DV Hardware

Lenovo launches 15-inch ThinkPad S531 ultrabook

Lenovo introduces the ThinkPad S531, a new 15" ultrabook with an Intel's Ivy Bridge Core i3/i5/i7 processors, up to 1920 x 1080 pixel resolution, AMD Radeon HD 8670M graphics, up to 1TB HDD or 256GB SSD, and up to 10GB DDR3L memory. Other features include a backlit keyboard with numeric keypad, a 5-button ClickPad with glass surface, HDMI, 4-in-1 memory card reader, two USB 3.0 ports, WiFi, Bluetooth and a fingerprint reader. The battery life is listed as up to nine hours, the laptop measures 379mm x 253mm x 20.7mm and weighs 2.29kg. Pricing starts at 619EUR (excl. VAT).

Lenovo (HKSE: 992) (ADR: LNVGY) announced its new ThinkPad S531, a premium laptop PC featuring an ultra-thin bezel and bevelled edges, giving the illusion that the PC is floating. Optimized for Windows 8, the ThinkPad S531 offers small businesses enhanced performance and 15 percent faster processor speed than previous generations. The ThinkPad S531 is being launched today at the Xander Zhou fashion show at London Fashion Week in conjunction with the designer’s new mens’ fashion collection.

Lenovo’s first 15-inch ThinkPad Ultrabook delivers high style and performance to image-conscious small businesses and is ideal for professionals who want a combination of design and substance. It is also a fit for small businesses that need a laptop to do it all – great performance for work tasks and an excellent experience for personal computing

“The progressive design of our ThinkPad S531 will help small businesses impress their customers. We pack a punch behind that style, however, as we are committed to delivering genuine substance with improved performance, battery life and legendary ThinkPad reliability,” said Vincent Fauquenot, VP Products and Channels, Lenovo EMEA. “The ThinkPad S531 offers an intuitive Windows 8 experience with the power needed to accelerate productivity.”

The S531 is one of the first ThinkPads to feature Lenovo OneLink technology, which allows users to connect to the ThinkPad OneLink Dock with a single cable for dedicated video, additional USB 3.0 ports and gigabit Ethernet, all while powering the system.

Chic, stylish design
Featuring an ultra-thin bezel, the aesthetic exterior of the ThinkPad S531 includes bevelled edges on the front and side, giving the illusion that the laptop is suspended over the desk. An aluminum LCD cover, available in fashion-forward silver or graphite black, is sand blasted and anodized, making it smooth to the touch for a premium feel. The ThinkPad S531 also boasts a simplified interior with a five-button clickpad with glass surface to eliminate clutter, adding to the overall clean look of the laptop.

Easy, interactive experience
The ThinkPad S531 come with a variety of high-resolution displays featuring 180-degree open angle that lets users interact with the laptop in a number of ways. It also has a six-row backlit keyboard that includes Windows 8 optimized shortcut keys. Additionally, the large, responsive touchpad supports Windows 8 gestures, providing users with a powerful and intuitive way to be more productive and interactive with their laptop.

Power for performance
The ThinkPad S531 is powered by Intel 3rd generation Core™ processors, making it 15 percent faster than its predecessor with up to nine hours of battery life. With up to 10 GB of memory* and 500 GB of storage, users don’t have to sacrifice responsiveness for performance. The S531 can store up to 150,000 MP3s or 250 full-length feature films. Dolby Advanced Audio will bring sound to life and a 15.6inch Antiglare Full HD* display will make movies stand out. The laptop features two USB 3.0 ports for fast data transfer.

Lenovo launches 15-inch ThinkPad S531 ultrabook - More news at DV Hardware

ASUS: Wearable devices critical sector for innovation

Wearable computing is one of the latest gadget crazes. Google jumped into it with its Glass goggles, Samsung is working on a watch-like product, and Apple and Microsoft are rumored to be developing watches of their own. Another firm keen to enter wearable computing is ASUS. Company chairman Jonney Shih said wearable devices will be a critical sector for innovation, and revealed ASUS has been experimenting in that area:

Now, you can add Asus to the list. According to Focus Taiwan, Asus Chairman Jonney Shih thinks wearable devices will be a "critical sector" for innovation. Asus' research lab has been experimenting in that area, Shih said, but there doesn't appear to be anything specific planned just yet. Rather than catering to early adopters, Shih seems more interested in competing when there's mass-market demand.

ASUS: Wearable devices critical sector for innovation - More news at DV Hardware

Microsoft testing Surface RT with Snapdragon 800

Neowin picked up rumors that Microsoft is testing new Surface RT tablets with the Qualcomm Snapdragon 800 chipset. This new model is expected to arrive towards the end of the year.

Bloomberg claims that Microsoft will update the tablet with new chips from Qualcomm, while NVIDIA will "continue as a supplier for some versions", presumably including the existing model with its Tegra 3 chipset.

Meanwhile, The Verge is citing separate "sources familiar to Microsoft's Surface plans", stating that a Windows RT 8.1 Surface device is already in testing at Microsoft, powered by a Qualcomm Snapdragon 800 chipset. The report accurately states that the ARM-based chip has integrated LTE radios, but it's unclear at this stage whether a future Surface will come with mobile broadband capabilities.

Microsoft testing Surface RT with Snapdragon 800 - More news at DV Hardware

Qualcomm Snapdragon 800 gets benchmarked

ARS Technica reports benchmarks are showing up of Qualcomm's new Snapdragon 800 SoC. This chip features four Krait 400 CPU cores and the Adreno 330 GPU, making it one of the faster SoCs in the market. Power consumption is still somewhat of a mystery though, although Qualcomm claims it's on-par with that of the Snapdragon 600 thanks to the use of the TSMC 28nm High Performance for Mobile (HPm) process instead of the 28nm Low Power (LP) process.

As you can see here, the Snapdragon 800 comes within spitting distance of the four ARM Cortex-A15 CPU cores used in the Tegra 4, though it can't quite beat it (and the difference would become more pronounced if the two were running at the same clock speed). The GPU, on the other hand, is even quicker than Tegra 4 or the iPad 4. This is no small feat, given that Tegra 4 tablets aren't quite on the market yet and Apple has always been ahead of the curve when it comes to graphics performance.

Qualcomm Snapdragon 800 gets benchmarked - More news at DV Hardware

EA Sports Ignite engine does not support PCs

EA Sports' upcoming Ignite engine that will power the company's next-generation titles will not support the PC nor the Wii U. Executive vice-president Andrew Wilson told the press that the PC is excluded because "most players don't have computers that could run it". Wilson points out that they received many complaints from gamers unable to play FIFA 11 back in 2010 due to lack of an adequate computer configuration, and adds that Ignite has been built for the closed Xbox One and PS4 hardware and not the open hardware of an average PC. However, he concedes that with some adjustments, Ignite might make the jump to the PC in the future.

According to Wilson, the release of FIFA 11 back in 2010 resulted in many players being unable to play the game because they did not have an adequately powerful computer at the time and the company feels this would be repeated if Ignite-powered titles were released on the PC today.

'Even though there were some PCs on the marketplace that could run that engine, the lion's share of PCs on the marketplace could not,' Wilson told Polygon. 'And the majority of the gamer base that was playing the game on PC did not have a PC spec that would work with that.'

EA Sports Ignite engine does not support PCs - More news at DV Hardware

MSI GeForce GTX 780 Gaming card launched

MSI announces the GeForce GTX 780 Gaming. This card features a 954MHz core, 1006MHz Turbo and 3GB GDDR5 memory clocked at 6008MHz. Cooling is provided by MSI's Twin Frozr IV.

Leading international motherboard and graphics card maker MSI has just officially unveiled its latest high-end GTX 780 Gaming graphics card! Featuring NVIDIA's new GeForce GTX 780 GPU with 3GB of high speed GDDR5 memory and PCI Express Gen 3, the MSI GTX 780 also comes with the exclusive MSI Gaming App tuning utility which enables gamers to instantly switch between a high-performance OC mode, Gaming mode and Silent modes. MSI's proprietary Airflow Control technology, dual over-sized 10 cm fans, and patented Propeller Blade technology perfectly complement the Twin Frozr IV Advanced and its impressive cooling performance. With a core temperature of just 67°C and noise level of a mere 25.7 dB* under full load, the MSI GTX 780 gives gamers unparalleled gaming performance and stability. In addition, MSI’s Military Class components are now in their 4th generation of development, delivering longer life and better stability than ever before. The exclusive Predator audio-video capture software allows gamers to easily record and share their gaming highlights with friends. The MSI GTX 780 features software and hardware exclusively designed for real gamers, making it the ultimate weapon for dominating any gaming challing

Exclusive Gaming App Simplifies Graphics Card Tuning
MSI specifically developed its Gaming App tuning utility with true gamers in mind. All it takes is one push of a button to switch between card modes, including high-performance OC Mode for improved cooling and extreme gaming performance, Gaming Mode for perfectly balanced performance, temperatures, and stability, and Silent Mode, which reduces noise to a minimum and provides gamers with a more comfortable and relaxing user environment.

Twin Frozr Cooling Evolution
The MSI GeForce GTX 780 Gaming features the Twin Frozr IV advanced Thermal Design. In addition to Propeller Blade, SuperPipe, and Nickel-plated Copper Base technologies for optimal cooling performance, 10 cm over-sized fan blades channel in maximum air flow at ultra low noise levels for unrivaled heat dissipation. In addition, MSI’s new proprietary Airflow Control technology funnels air directly to the heatpipes, making cooling more efficient. GPU temperature at full load is now a mere 67 °C and noise is kept down to a whisper-quiet 25.7 dB. Indeed, MSI’s continued devotion to innovation and perfection is a welcome relieve for gamers everywhere

MSI GeForce GTX 780 Gaming card launched - More news at DV Hardware

NVIDIA to license graphics IP to third parties

NVIDIA announced yesterday that it will engage in licensing its graphics designs to third parties. HotHardware picked up the news and writes NVIDIA will start by licensing the GPU core based on the NVIDIA Kepler architecture, allowing other firms like smartphone makers to use the basic design and add other elements.

In a blog post today, company spokesperson David Shannon writes: "our next step is to license our GPU cores and visual computing patent portfolio to device manufacturers to serve the needs of a large piece of the market... We’ll start by licensing the GPU core based on the NVIDIA Kepler architecture, the world’s most advanced, most efficient GPU. Its DX11, OpenGL 4.3, and GPGPU capabilities, along with vastly superior performance and efficiency, create a new class of licensable GPU cores. Through our efforts designing Tegra into mobile devices, we’ve gained valuable experience designing for the smallest power envelopes. As a result, Kepler can operate in a half-watt power envelope, making it scalable from smartphones to supercomputers."

...

It's not hard to see why. Imagination Technologies is currently the graphics darling of the mobile industry. It has provided GPU solutions to Apple, Intel, Samsung, and a host of other, smaller players. With Tegra, NVIDIA tackled the market with an all-in-one solution that it hoped would win designs on the strength of its overall performance and mobile graphics. Clearly, NVIDIA now feels it has more to offer beyond just a silicon solution, by licensing its graphics IP separately, rather than trying to entice manufacturers with only packaged silicon.

NVIDIA to license graphics IP to third parties - More news at DV Hardware

Super Talent Ram*Disk USB 3.0 drive revealed

Super Talent introduces the Ram?Disk, a new USB 3.0 flash drive that comes with software that lets the disk utilize your computer's RAM memory for faster data transfers. I'm not sure what's so special about this, but it does allow Super Talent to make some eye catching claims about the disk's read and write speeds, even though the maximum theoretical speed of USB 3.0 is only 600MB/s. The product is available in 8GB, 16GB and 32GB capacities.

Super Talent Technology, a leading manufacturer of NAND flash storage solutions, today announces the introduction of the USB 3.0 Express Ram?Disk. With sequential read scores of up to 4041 MB/s and sequential write scores of up to 5388 MB/s, the USB 3.0 Express Ram?Disk is a speed demon of a drive housed in a sleek aluminum casing. The USB 3.0 Express Ram?Disk uses your computer’s free RAM to transfer files at an amazingly quick rate. This USB also transfers the files while you are using the program, cutting down on wait time later.

“We are excited to release the USB 3.0 Express Ram?Disk. This product can improve the productivity of those who work with large files and programs by harnessing the power of their system’s RAM to deliver transfer speeds of over 4,000MB/s.” –Abraham Ma, CEO Super Talent Technology

The USB 3.0 Express Ram?Disk is as portable as a regular USB, giving the user the freedom to take their work anywhere. The USB 3.0 Express Ram?Disk provides the power of increased productivity through its incredible speed abilities, which can be many times faster than a SSD. This drive is especially suited for creative professionals. The USB 3.0 Express Ram?Disk is an ideal drive for anyone seeking a speedy drive with great performance.

Super Talent Ram*Disk USB 3.0 drive revealed - More news at DV Hardware

Cooler Master CM Storm Havoc laser mouse is out

Cooler Master shows off the CM Storm Havoc, a new laser gaming mouse with a 8200 dpi Avago 9800 sensor. The MSRP is $54.99.

Cooler Master, an industry leading chassis, thermal solution, peripheral, and accessory manufacturer today introduces the Havoc, a new laser gaming mouse into its CM Storm line of gaming peripherals. The CM Storm Havoc was designed with extreme precision in mind, capable of a blistering 8200 DPI that allows you to control the chaos at light speed.

Built For You
The Havoc provides full RGB color options to customize your mouse to your needs and 128kb onboard memory for profile management. All 8 programmable buttons are equipped with Japanese Omron micro-switches capable of over 5 million clicks, meaning your razor sharp actions will out-last even the toughest opponents.

Built For Mayhem
The CM Storm Havoc comes ready for battle with a durable rubber coated body and an ergonomic design. Your grip and comfort are never compromised, even when laying waste to your enemies.

Features:

Avago 9800 laser sensor with 100-8200 DPI

Highest grade Japanese Omron micro switches

Smooth super grip rubber coasting

8 programmable buttons

Up to 5 million button clicks

Rubber side grip for stability and fast mouse swipes

1.8 meter flexible and extremely durable mousecord

Up to 4 profiles setting

Build-in 128KB memory for easy plug and use

Cooler Master CM Storm Havoc laser mouse is out - More news at DV Hardware

LG shows off 55-inch curved OLED TV

LG announced its new 55EA9800, world's first 55" curved OLED TV will start shipping later this year for around 15 million won (around $13,260). The TV is the first of its kind, it uses a carbon fiber reinforced plastic (CFRP) frame and weighs just 17kg.

LG’s OLED TVs produce astoundingly vivid and realistic pictures, thanks to superior WRGB technology. This unique Four-Colour Pixel system features a white sub-pixel, which works in conjunction with the conventional RGB setup to create preferred colour output. The built-in Colour Refiner delivers even greater tonal enhancement, resulting in images that are more vibrant and natural than anything seen before in our range. The 55-inch OLED TV (Model No. 55EM9600) also offers an infinite contrast ratio, which maintains contrast levels even at wide viewing angles. To complement the infinite contrast ratio and enable the richest colour and deepest black expression, a High Dynamic Range (HDR) algorithm has been incorporated. This technology ensures contrast ratio consistency for rich colours.

As OLEDs generate their own light, there is no need for a separate backlight structure, enabling LG OLED TVs to boast a significantly reduced weight and depth, and a stylish, minimal appearance. The EA9800’s streamlined, ultra-modern design and curved screen remove any hint of visual distraction to maximise the viewing experience. Carbon Fibre-Reinforced Plastic (CFRP) has been implemented to further reduce unit weight and add additional strength to the beautifully curved screen. The OLED TV’s sleek styling and slim profile complement the stunning images brought about by LG’s WRGB technology, helping to create our ultimate immersive viewing experience.

LG’s Ultra Slim design effectively unifies screen and stand into a seamless aesthetic entity. Meanwhile, CINEMA SCREEN design elements result in a narrow screen bezel. A minimal bezel helps to produce an immersive 2D and 3D viewing experience.

Additionally, Smart Touch Control further differentiates LG’s OLED TV designs from competing models. This new feature results in an attractive appearance and an enhanced control experience. Located below the screen, the sliding touch key provides the user with an intuitive and elegant way to control the OLED TVs basic functions, such as changing channels and volume, and powering on or off.

LG shows off 55-inch curved OLED TV - More news at DV Hardware

Oculus Rift VR headset secures extra $16 million in funding

The Tech Report spreads news that the company behind the Oculus Rift VR headset has secured $16 million in additional funding through Spark Capital and Matrix Partners, two investment firms. Last year the project already raised nearly $2.5 million via crowdfunding site Kickstarter, and Oculus explains the extra cash will be used to "accelerate the development of virtual reality hardware, software and services, ultimately creating a full virtual reality platform for consumers."

Oculus hasn't announced any consumer products yet. However, the developer kit can be ordered from the company's site for $300.

The goggles that come with the kit have a relatively low 1280x800 resolution—640x800 for each eye. Oculus had a new, 1080p prototype on display at the E3 expo last week, though. Polygon was impressed by the HD headset, which will reportedly serve as the basis for the first commercial unit. Unfortunately, there's no word on when the finished product might become available.

Oculus Rift VR headset secures extra $16 million in funding - More news at DV Hardware

AMD discloses its server plans for 2013-2014

AMD issued a press release to reveal its server strategy and roadmap for 2013 and 2014. The roadmap shows several new chips, including Berlin, Warsaw and Seattle. Berlin will be available both as a CPU and an APU, it uses Steamroller cores and the APUs have GCN graphics with HSA support and unified memory access. AMD claims Berlin will offer twice the performance of the current-generation Kyoto server chips. Warsaw on the other hand is designed for two- and four-socket servers, it promises improved performance-per-Watt while enabling seamless migration from the current Opteron 6300 series. Both Berlin and Warsaw are anticipated in Q1 2014.

Seattle will be AMD's first 64-bit ARM-based server SoC, this chip features eight to sixteen cores based on the ARM Cortex-A57 design and uses AMD's Freedom Fabric interconnect. AMD says the cores will run at a clockspeed of 2GHz or greater and boasts that Seattle achieves 2-4x the performance of the current Kyoto server processors. Samples of Seattle are expected in Q1 2014 while mass production is slated for the second half of 2014.

AMD (NYSE: AMD) today publicly disclosed its strategy and roadmap to recapture market share in enterprise and data center servers by unveiling innovative products that address key technologies and meet the requirements of the fastest-growing data center and cloud computing workloads.

Additionally, AMD revealed details of its 2014 server portfolio including best-in-class Accelerated Processing Units (APUs), two- and four-socket CPUs, and details on what it expects to be the industry’s premier ARM server processor. This is on the heels of announcing the general availability of the AMD Opteron™ X-Series processor, code named “Kyoto,” which dominates the small-core server market on every performance benchmark. These forthcoming AMD Opteron™ processors bring important innovations to the rapidly changing compute market, including integrated CPU and GPU compute (APU); high core-count ARM servers for high-density compute in the data center; and substantial improvements in compute per-watt per-dollar and total cost of ownership.

“Our strategy is to differentiate ourselves by using our unique IP to build server processors that are particularly well matched to a target workload and thereby drive down the total cost of owning servers. This strategy unfolds across both the enterprise and data centers and includes leveraging our graphics processing capabilities and embracing both x86 and ARM instruction sets,” said Andrew Feldman, general manager of the Server Business Unit, AMD. “AMD led the world in the transition to multicore processors and 64-bit computing, and we intend to do it again with our next-generation AMD Opteron families.”

In 2014, AMD will set the bar in power-efficient server compute with the industry’s premier ARM server CPU. The 64-bit CPU, code named “Seattle,” is based on ARM Cortex™-A57 cores and is expected to provide category-leading throughput as well as setting the bar in performance-per-watt. AMD will also deliver a best-in-class APU, code named “Berlin.” “Berlin” is an x86 CPU and APU, based on a new generation of cores named “Steamroller.” Designed to double the performance of the recently available “Kyoto” part, “Berlin” will offer extraordinary compute-per-watt that will enable massive rack density. The third processor announced today is code named “Warsaw,” AMD’s next-generation 2P/4P offering. It is optimized to handle the heavily virtualized workloads found in enterprise environments including the more complex compute needs of data analytics, xSQL and traditional databases. “Warsaw” will provide significantly improved performance-per-watt over today’s AMD Opteron™ 6300 family.

Seattle
“Seattle” will be the industry’s only 64-bit ARM-based server SoC from a proven server processor supplier. “Seattle” is an 8- and then 16-core CPU based on the ARM Cortex-A57 core and is expected to run at or greater than 2 GHz. The “Seattle” processor is expected to offer 2-4X the performance of AMD’s recently announced AMD Opteron X-Series processor with significant improvement in compute-per-watt. It will deliver 128GB DRAM support, extensive offload engines for better power efficiency and reduced CPU loading, server caliber encryption, and compression and legacy networking including integrated 10GbE. It will be the first processor from AMD to integrate AMD’s advanced Freedom™ Fabric for dense compute systems directly onto the chip. AMD plans to sample “Seattle” in the first quarter of 2014 with production in the second half of the year.

Berlin
“Berlin” is an x86-based processor that will be available both as a CPU and APU. The processor boasts four next-generation “Steamroller” cores and will offer almost 8X the gigaflops per-watt compared to current AMD Opteron™ 6386SE processor. It will be the first server APU built on AMD’s revolutionary Heterogeneous System Architecture (HSA), which enables uniform memory access for the CPU and GPU and makes programming as easy as C++. “Berlin” will offer extraordinary compute per-watt that enables massive rack density. It is expected to be available in the first half of 2014.

Warsaw
“Warsaw” is an enterprise server CPU optimized to deliver unparalleled performance and total cost of ownership for two- and four-socket servers. Designed for enterprise workloads, it will offer improved performance-per-watt, which drives down the cost of owning a “Warsaw”-based server while enabling seamless migration from the AMD Opteron 6300 Series family. It is a fully compatible socket with identical software certifications, making it ideal for the AMD Open 3.0 Server – the industry’s most cost effective Open Compute platform. It is expected to be available in the first quarter of 2014.

AMD discloses its server plans for 2013-2014 - More news at DV Hardware

Intel 14nm Knights Landing to integrate Xeon Phi

The Inquirer reports Intel is developing a 14nm "Knights Landing" server processor that will integrate its Xeon Phi accelerator:

Intel has so far put its Xeon Phi accelerators onto daughter boards that run on the PCI-Express bus, however the firm told The INQUIRER last year that eventually the Many Integrated Core architecture behind the Xeon Phi will become a co-processor.

Now Intel has announced that it is working on a standalone chip that includes Xeon Phi cores, codenamed Knights Landing, which will be fabbed on its upcoming 14nm process node.

Intel didn't release any specifications for Knights Landing other than saying it will have on-package memory, a trend it started with its Iris Pro branded graphics in Haswell processors. Rajeeb Hazra, VP of Intel's Datacentre and Connected Systems Group said the goal is to eliminate the bottleneck posed by the PCI-Express bus.

Intel 14nm Knights Landing to integrate Xeon Phi - More news at DV Hardware

Intel reportedly delays 14nm Broadwell

DailyTech points out that newly leaked Intel roadmaps suggest that the chip giant has delayed its 14nm Broadwell processor in favor of a 22nm Haswell refresh in 2014 (and Haswell-E towards the end of the year).

Much has already been published about Ivy Bridge-E, but the VR-Zone piece deals with its architecture-refreshed successor, Haswell-E. The leaked slides seemingly confirm the timeline of the previous leak, indicating that Haswell-E chips won't be available until sometime late next year (H2 2014).

The leaked slides show the Haswell-E chips will (presumably) be Intel's first consumer octacore offering, packing a whopping sixteen threads. There will also be slightly cheaper hexacore (12-thread) variants. The cache will be bumped from 15 MB with Ivy Bridge-E to 20 MB in Haswell-E. Both releases will support up to four PCI-Express 3.0 graphics cards. But Haswell-E will add a neat trick, supporting the upcoming fourth generation double data rate memory, DDR4-2133. (Ivy Bridge-E bumps memory support to DDR3-1866.)

Intel reportedly delays 14nm Broadwell - More news at DV Hardware

Intel integrated graphics to get eDRAM

EE Times reports Intel revealed details of its new embedded DRAM technology at the VLSI Symposium. By embedding memory onto the processor, the chip giant expects to significantly improve the performance of its integrated graphics solutions for use in high-end notebooks and servers, while also lowering the total system power consumption:

Using its eDRAM technology, Intel built a discrete 128 Mbyte L4 cache chip with a 100 microsecond retention time at a worst case 95 degrees C. It will fit in a Haswell package linking to the CPU die via a 100 Gbyte/second point-to-point link, adding about 3W to the component.

The technology reaches “part of the design space you can’t hit with commodity DRAM,” such as GDDR-5 chips that would offer half the bandwidth and consume more power, said David Kanter, microprocessor analyst for Real World Tech.

OEMs including Apple are expected to use in their top-end notebooks the Haswell eDRAM module at about 45W to save space and power while sacrificing little performance. It will replace a combo of discrete graphics chips dissipating about 40W and existing processors drawing 30W.

Intel integrated graphics to get eDRAM - More news at DV Hardware