258 85 http://www.patentstorm.us/ http://www.patentstorm.us/images/logo.gif http://www.patentstorm.us/rss/class/patents/rss-432.xml Recent patents filings in USPTO Class 432 Heating. Tue, 7 Feb 2012 16:04:12 patents@patentstorm.us en http://feedproxy.google.com/~r/Patentstorm-Patents-Heating/~3/OiepgJc-Gx8/description.html <ul><li><strong>Patent Number:</strong> &nbsp;8109761</li><li><strong>Publication Date:</strong> &nbsp;2012-02-07</li><li><strong>Inventors:</strong> &nbsp;Neal, Mike; Hall, David; Doucette, Jay; Yang, Chenxi</li></ul> <p>A cooling system for a dental porcelain furnace speeds up the cycle time for the ...<br /> <p><a href="http://feedads.g.doubleclick.net/~a/ovnc3_Tw52tJlkP07LZ9w798y9U/0/da"><img src="http://feedads.g.doubleclick.net/~a/ovnc3_Tw52tJlkP07LZ9w798y9U/0/di" border="0" ismap="true"></img></a><br/> <a href="http://feedads.g.doubleclick.net/~a/ovnc3_Tw52tJlkP07LZ9w798y9U/1/da"><img src="http://feedads.g.doubleclick.net/~a/ovnc3_Tw52tJlkP07LZ9w798y9U/1/di" border="0" ismap="true"></img></a></p><img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-Heating/~4/OiepgJc-Gx8" height="1" width="1"/> 8109761 http://www.patentstorm.us/patents/8109761/description.html http://feedproxy.google.com/~r/Patentstorm-Patents-Heating/~3/pDCSPKlALig/description.html <ul><li><strong>Patent Number:</strong> &nbsp;8105078</li><li><strong>Publication Date:</strong> &nbsp;2012-01-31</li><li><strong>Inventor:</strong> &nbsp;Adachi, Naoshi</li></ul> <p>A heat treatment jig for semiconductor silicon substrates is configured such that a cristobalitized oxide film is formed in a region where the cristobalitized oxide film is in contact with a silicon substrate backside. When said heat treatment jig is used, generation of a slip can be prevented during heat treatment. In the case where the heat treatment jig is used in combination with a shielding plate, particles are further prevented from adhering to the silicon substrate surface to ...<br /> <p><a href="http://feedads.g.doubleclick.net/~a/FzzSrkFsRQgr5Tjx-6W21YhZsFM/0/da"><img src="http://feedads.g.doubleclick.net/~a/FzzSrkFsRQgr5Tjx-6W21YhZsFM/0/di" border="0" ismap="true"></img></a><br/> <a href="http://feedads.g.doubleclick.net/~a/FzzSrkFsRQgr5Tjx-6W21YhZsFM/1/da"><img src="http://feedads.g.doubleclick.net/~a/FzzSrkFsRQgr5Tjx-6W21YhZsFM/1/di" border="0" ismap="true"></img></a></p><img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-Heating/~4/pDCSPKlALig" height="1" width="1"/> 8105078 http://www.patentstorm.us/patents/8105078/description.html http://feedproxy.google.com/~r/Patentstorm-Patents-Heating/~3/Nn1h6cN4V2A/description.html <ul><li><strong>Patent Number:</strong> &nbsp;8100690</li><li><strong>Publication Date:</strong> &nbsp;2012-01-24</li><li><strong>Inventors:</strong> &nbsp;Föns, Mogens Juhl; Mortensen, Sten</li></ul> <p>Described is a method as well as a cooler (<b>1</b>) for cooling hot particulate material which has been the subject of heat treatment in an industrial furnace, such as a rotary kiln (<b>3</b>) for manufacturing cement clinker, by which method the hot material from the kiln (<b>3</b>) is directed to an inlet grate (<b>21</b>) in the cooler (<b>1</b>), in which cooling air from an underlying compartment (<b>24</b>) is led via a number of channels (<b>28</b>) through gaps (<b>20</b>) in the ...<br /> <p><a href="http://feedads.g.doubleclick.net/~a/7x-zb8JfhIP3k4wboSCDsrEOb0w/0/da"><img src="http://feedads.g.doubleclick.net/~a/7x-zb8JfhIP3k4wboSCDsrEOb0w/0/di" border="0" ismap="true"></img></a><br/> <a href="http://feedads.g.doubleclick.net/~a/7x-zb8JfhIP3k4wboSCDsrEOb0w/1/da"><img src="http://feedads.g.doubleclick.net/~a/7x-zb8JfhIP3k4wboSCDsrEOb0w/1/di" border="0" ismap="true"></img></a></p><img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-Heating/~4/Nn1h6cN4V2A" height="1" width="1"/> 8100690 http://www.patentstorm.us/patents/8100690/description.html http://feedproxy.google.com/~r/Patentstorm-Patents-Heating/~3/opWjK1f9PQU/description.html <ul><li><strong>Patent Number:</strong> &nbsp;8096805</li><li><strong>Publication Date:</strong> &nbsp;2012-01-17</li><li><strong>Inventor:</strong> &nbsp;Kudo, Tomoyasu</li></ul> <p>A manufacturing apparatus for a semiconductor device that includes a bake chamber for a wafer with a coating film formed thereon to be baked at a predetermined temperature, a cooling chamber connected to the bake chamber, a first carrying unit for the baked wafer to be carried in the cooling chamber, a first temperature control unit for the wafer carried by the first carrying unit to be cooled down, and an unloading gate for unloading the wafer cooled down from the cooling ...<br /> <p><a href="http://feedads.g.doubleclick.net/~a/b2csIFoDiR-Ownr_fpW4ZikpZ0A/0/da"><img src="http://feedads.g.doubleclick.net/~a/b2csIFoDiR-Ownr_fpW4ZikpZ0A/0/di" border="0" ismap="true"></img></a><br/> <a href="http://feedads.g.doubleclick.net/~a/b2csIFoDiR-Ownr_fpW4ZikpZ0A/1/da"><img src="http://feedads.g.doubleclick.net/~a/b2csIFoDiR-Ownr_fpW4ZikpZ0A/1/di" border="0" ismap="true"></img></a></p><img src="http://feeds.feedburner.com/~r/Patentstorm-Patents-Heating/~4/opWjK1f9PQU" height="1" width="1"/> 8096805 http://www.patentstorm.us/patents/8096805/description.html