving] A process for producing a metal tube comprising continuously forming a metal plate composed of a first component into a tubular shape and continuously welding its butted ends to form the metal tube, wherein, after the continuous welding, a metal layer composed of a ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/_zBlBtRTNqE" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8444042/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Brazing system and method]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/wgHgb6rQGBA/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8444041&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-21&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A brazing system has a first gas source, a second gas source, a first enclosure, a second enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/wgHgb6rQGBA" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8444041/description.html</feedburner:origLink></item>
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			         <title><![CDATA[End effector for forming swept friction stir spot welds]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/g1g5qfb1d88/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8444040&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-21&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;An apparatus includes a connector and is configured to mount to a machine having multiple axes of control. A control signal on the connector determines a path of a rotating tool ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/g1g5qfb1d88" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8444040/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Thermally-insulated vibration welding tool]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/p8Whqob6ghk/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8444039&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-21&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A welding assembly for forming a weld along a welding interface of a work piece(s) using vibrations includes a welding tool and a thermal barrier. The thermal barrier is at least a chemical and/or mechanical insulating layer positioned adjacent to the welding tool, which minimizes the rate of dissipation of heat generated by the vibrations at or along the welding interface. The welding assembly may also include a wear-resistant layer adjacent to the thermal barrier, which protects the ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/p8Whqob6ghk" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8444039</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8444039/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Method for bonding metal surfaces, method for producing an object having cavities, object having cavities, structure of a light emitting diode]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/Zg6YO60DAcU/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8439252&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-14&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A method for bonding two partially form-fitting surfaces of two metal bodies which contain the same metal is carried out by generating a first layer on the surface of a first one of the two bodies, the first layer containing a mixture of the metal and the oxide of the metal; generating a second layer on the first layer, the second layer containing the metal but less oxide of the metal than does the first layer; placing the partially form-fitting surfaces of the two metal bodies adjacent to ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/Zg6YO60DAcU" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8439252</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8439252/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Wiring method and device]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/Re41cX-nzg8/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8439251&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-14&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at least one seat in which the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction, d. applying the holding jig to the frame and orienting the same so that the longitudinal ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/Re41cX-nzg8" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8439251</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8439251/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Friction-stir weld-tool and method]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/0ja3trM3cGo/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8439250&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-14&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A method for joining a tube and tube plate for use in a tube-and-shell heat exchanger is disclosed. The method enables a joint between the tube and tube plate that is substantially hermetic and substantially corrosion-resistant. The method comprises providing an anvil inside the tube, wherein the anvil supports the tube wall during a friction-stir welding process used to join the tube and tube plate. The anvil facilitates formation of a reliable weld region and enables faster friction-stir ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/0ja3trM3cGo" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8439250</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8439250/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Device and method for making a semiconductor device including bonding two bonding partners]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/F7XKcYWYvPw/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8439249&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-14&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A device and a method for making a semiconductor device including bonding a first bonding partner to a second bonding partner. The device comprises a lower tool and an upper tool, the upper tool including a plunger having a bottom side facing the lower tool at which bottom side a vacuum is creatable, so that the first bonding partner can be picked up by vacuum from the upper tool and positioned on the second bonding ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/F7XKcYWYvPw" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8439249/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Methods and associated apparatus of constructing and installing rigid riser structures]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/B62Ld9y7dhc/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8439248&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-14&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;Disclosed is a method of fabricating and installing a riser tower structure, preferably in a welding chamber, and a welding chamber suitable for the method. The method includes fabricating sections of the riser tower structure at a site remote from the site of installation; transporting the sections of the riser tower structure to within the vicinity of the installation site; and assembling together the sections of the riser tower structure in the vicinity of the installation site. The ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/B62Ld9y7dhc" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8439248/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Ultrasonic welding system with dynamic pressure control]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/5v6AgmZjvo4/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8439247&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-14&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;An ultrasonic welding system for securing a first work piece to a second work piece includes a welding assembly and a loading assembly disposed adjacent to the welding assembly. The welding assembly includes an ultrasonic controller, an ultrasonic transducer, and a welding tip. The ultrasonic transducer is configured to impart an ultrasonic vibration to the welding tip in response to an electrical signal received from the ultrasonic controller. The loading assembly is configured to generate ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/5v6AgmZjvo4" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8439247/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Manufacturing method of a forged golf club head]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/aFNU_VtKGzk/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434671&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A manufacturing method of a forged golf club head has acts of: providing pre-forged strike element and the pre-forged hosel made with different materials, welding the hosel on a connecting end of the strike element, and press-forging the blank to form a main component of the golf club head. The main component of the golf club head may accomplish the golf club head. Otherwise, a pre-forged secondary component is welded on a back part of the strike face of the main component to accomplish the ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/aFNU_VtKGzk" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8434671/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Repair apparatus and repair method]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/9UIIvQwAe00/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434670&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/9UIIvQwAe00" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8434670/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Universal bond head for wire bonders]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/Wxv-Xy8koJY/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434669&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A wedge wire bonder comprises a wedge that is operative to oscillate along a transducer axis for bonding a wire onto a surface and a wire clamp comprising a pair of parallel clamping plates for clamping the wire. The clamping plates having clamping surfaces that are oriented substantially perpendicularly to the transducer axis. Lateral guides are arranged on opposite sides of the wire, such that the lateral guides and the wire are generally aligned parallel to the clamping surfaces of the ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/Wxv-Xy8koJY" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8434669/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Magnetic attachment structure]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/bcNAMlhXDq0/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434668&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/bcNAMlhXDq0" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434668</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8434668/description.html</feedburner:origLink></item>
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			         <title><![CDATA[Polyamine, carboxylic acid flux composition and method of soldering]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/HMVMukgroHE/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434667&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; ; ; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I:&lt;/p&gt;
&lt;p&gt;&lt;chemistry&gt;

&lt;/chemistry&gt;
&lt;br&gt;&lt;/br&gt;
with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia:
&lt;/p&gt;
&lt;p&gt;&lt;chemistry&gt;

&lt;/chemistry&gt;
&lt;br&gt;&lt;/br&gt;
then zero to three of R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3 &lt;/sup&gt;and R&lt;sup&gt;4 &lt;/sup&gt;is(are) a hydrogen. Also provided is a method of soldering an electrical ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/HMVMukgroHE" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434667</guid>
			
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<item>
			         <title><![CDATA[Flux composition and method of soldering]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/xUuwPawhlqY/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434666&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; ; ; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I:&lt;/p&gt;
&lt;p&gt;&lt;chemistry&gt;

&lt;/chemistry&gt;
&lt;br&gt;&lt;/br&gt;
wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3 &lt;/sup&gt;and R&lt;sup&gt;4 &lt;/sup&gt;are independently selected from a hydrogen, a substituted C&lt;sub&gt;1-80 &lt;/sub&gt;alkyl group, an unsubstituted C&lt;sub&gt;1-80 &lt;/sub&gt;alkyl group, a substituted C&lt;sub&gt;7-80 &lt;/sub&gt;arylalkyl group and an unsubstituted C&lt;sub&gt;7-80 &lt;/sub&gt;arylalkyl group; and ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/xUuwPawhlqY" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434666</guid>
			
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<item>
			         <title><![CDATA[Electronic component mounting system and electronic component mounting method]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/4pUjjfA_Gyg/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434665&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system (&lt;b&gt;1&lt;/b&gt;) includes a solder printing device (M&lt;b&gt;1&lt;/b&gt;), a coating/inspection device (M&lt;b&gt;2&lt;/b&gt;), a component mounting device (M&lt;b&gt;3&lt;/b&gt;), a bonding material supply/substrate mounting device (M&lt;b&gt;4&lt;/b&gt;), and a reflow device (M&lt;b&gt;5&lt;/b&gt;). The ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/4pUjjfA_Gyg" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434665</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8434665/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Micro-ball loading device and loading method]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/W8mtyYRC0g0/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434664&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A device for loading electro-conductive ball onto the terminal regions of a substrate more correctly and reliably is disclosed. Micro-ball loading device (&lt;b&gt;200&lt;/b&gt;) may have the following parts: backing plate (&lt;b&gt;220&lt;/b&gt;) supporting substrate (&lt;b&gt;100&lt;/b&gt;) such that plural terminal regions (&lt;b&gt;108&lt;/b&gt;) formed on one surface of substrate (&lt;b&gt;100&lt;/b&gt;) are free, transfer mask (&lt;b&gt;210&lt;/b&gt;), which contains a metal mask and has plural through-holes (&lt;b&gt;216&lt;/b&gt;) formed corresponding to plural ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/W8mtyYRC0g0" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434664</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8434664/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Process for manufacturing a honeycomb seal]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/FH-R1WQGsPY/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434663&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A process for manufacturing a honeycomb seal is disclosed. The process includes the following steps: a) the honeycomb structure is brought to the desired three-dimensional form and is fixed in this form; b) then the honeycomb structure is filled with a filler material; c) then the honeycomb structure filled with the filler material is machined on a side on which a carrier element is arranged, such that this side has the desired contour and that the end edges of the honeycomb structure are ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/FH-R1WQGsPY" height="1" width="1"/&gt;</description>
			         
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<item>
			         <title><![CDATA[Joining method and friction stir welding method]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/44KMl9K_b-o/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434662&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A method of welding that realizes enhancements of airtightness and watertightness at a weld area and a method of welding and method of friction stir welding that attain an enhancement of welding operation efficiency/speed. There is provided a method of welding including the first primary welding step of carrying out a friction stir welding on the abutting portion (J&lt;b&gt;1&lt;/b&gt;) of metal members (&lt;b&gt;1,1&lt;/b&gt;) from the surface (&lt;b&gt;12&lt;/b&gt;) side of metal member (&lt;b&gt;1&lt;/b&gt;) and the second primary ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/44KMl9K_b-o" height="1" width="1"/&gt;</description>
			         
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<item>
			         <title><![CDATA[Friction stir welding tool and process for welding dissimilar materials]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/yRRRr9rVyD4/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434661&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A friction stir welding tool and process for lap welding dissimilar materials are detailed. The invention includes a cutter scribe that penetrates and extrudes a first material of a lap weld stack to a preselected depth and further cuts a second material to provide a beneficial geometry defined by a plurality of mechanically interlocking features. The tool backfills the interlocking features generating a lap weld across the length of the interface between the dissimilar materials that ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/yRRRr9rVyD4" height="1" width="1"/&gt;</description>
			         
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<item>
			         <title><![CDATA[Method for friction stir welding using spindle-in-spindle]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/KmEGhUGbyms/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434660&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A spindle head for performing friction stir welding includes concentric spindle shafts driven by stacked, coaxial motors contained within a spindle housing. The coaxial arrangement of the motors results in a more compact package. Each of the motors is concentrically arranged around one of the spindles by directly connecting a rotor of the motor to a spindle shaft. The stators of the motors are mounted on the housing and are concentrically arranged around the concentric spindle ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/KmEGhUGbyms" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434660</guid>
			
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<item>
			         <title><![CDATA[Bonding device, ultrasonic transducer, and bonding method]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/R1sF5H3kZNk/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434659&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (&lt;b&gt;2&lt;/b&gt;) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (&lt;b&gt;5&lt;/b&gt;) and an ultrasonic transducer (&lt;b&gt;35&lt;/b&gt;) are disposed for ultrasonic vibration excitation of the bonding ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/R1sF5H3kZNk" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434659</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8434659/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Joining method and reflow apparatus]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/AzhA1AaceDA/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434658&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventor:&lt;/strong&gt; &amp;nbsp;&lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/AzhA1AaceDA" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434658</guid>
			
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<item>
			         <title><![CDATA[Gantry-based welding system and method]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/lY7CdvG6crg/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434657&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A multi-station, gantry-based automated welding system includes a gantry mounting robotic arc welders or other equipment. The gantry has a range of travel over multiple workstations, each workstation being adapted for rotatably mounting a respective workpiece on a headstock assembly and a tailstock assembly, which define a workpiece or weldment rotational axis extending therebetween. The tailstock assembly can be located at different positions within a workstation for accommodating ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/lY7CdvG6crg" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434657</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8434657/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Ultrasonic horn]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/7OCCjcpBRp0/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8434656&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-05-07&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/7OCCjcpBRp0" height="1" width="1"/&gt;</description>
			         
			         <guid isPermaLink="false">8434656</guid>
			
			      <feedburner:origLink>http://www.patentstorm.us/patents/8434656/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Curable flux composition and method of soldering]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/7UlqvwkDnQE/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8430295&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-04-30&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; ; ; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I:&lt;/p&gt;
&lt;p&gt;&lt;chemistry&gt;

&lt;/chemistry&gt;
&lt;br&gt;&lt;/br&gt;
wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3 &lt;/sup&gt;and R&lt;sup&gt;4 &lt;/sup&gt;are independently selected from a hydrogen, a substituted C&lt;sub&gt;1-80 &lt;/sub&gt;alkyl group, an unsubstituted C&lt;sub&gt;1-80 &lt;/sub&gt;alkyl group, a substituted C&lt;sub&gt;7-80 &lt;/sub&gt;arylalkyl ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/7UlqvwkDnQE" height="1" width="1"/&gt;</description>
			         
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<item>
			         <title><![CDATA[Amine, carboxylic acid flux composition and method of soldering]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/5c4NzhVWOiQ/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8430294&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-04-30&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; ; ; ; ; ; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I:&lt;/p&gt;
&lt;p&gt;&lt;chemistry&gt;

&lt;/chemistry&gt;
&lt;/p&gt;
&lt;p&gt;Also provided is a method of soldering an electrical contact using the flux ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/5c4NzhVWOiQ" height="1" width="1"/&gt;</description>
			         
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			      <feedburner:origLink>http://www.patentstorm.us/patents/8430294/description.html</feedburner:origLink></item>
<item>
			         <title><![CDATA[Curable amine, carboxylic acid flux composition and method of soldering]]></title>
			         <link>http://feedproxy.google.com/~r/Patentstorm-Patents-MetalFusionBonding/~3/iGS0FIYF3sY/description.html</link>
			         <description>&lt;ul&gt;&lt;li&gt;&lt;strong&gt;Patent Number:&lt;/strong&gt; &amp;nbsp;8430293&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Publication Date:&lt;/strong&gt; &amp;nbsp;2013-04-30&lt;/li&gt;&lt;li&gt;&lt;strong&gt;Inventors:&lt;/strong&gt; &amp;nbsp;; ; ; ; ; ; ; ; &lt;/li&gt;&lt;/ul&gt;
&lt;p&gt;A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I:&lt;/p&gt;
&lt;p&gt;&lt;chemistry&gt;

&lt;/chemistry&gt;
&lt;br&gt;&lt;/br&gt;
and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux ...&lt;br /&gt;&lt;img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-MetalFusionBonding/~4/iGS0FIYF3sY" height="1" width="1"/&gt;</description>
			         
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