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Precision variable resistor

Patent Number: 8466772
Publication Date: 2013-06-18
Inventors: ; ;

On the track of a potentiometer a resistive path of thin film is deposited or a foil is bonded to a matched substrate and a parallel path is formed of discrete contact straps extending from the resistive path. The resistive path has a protecting coating and the wiper is moving on abrasion resistant contact straps. This design enables application of high precision and stability resistor technologies in the production of variable resistors destined for long service life. It enables also, in ...

Sintered metal oxide for thermistor, thermistor element, thermistor temperature sensor, and method for producing sintered metal oxide for thermistor

Patent Number: 8466771
Publication Date: 2013-06-18
Inventor:

Disclosed is a sintered metal oxide used for thermistors, which includes a complex oxide represented by the following general formula: La_1-yA_y(Cr_1-xMn_x)O₃(with the proviso that A represents at least either one of Ca or Sr, and x and y satisfy 0.0≦x≦1.0 and 0.03) that includes a sintered metal oxide for thermistors (2) and at least a pair of lead wires (1) each ...

In-molded resistive and shielding elements

Patent Number: 8461957
Publication Date: 2013-06-11
Inventors: ; ;

An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the ...

Chip resistor device and a method for making the same

Patent Number: 8456273
Publication Date: 2013-06-04
Inventor:

A chip resistor device includes: a dielectric substrate that has top and bottom surfaces and two opposite edge faces interconnecting the top and bottom surfaces; two electrodes that are formed on two opposite sides of the dielectric substrate and that cover the edge faces and parts of the top and bottom surfaces; a resistor layer that is formed on one of the top and bottom surfaces of the dielectric substrate between the electrodes and that is brought into contact with the electrodes; and a ...

Electric line

Patent Number: 8456272
Publication Date: 2013-06-04
Inventors: ; ;

An electric line comprising: at least one conducting substrate including at least two heating fields of different width, at least one shared contacting device, wherein the conducting substrate includes a coating material disclosed on the conducting substrate that forms the at least two heating fields, and the same coating material is disposed on the at least two heating fields, and wherein an electrical conductivity of the coating material on one of the at least two heating fields is ...

Optical proximity switch

Patent Number: 8456271
Publication Date: 2013-06-04
Inventors: ;

An optical proximity switch includes a potentiometer for setting a switching point and supported for rotation through multiple turns, a crosswheel supported for rotation and including a visible position index visible, and a cam drive rotatably coupled to the potentiometer and the ...

Co-fired multi-layer stack chip resistor and manufacturing method

Patent Number: 8451085
Publication Date: 2013-05-28
Inventor:

A co-fired multi-layer stack chip resistor is provided. The co-fired multi-layer stack chip resistor includes a ceramic substrate and a multi-layer stack resistance structure monomer. The ceramic substrate is formed by stacking multiple layers of the ceramic membranes, wherein the ceramic membranes is formed of a bearing membrane and a porcelain slurry with the solvent, the binder and the dispersant. The multi-layer stack resistance structure monomer is stacked on the ceramic substrate, and ...

Laminated surface mounting type thermistor and manufacturing method thereof

Patent Number: 8451084
Publication Date: 2013-05-28
Inventor:

A laminated SMD-type thermistor has a conductive module, a left and a right conductive metal layer. The conductive module includes a core conductive module coated with an insulating layer on the upper and lower surface, and the left and right side. The core conductive module includes at least one conductive unit piled up in sequence, two conductive units are separated by an insulating material layer. The conductive unit includes an upper metal foil, a conductive polymer chip and a lower ...