EDA Blog

2012 Interdisciplinary Engineering Design Education Conference

Ken Cheung — Wed, 08 Feb 2012 16:19:59 +0000

The Interdisciplinary Engineering Design Education Conference (IEDEC) will take place on Monday, March 19, 2012 in Santa Clara,California. The conference provides a forum for sharing ideas, learning about developments in engineering design education, and interacting with professionals, experts, and colleagues in the field. IEDEC is intended for educators, mentors, engineers, managers, researchers, students, and representatives from industry and consortiums.

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Fully Depleted Workshop Covers Fully Depleted SOI Technology

Ken Cheung — Tue, 07 Feb 2012 16:39:03 +0000

The SOI Industry Consortium, CEA-Leti and Soitec are organizing a workshop on fully depleted silicon-on-insulator (FD-SOI) technology for advanced semiconductor architectures. The forum, which includes technical presentations and discussions, will take place in San Francisco, California on February 24, 2012. The event provides semiconductor IC designers and manufacturers with the latest information and insights on using FD-SOI wafers to produce more power efficient ICs at the performance required for applications in mobile and consumer electronics.

Cadence, Samsung Foundry Develop DFM Flows for 32nm, 28nm, 20nm Chip Design

Ken Cheung — Mon, 06 Feb 2012 19:08:51 +0000

Cadence Design Systems and Samsung Foundry teamed together to create a design-for-manufacturing infrastructure to produce complex chips. Cadence worked closely with Samsung Foundry to integrate their robust DFM suite. The resulting flows and underlying infrastructure provide a significant competitive edge by enabling engineers to meet tight deadlines while reducing the risk of costly errors.

Microsemi and TRINAMIC Create SmartFusion Dual Motor Control Kit

Ken Cheung — Fri, 03 Feb 2012 15:48:42 +0000

Microsemi and TRINAMIC teamed together on the SmartFusion Dual Motor Control Kit. The motor control kit features the Microsemi SmartFusion evaluation kit and TRINAMIC motor control daughter board kit. The bundles solution also includes stepper motor with 1.8 degree step angle, brushless DC motor with Hall sensors, portable desktop power supply (24V/1A) with international plugs, and example designs. The solution enables designers to lower product-development costs and bring products to market quickly. The SmartFusion Dual Motor Control Kit is available for now. The motor control kit is priced at $549.

AdaCore Unveils GNATtest Unit Test Harness Generator for Ada

Ken Cheung — Thu, 02 Feb 2012 17:43:36 +0000

AdaCore introduced the GNATtest unit test harness generator for Ada. GNATtest is included in GNAT Pro and supports all versions of Ada and all target configurations. It is based on, and replaces, the earlier AUnit technology. The AdaCore GNATtest tool helps automate the essential, but tedious and error-prone, processes for developing and managing the large number of test cases that accompany the verification of large software systems.

Microchip, Digilent Unveils Cerebot MX3cK, MX4cK, MX7cK Development Boards

Ken Cheung — Wed, 01 Feb 2012 16:29:38 +0000

Microchip Technology and Digilent introduced the Cerebot MX3cK, Cerebot MX4cK and Cerebot MX7cK development boards. The 32-bit PIC32 microcontroller-based boards feature prototyping capabilities for the Arduino compatible chipKIT development platform. The MX3/4/7 boards offer a single, general-purpose development platform for users to develop a wide range of 32-bit MCU applications using the free, Arduino-compatible chipKIT IDE (called the Multi-Platform IDE, or MPIDE). All three boards are available now. The Cerebot MX3cK board is priced at $39, the MX4cK board is $79, and the MX7cK board is $99.

Microchip PIC18F26J50 EVK Flowcode Development Kit

Ken Cheung — Tue, 31 Jan 2012 17:09:47 +0000

element14, Microchip and Matrix teamed together to create the PIC18 Flowcode Developers Kit. The PIC18F26J50 EVK Flowcode Development Kit is designed to provide developers a hands-on approach for learning Flowcode 4, which is an advanced graphical programming language for microcontrollers. The development kit features the PIC18F26J50-EVK Board, USB cable, a lite version of Flowcode 4, and CD-ROM. The PIC18F26J50 EVK Flowcode Development Kit is available for $38.22.

Mentor Graphics Releases HyperLynx v8.2 Tool Suite

Ken Cheung — Mon, 30 Jan 2012 17:41:20 +0000

Mentor Graphics rolled out HyperLynx release 8.2. HyperLynx is a suite of analysis tools for optimizing printed circuit board (PCB) designs. New features include 3D full-wave field solving, and integrated thermal/power co-simulation analysis capabilities. Specialized 3D modeling is required for analysis of multi-GHz SERDES channel interconnects (such as PCIe-Gen 3). The Mentor HyperLynx v8.2 tool suite will ship in volume next month.

Apache Design Sponsors Two DesignCon Chip Package System Workshops

Ken Cheung — Fri, 27 Jan 2012 16:25:05 +0000

Apache Design, Inc. is sponsoring two Chip-Package-System (CPS) workshops at DesignCon 2012. The two in-depth technical workshops will provide designers with an open forum for exchanging the latest ideas and information on the most current technologies. In the interactive workshops, leading semiconductor companies and system houses will share perspectives and best practices on chip and package modeling, and system-level verification for signal integrity, power integrity, electromagnetic interference and thermal. The workshops are free. However, seating is limited and registration is required.

HSPICE 2011.09 Speed-up Signal Integrity Simulation by Factor of Three

Ken Cheung — Thu, 26 Jan 2012 17:06:39 +0000

HSPICE 2011.09 has been integrated with Sigrity’s signal integrity analysis solution to accelerate signal integrity simulation of high-speed systems. The combined Synopsys and Sigrity tool features up to 3X faster simulation of signal and power integrity analysis of multi-gigahertz designs. In addition, HSPICE 2011.09 circuit simulator offers enhanced multi-core simulation performance, improved accuracy in statistical eye-diagram analysis, and new multi-core enabled S-parameter and W-element analysis.